S2S3 Series VDRM : 600V, Non-zero cross type Mini-Flat Package Phototriac Coupler for triggering S2S3 Series Zero cross type is also available. (S2S4 Series) Description Agency approvals/Compliance S2S3 Series Phototriac Coupler include an infrared emitting diode (IRED) optically coupled to an output Phototriac. These devices feature full wave control and are ideal isolated drivers for medium to high current Triacs. SOP package provides 3.75kV isolation from input to output with superior commutative noise immunity. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. S2S3) 2. Approved by CSA, file No. CA95323 (as model No. S2S3) 3. Optionary available VDE Approved () (DIN EN 60747-5-2), file No. 40009162 (as model No. S2S3) 4. Package resin : UL flammability grade (94V-0) () DIN EN60747-5-2 : successor standard of DIN VDE0884. Up to Date code "RD" (December 2003), approval of DIN VDE0884. From Date code "S1" (January 2004), approval of DIN EN60747-5-2. () Reinforced insulation type is also available. (PC3SG11YIZ Series) Features 1. High repetitive peak off-state voltage (VDRM : 600V) 2. Non-zero crossing functionality 3. IFT ranks available (see Model Line-up section in this datasheet) 4. 4pin Mini-flat package 5. Superior noise immunity (dV/dt : MIN. 100V/s) 6. Lead-free components are also available (see Model Line-up section in this datasheet) 7. Double transfer mold construction (Ideal for Flow Soldering) 8. High isolation voltage between input and output (Viso(rms) : 3.75kV) Applications 1. Triggering for Triacs used to switch on and off devices which require AC Loads. For example heaters, fans, motors, solenoids, and valves. 2. Triggering for Triacs used for implementing phase control in applications such as lighting control and temperature control (HVAC). 3. AC line control in power supply applications. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A06501EN Date Mar. 31. 2004 (c) SHARP Corporation S2S3 Series Internal Connection Diagram 1 1 4 2 3 4 2 Anode Cathode Anode/Cathode Cathode/Anode 3 Outline Dimensions (Unit : mm) VDE option 3.60.3 3.60.3 2.540.25 2.540.25 4 3 SHARP mark "S" 4 Date code (2 digit) 3 SHARP mark "S" Date code (2 digit) Anode mark 4.40.2 Anode mark Model No. 2S3 4.40.2 Model No. 2S3 4 Factory identification mark Factory identification mark 0.40.1 1 2 0.40.1 1 5.30.3 Epoxy resin 45 2.60.2 0.20.05 45 0.20.05 0.5+0.4 -0.2 6 0.10.1 2.60.2 VDE identification mark 5.30.3 Epoxy resin 0.10.1 2 7.0+0.2 -0.7 Product mass : approx. 0.09g 0.5+0.4 -0.2 6 7.0+0.2 -0.7 Product mass : approx. 0.09g Sheet No.: D2-A06501EN 2 S2S3 Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ** * repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia Philippines China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark There is no rank mark indicator. Sheet No.: D2-A06501EN 3 S2S3 Series Parameter Symbol Rating Forward current IF 50 Input Reverse voltage VR 6 RMS ON-state current IT(rms) 0.05 Isurge 0.6 *3 Output Peak one cycle surge current Repetitive peak OFF-state voltage VDRM 600 *1 V (rms) 3.75 Isolation voltage iso Operating temperature Topr -30 to +100 Storage temperature Tstg -40 to +125 *2 Soldering temperature Tsol 260 (Ta=25C) Unit mA V A A V kV C C C 0.2mm or more Absolute Maximum Ratings Soldering area *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 f=50Hz sine wave Electro-optical Characteristics Input Output Transfer characteristics Parameter Forward voltage Reverse current Repentitive peak OFF-state current ON-state voltage Holding current Critical rate of rise of OFF-state voltage No rank Rank R Minimum trigger current Rank L Isolation resistance Turn-on time (Ta=25C) Symbol VF IR IDRM VT IH dV/dt Conditions IF=20mA VR=3V VD=VDRM IT=0.05A VD=6V - VD=1/2 *VDRM IFT VD=6V, RL=100 RISO ton DC500V,40 to 60%RH VD=6V, RL=100, IF=20mA MIN. TYP. - 1.2 - - - - - - - 0.1 100 1 000 - - - - - - 5x1010 1011 - - MAX. 1.4 10 1 2.5 3.5 - 10 7 5 - 100 Unit V A A V mA V/s mA s Sheet No.: D2-A06501EN 4 S2S3 Series Model Line-up (1) (Lead-free components) Shipping Package Sleeve 100pcs/sleeve IFT rank IFT[mA] (VD=6V, RL=100) S2S3000F S2S3Y00F S2S3A00F S2S3AY0F S2S3B00F S2S3BY0F No rank MAX.10 S2S3R00F S2S3RY0F S2S3RA0F S2S3RAYF S2S3RB0F S2S3RBYF Rank R MAX.7 S2S3L00F S2S3LY0F S2S3LA0F Rank L MAX.5 IFT rank IFT[mA] (VD=6V, RL=100) DIN EN60747-5-2 Model No. Taping 750pcs/reel 3 000pcs/reel Approved Approved Approved - S2S3LB0F - Model Line-up (2) (Lead solder plating components) Shipping Package Sleeve 100pcs/sleeve DIN EN60747-5-2 Model No. Taping S2S3Y S2S3R S2S3RY S2S3L S2S3LY Approved Approved Approved S2S3 750pcs/reel 3 000pcs/reel No rank MAX.10 S2S3RA S2S3RAY S2S3RB S2S3RBY Rank R MAX.7 S2S3LA Rank L MAX.5 S2S3A S2S3AY S2S3B S2S3LB - S2S3BY - Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A06501EN 5 S2S3 Series Fig.1 Forward Current vs. Ambient Temperature Fig.2 RMS ON-state Current vs. Ambient Temperature 60 RMS ON-state current IT (rms) (mA) 60 Forward current IF (mA) 50 40 30 20 10 0 -30 0 50 50 40 30 20 10 0 -30 100 0 Ambient temperature Ta (C) Fig.3-b Forward Current vs. Forward Voltage (Rank L) 100 100 Ta=100C 50 75C Forward current IF (mA) Forward current IF (mA) 100 Ambient temperature Ta (C) Fig.3-a Forward Current vs. Forward Voltage (No rank, Rank R) 25C 50C 0C -30C 10 5 0 0.5 1 1.5 2 2.5 50 Ta=75C 3 10 -25C 25C 5 1 1.1 1.2 1.3 1.4 1.5 Forward voltage VF (V) Forward voltage VF (V) Fig.4 Minimum Trigger Current vs. Ambient Temperature Fig.5 Relative Repetitive Peak OFF-state Voltage vs. Ambient Temperature 1.3 12 Relative repetitive peak OFF-state voltage VDRM (Tj=Ta) / VDRM (Tj=25C) VD=6V RL=100 10 8 No rank Rank R 6 4 Rank L 2 0 -40 0C 50C 1 0.9 1 Minimum trigger current IFT (mA) 50 -20 0 20 40 60 80 1.2 1.1 1 0.9 0.8 0.7 -40 100 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) Sheet No.: D2-A06501EN 6 S2S3 Series Fig.7 Holding Current vs. Ambient Temperature Fig.6 ON-state Voltage vs. Ambient Temperature 10 2 VD=6V IT=50mA Holding current IH (mA) ON-state voltage VT (V) 1.8 1.6 1.4 1.2 1 1 0.8 -40 -20 0 20 40 60 80 0.1 -40 100 Fig.8 Repetitive Peak OFF-state Current vs. OFF-state Voltage 60 80 100 VD=600V Relative repetitive peak OFF-state current IDRM (Tj=Ta) / IRM (Tj=25C) Repetitive peak OFF-state current IDRM (nA) 40 1 000 0.1 100 10 1 0.1 200 300 400 500 0 600 Fig.10-a Turn-on Time vs. Forward Current (No Rank, Rank R) 1 000 20 40 60 80 100 Ambient temperature Ta (C) OFF-state voltage VD (V) Fig.10-b Turn-on Time vs. Forward Current (Rank L) 1 000 VD=6V RL=100 Ta=25C Turn-on time tON (s) Turn-on time tON (s) 20 Fig.9 Relative Repetitive Peak OFF-state Current vs. Ambient Temperature Ta=25C 0.01 100 0 Ambient temperature Ta (C) Ambient temperature Ta (C) 1 -20 100 VD=6V RL=100 Ta=25C 100 10 10 1 10 1 100 10 100 Forward current IF (mA) Forward current IF (mA) Sheet No.: D2-A06501EN 7 S2S3 Series Fig.11 ON-state Current vs. ON-state Voltage 100 IF=20mA Ta=25C ON-state current IT (mA) 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ON-state voltage VT (V) Remarks : Please be aware that all data in the graph are just for reference. Sheet No.: D2-A06501EN 8 S2S3 Series Design Considerations Design guide In order for the Phototriac to turn off, the triggering current (IF), must be 0.1mA or less. Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are intended to be used as triggering device for main Triacs. Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in malfunctions. In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. For designs that will experience excessive noise or sudden changes in load voltage, please include an appropriate snubber circuit as shown in the below circuit. Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often eliminate the need for a snubber circuit. Degradation In general, the emission of the IRED used in Phototriac Couplers will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should provide at least twice the minimum required triggering current from initial operation. Recommended Foot Print (reference) 0.8 2.54 6.3 1.5 (Unit : mm) Sheet No.: D2-A06501EN 9 S2S3 Series Standard Circuit (Medium/High Power Triac Drive Circuit) S2S3 1 4 Load Triac 2 AC Line 3 Note) Please add the snubber circuit according to a condition. Any snubber or varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A06501EN 10 S2S3 Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A06501EN 11 S2S3 Series Cleaning instructions Solvent cleaning : Solvent temperature should be 45C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A06501EN 12 S2S3 Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 50 sleeves in one case. Sleeve outline dimensions 10.5 4.6 2 2.8 6.3 400 4.5 (Unit : mm) Sheet No.: D2-A06501EN 13 S2S3 Series Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J MAX . H H A B C I Dimensions List A B 0.3 12.0 5.50.1 H I 0.1 7.4 0.30.05 5 K C 1.750.1 J 3.10.1 D 8.00.1 K 4.00.1 E 2.00.1 F 4.00.1 (Unit : mm) G +0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 370 13.51.5 e f 211.0 2.00.5 f a b (Unit : mm) c d 801.0 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A06501EN 14 S2S3 Series 2. 750pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J 5 MAX . H H A B C I K Dimensions List A B 12.00.3 5.50.1 H I 0.1 7.4 0.30.05 C 1.750.1 J 3.10.1 D 8.00.1 K 4.00.1 E 2.00.1 (Unit : mm) F G +0.1 4.00.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 180 13.51.5 e f 211.0 2.00.5 f a b (Unit : mm) c d 801.0 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 750pcs/reel] Sheet No.: D2-A06501EN 15 S2S3 Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A06501EN 16