LM4875MM - National Semiconductor

LM4875

LM4875 BOOMER 750 mW Audio Power Amplifier with DC Volume Controland

Headphone Switch

Literature Number: SNAS042B

LM4875

750 mW Audio Power Amplifier with DC Volume Control

and Headphone Switch

General Description

The LM4875 is a mono bridged audio power amplifier with

DC voltage volume control. The LM4875 is capable of deliv-

ering 750mW of continuous average power into an 8Ωload

with less than 1% THD when powered by a 5V power supply.

Switching between bridged speaker mode and headphone

(single ended) mode is accomplished using the headphone

sense pin. To conserve power in portable applications, the

LM4875’s micropower shutdown mode (I

= 0.7µA, typ) is

activated when less than 300mV is applied to the DC Vol/SD

pin.

Boomer audio power amplifiers are designed specifically to

provide high power audio output while maintaining high fidel-

ity. They require few external components and operate on

low supply voltages.

Applications

nGSM phones and accessories, DECT, office phones

nHand held radio

nOther portable audio devices

Key Specifications

at 1.0% THD+N into 8Ω750mW (typ)

at 10% THD+N into 8Ω1W (typ)

jShutdown current 0.7µA(typ)

jSupply voltage range 2.7V to 5.5V

Features

nPrecision DC voltage volume control

nHeadphone amplifier mode

n“Click and pop” suppression

nShutdown control when volume control pin is low

nThermal shutdown protection

Typical Application Connection Diagram

Small Outline Package (SO)

Mini Small Outline Package (MSOP)

10104202

Top View

Order Number LM4875M, LM4875MM

See NS Package Number M08A, MUA08A

BOOMER™is a trademark of National Semiconductor Corporation.

10104201

FIGURE 1. Typical Audio Amplifier

Application Circuit

January 2002

LM4875 750 mW Audio Power Amplifier with DC Volume Control and Headphone Switch

Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65˚C to +150˚C

Input Voltage −0.3V to V

+0.3V

Power Dissipation (Note 3) Internally Limited

ESD Susceptibility (Note 4) 2000V

ESD Susceptibility (Note 5) 200V

Junction Temperature 150˚C

Soldering Information

Vapor Phase (60 sec.) 215˚C

Infrared (15 sec.) 220˚C

Thermal Resistanc

(SOP) 35˚C/W

(SOP) 150˚C/W

(MSOP) 56˚C/W

(MSOP) 190˚C/W

Operating Ratings

Temperature Range

MIN

≤T

MAX

−40˚C ≤T

≤+85˚C

Supply Voltage 2.7V ≤V

≤5.5V

See AN-450 “Surface Mounting and their Effects on Product

Reliability” for other methods of soldering surface mount

devices.

Electrical Characteristics (Notes 1, 2)

The following specifications apply for V

= 5V, unless otherwise specified. Limits apply for T

= 25˚C.

Symbol Parameter Conditions

LM4875

Min

(Note 7)

Typical

(Note 6)

Max

(Note 7) Units

Supply Voltage 2.7 5.5 V

Quiescent Power Supply

Current

= 0V, I

= 0A, HP Sense = 0V 4 7 mA

= 0V, I

- 0A, HP Sense = 5V 3.5 6 mA

Shutdown Current V

PIN4

≤0.3V 0.7 µA

Output Offset Voltage V

= 0V 5 50 mV

Output Power

THD = 1% (max), HP Sense <0.8V,

f = 1kHz, R

=8Ω500 750 mW

THD = 10% (max), HP Sense <0.8V,

f = 1kHz, R

=8Ω1.0 W

THD+N=1%,HPSense >4V,

f = 1kHz, R

=32Ω80 mW

THD = 10%, HP Sense >4V,

f = 1kHz, R

=32Ω110 mW

THD+N Total Harmonic Distortion +

Noise

= 300 mWrms, f = 20Hz–20kHz,

=8Ω0.6 %

PSRR Power Supply Rejection Ratio V

RIPPLE

= 200mVrms, R

=8Ω,C

1.0 µF, f = 1kHz 50 dB

Gain

RANGE

Single-Ended Gain Range Gain with V

PIN4

≥4.0V, (80% of V

) 18.8 20 dB

Gain with V

PIN4

≤0.9V, (20% of V

) −70 −72 dB

HP Sense High Input Voltage 4 V

HP Sense Low Input Voltage 0.8 V

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. “Operating Ratings” indicate conditions for which the device

is functional, but do not guarantee specific performance limits. “Electrical Characteristics” state DC and AC electrical specifications under particular test conditions

that guarantee specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not guaranteed for parameters

where no limit is given. The typical value, however, is a good indication of device performance.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX =(T

JMAX −T

A)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4875M, TJMAX =

150˚C.

Note 4: Human body model, 100pF discharged through a 1.5kΩresistor.

Note 5: Machine Model, 220pF–240pF discharged through all pins.

Note 6: Typicals are measured at 25˚C and represent the parametric norm.

Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 8: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.

LM4875

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External Components Description

(Figure 1)

Components Functional Description

1. C

Input coupling capacitor blocks DC voltage at the amplifier’s input terminals. It also creates a highpass filter

with the internal R

that produces an f

= 1/(2πR

) (10kΩ≤R

≤100kΩ). Refer to the Application

Information section, Selecting External Components, for an explanation of determining the value of C

2. C

The supply bypass capacitor. Refer to the Power Supply Bypassing section for information about properly

placing, and selecting the value of, this capacitor.

3. C

The capacitor, C

, filters the half-supply voltage present on the BYPASS pin. Refer to the Application

Information section, Selecting External Components, for information concerning proper placement and

selecting C

’s value.

Typical Performance Characteristics

THD+N vs Frequency THD+N vs Frequency

10104205 10104206

THD+N vs Output Power THD+N vs Output Power

10104207

10104208

LM4875

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Typical Performance Characteristics (Continued)

THD+N vs Output Power THD+N vs Output Power

10104210 10104211

Power Dissipation vs Load Resistance Power Dissipation vs Output Power

10104212 10104213

Power Derating Curve Clipping Voltage vs RL

10104214 10104215

LM4875

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Typical Performance Characteristics (Continued)

Noise Floor

Frequency Response vs

Input Capacitor Size

10104216

10104217

Power Supply

Rejection Ratio

Attenuation Level vs

DC-Vol Amplitude

10104218 10104219

THD+N vs Frequency THD+N vs Frequency

10104220 10104221

LM4875

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Typical Performance Characteristics (Continued)

THD+N vs Frequency THD+N vs Output Power

10104222

10104223

THD+N vs Output Power THD+N vs Output Power

10104224 10104228

Output Power vs Load Resistance Clipping Voltage vs Supply Voltage

10104229 10104230

LM4875

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Typical Performance Characteristics (Continued)

Output Power vs Supply Voltage Output Power vs Supply Voltage

10104231 10104232

Supply Current vs Supply Voltage

10104233

Application Information

BRIDGE CONFIGURATION EXPLANATION

As shown in Figure 1, the LM4875 consists of two opera-

tional amplifiers internally. An external DC voltage sets the

closed-loop gain of the first amplifier, whereas two internal

20kΩresistors set the second amplifier’s gain at -1. The

LM4875 can be used to drive a speaker connected between

the two amplifier outputs or a monaural headphone con-

nected between V

1 and GND.

Figure 1 shows that the output of Amp1 serves as the input

to Amp2. This results in both amplifiers producing signals

that are identical in magnitude, but 180˚ out of phase.

Taking advantage of this phase difference, a load placed

between V

1 and V

2 is driven differentially (commonly

referred to as “bridge mode“ ). This mode is different from

single-ended driven loads that are connected between a

single amplifier’s output and ground.

Bridge mode has a distinct advantage over the single-ended

configuration: its differential drive to the load doubles the

output swing for a specified supply voltage. This results in

four times the output power when compared to a single-

ended amplifier under the same conditions. This increase in

attainable output assumes that the amplifier is not current

limited or the output signal is not clipped. To ensure mini-

mum output signal clipping when choosing an amplifier’s

closed-loop gain, refer to the Audio Power Amplifier De-

sign section.

Another advantage of the differential bridge output is no net

DC voltage across load. This results from biasing V

1 and

2 at half-supply. This eliminates the coupling capacitor

that single supply, single-ended amplifiers require. Eliminat-

ing an output coupling capacitor in a single-ended configu-

ration forces a single supply amplifier’s half-supply bias volt-

age across the load. The current flow created by the half-

supply bias voltage increases internal IC power dissipation

and may permanently damage loads such as speakers.

POWER DISSIPATION

Power dissipation is a major concern when designing a

successful bridged or single-ended amplifier. Equation (1)

states the maximum power dissipation point for a single-

ended amplifier operating at a given supply voltage and

driving a specified output load.

DMAX

=(V

)

/(2π

) Single-Ended (1)

However, a direct consequence of the increased power de-

livered to the load by a bridge amplifier is an increase in

internal power dissipation point for a bridge amplifier oper-

ating at the same given conditions.

DMAX

= 4*(V

)

/(2π

) Bridge Mode (2)

The LM4875 has two operational amplifiers in one package

and the maximum internal power dissipation is 4 times that

LM4875

www.national.com7

Application Information (Continued)

of a single-ended amplifier. However, even with this substan-

tial increase in power dissipation, the LM4875 does not

require heatsinking. From Equation (2), assuming a 5V

power supply and an 8Ωload, the maximum power dissipa-

tion point is 633 mW. The maximum power dissipation point

obtained from Equation (2) must not be greater than the

power dissipation that results from Equation (3):

DMAX

=(T

JMAX

–T

)/θ

(3)

For the SO package, θ

= 150˚C/W. The MSOP package

has a 190˚C/W θ

JMAX

= 150˚C for the LM4875. For a

given ambient temperature T

, Equation (3) can be used to

find the maximum internal power dissipation supported by

the IC packaging. If the result of Equation (2) is greater than

that of Equation (3), then either decrease the supply voltage,

increase the load impedance, or reduce the ambient tem-

perature. For a typical application using the SO packaged

LM4875, a 5V power supply, and an 8Ωload, the maximum

ambient temperature that does not violate the maximum

junction temperature is approximately 55˚C. The maximum

ambient temperature for the MSOP package with the same

conditions is approximately 30˚C. These results further as-

sume that a device is a surface mount part operating around

the maximum power dissipation point. Since internal power

dissipation is a function of output power, higher ambient

temperatures are allowed as output power decreases. Refer

to the Typical Performance Characteristics curves for

power dissipation information at lower output power levels.

POWER SUPPLY BYPASSING

As with any power amplifier, proper supply bypassing is

critical for low noise performance and high power supply

rejection. The capacitors connected to the bypass and power

supply pins should be placed as close to the LM4875 as

possible. The capacitor connected between the bypass pin

and ground improves the internal bias voltage’s stability,

producing improved PSRR. The improvements to PSRR

increase as the bypass pin capacitor value increases. Typi-

cal applications employ a 5V regulator with 10µF and a

0.1µF filter capacitors that aid in supply stability. Their pres-

ence, however does not eliminate the need for bypassing the

supply nodes of the LM4875. The selection of bypass ca-

pacitor values, especially C

, depends on desired PSRR

requirements, click and pop performance (as explained in

the section, Proper Selection of External Components),

system cost, and size constraints.

DC VOLTAGE VOLUME CONTROL

The LM4875’s internal volume control is controlled by the DC

voltage applied its DC Vol/SD pin (pin 4). The volume con-

trol’s input range is from GND to V

. A graph showing a

typical volume response versus input control voltage is

shown in the Typical Performance Characteristicssection.

The DC Vol/SD pin also functions as the control pin for the

LM4875’s micropower shutdown feature. See the Mute and

Shutdown Function section for more information.

Like all volume controls, the Lm4875’s internal volume con-

trol is set while listening to an amplified signal that is applied

to an external speaker. The actual voltage applied to the DC

Vol/SD pin is a result of the volume a listener desires. As

such, the volume control is designed for use in a feedback

system that includes human ears and preferences. This

feedback system operates quite well without the need for

accurate gain. The user simply sets the volume to the de-

sired level as determined by their ear, without regard to the

actual DC voltage that produces the volume. Therefore, the

accuracy of the volume control is not critical, as long as

volume changes monotonically and step size is small

enough to reach a desired volume that is not too loud or too

soft. Since gain accuracy is not critical, there may be a

volume variation from part-to-part even with the same ap-

plied DC control voltage. The gain of a given LM4875 can be

set with a fixed external voltage, but another LM4875 may

require a different control voltage to achieve the same gain.

Figure 2 is a curve showing the volume variation of seven

typical LM4875s as the voltage applied to the DC Vol/SD pin

is varied. For gains between -20dB and +16dB, the typical

part-to-part variation is typically ±1dB for a given control

voltage.

MUTE AND SHUTDOWN FUNCTION

The LM4875’s mute and shutdown functions are controlled

through the DC Vol/SD pin. Mute is activated by applying a

voltage in the range of 500mV to 1V. A typical attenuation of

75dB is achieved is while mute is active. The LM4875’s

micropower shutdown mode turns off the amplifier’s bias

circuitry. The micropower shutdown mode is activated by

applying less than 300mV

to the DC Vol/SD pin. When

shutdown is active, they supply current is reduced to 0.7µA

(typ). A degree of uncertainty exists when the voltage applied

to the DC Vol/SD pin is in the range of 300mV to 500mV. The

LM4875 can be in mute, still fully powered, or in micropower

shutdown and fully muted. In mute mode, the LM4875 draws

the typical quiescent supply current. The DC Vol/SD pin

should be tied to GND for best shutdown mode performance.

As the DC Vol/SD is increased above 0.5V the amplifier will

follow the attenuation curve in Typical Performance Char-

acteristics.

HP-Sense FUNCTION

Applying a voltage between 4V and V

to the LM4875’s

HP-Sense headphone control pin turns off Amp2 and mutes

a bridged-connected load. Quiescent current consumption is

reduced when the IC is in this single-ended mode.

Figure 3 shows the implementation of the LM4875’s head-

phone control function. With no headphones connected to

the headphone jack, the R1-R2 voltage divider sets the

voltage applied to the HP-Sense pin (pin 3) at approximately

50mV. This 50mV enables the LM4875 and places it in

bridged mode operation.

10104248

FIGURE 2. Typical part-to-part gain variation as a

function of DC-Vol control voltage

LM4875

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Application Information (Continued)

While the LM4875 operates in bridged mode, the DC poten-

tial across the load is essentially 0V. Since the HP-Sense

threshold is set at 4V, even in an ideal situation, the output

swing cannot cause a false single-ended trigger. Connecting

headphones to the headphone jack disconnects the head-

phone jack contact pin from V

1 and allows R1 to pull the

HP Sense pin up to V

. This enables the headphone func-

tion, turns off Amp2, and mutes the bridged speaker. The

amplifier then drives the headphones, whose impedance is

in parallel with resistor R2. Resistor R2 has negligible effect

on output drive capability since the typical impedance of

headphones is 32Ω. The output coupling capacitor blocks

the amplifier’s half supply DC voltage, protecting the head-

phones.

A microprocessor or a switch can replace the headphone

jack contact pin. When a microprocessor or switch applies a

voltage greater than 4V to the HP Sense pin, a bridge-

connected speaker is muted and Amp1 drives the head-

phones.

SELECTING EXTERNAL COMPONENTS

Optimizing the LM4875’s performance requires properly se-

lecting external components. Though the LM4875 operates

well when using external components having wide toler-

ances, the best performance is achieved by optimizing com-

ponent values.

Input Capacitor Value Selection

Amplification of the lowest audio frequencies requires high

value input coupling capacitors. These high value capacitors

can be expensive and may compromise space efficiency in

portable designs. In many cases, however, the speakers

used in portable systems, whether internal or external, have

little ability to reproduce signals below 150Hz. In application

5 using speakers with this limited frequency response, a

large input capacitor will offer little improvement in system

performance.

Figure 1 shows that the nominal input impedance (R

)is

10kΩat maximum volume and 110kΩat minimum volume.

Together, the input capacitor, C

, and R

, produce a -3dB

high pass filter cutoff frequency that is found using Equation

(4).

(4)

As the volume changes from minimum to maximum, R

decrease from 110kΩto 10kΩ. Equation (4) reveals that the

-3dB frequency will increase as the volume increases. The

nominal value of C

for lowest desired frequency response

should be calculated with R

= 10kΩ. As an example when

using a speaker with a low frequency limit of 150Hz, C

using Equation (4) is 0.1µF. The 0.22µF C

shown in Figure 1

is optimized for a speaker whose response extends down to

75Hz.

Bypass Capacitor Value Selection

Besides minimizing the input capacitor size, careful consid-

eration should be paid to value of the bypass capacitor C

Since C

determines how fast the LM4875 turns on, its value

is the most critical when minimizing turn-on pops. The slower

the LM4875’s outputs ramp to their quiescent DC voltage

(nominally V

/2), the smaller the turn-on pop. Choosing C

equal to 1.0µF, along with a small value of C

(in the range of

0.1µF to 0.39µF), produces a clickless and popless shut-

down function. Choosing C

as small as possible helps mini-

mize clicks and pops.

CLICK AND POP CIRCUITRY

The LM4875 contains circuitry that minimizes turn-on and

shutdown transients or "clicks and pops". For this discus-

sion, turn-on refers to either applying the power supply volt-

age or when the shutdown mode is deactivated. While the

power supply is ramping to its final value, the LM4875’s

internal amplifiers are configured as unity gain buffers. An

internal current source changes the voltage of the bypass

pin in a controlled, linear manner. Ideally, the input and

outputs track the voltage applied to the bypass pin. The gain

of the internal amplifiers remains unity until the voltage on

the bypass pin reaches 1/2 V

. As soon as the voltage on

the bypass pin is stable, the device becomes fully opera-

tional and the gain is set by the external voltage applied to

the DC Vol/SD pin.

Although the bypass pin current cannot be modified, chang-

ing the size of C

alters the device’s turn-on time and the

magnitude of "clicks and pops". Increasing the value of C

reduces the magnitude of turn-on pops. However, this pre-

sents a tradeoff: as the size of C

increases, the turn-on time

increases. There is a linear relationship between the size of

CB and the turn-on time. Shown below are some typical

turn-on times for various values of C

0.01µF 3ms

0.1µF 30ms

0.22µF 65ms

0.47µF 135ms

1.0µF 280ms

In order eliminate "clicks and pops", all capacitors must be

discharged before turn-on. Rapidly switching V

may not

allow the capacitors to fully discharge, which may cause

"clicks and pops". In a single-ended configuration, the output

coupling capacitor, C

OUT

, is of particular concern. This ca-

pacitor discharges through an internal 20kΩresistor. De-

pending on the size of C

OUT

, the time constant can be

relatively large. To reduce transients in single-ended mode,

10104234

FIGURE 3. Headphone Circuit

LM4875

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Application Information (Continued)

an external 1kΩ-5kΩresistor can be placed in parallel with

the internal 20kΩresistor. The tradeoff for using this resistor

is increased quiescent current.

RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT

Figure 4 through Figure 6 show the recommended two-layer

PC board layout that is optimized for the SO-8 packaged

LM4875 and associated external components. Figure 7

through Figure 9 show the recommended two-layer PC

board layout for the MSOP packaged LM4875. Both layouts

are designed for use with an external 5V supply, 8Ωspeak-

ers, and 8Ω-32Ωheadphones. The schematic for both

recommended PC board layouts is Figure 1.

Both circuit boards are easy to use. Apply a 5V supply

voltage and ground to the board’s V

and GND pads,

respectively. Connect a speaker with an 8Ωminimum imped-

ance between the board’s -OUT and +OUT pads. For head-

phone use, the layout has provisions for a headphone jack,

J1. When a jack is connected as shown, inserting a head-

phone plug automatically switches off the external speaker.

10104238

FIGURE 4. Recommended SO PC board layout:

component side silkscreen

10104239

FIGURE 5. Recommended SO PC board layout:

component side layout

10104240

FIGURE 6. Recommended SO PC board layout:

bottom side layout

LM4875

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Application Information (Continued)

10104241

FIGURE 7. Recommended MSOP PC board layout:

component side silkscreen

10104242

FIGURE 8. Recommended MSOP PC board layout:

component side layout

10104245

FIGURE 9. Recommended MSOP PC board layout:

bottom side layout

LM4875

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Physical Dimensions inches (millimeters) unless otherwise noted

Order Number LM4875M

NS Package Number M08A

8-Lead (0.118" Wide) Molded Mini Small Outline Package

Order Number LM4875MM

NS Package Number MUAO8A

LM4875

www.national.com 12

Notes

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves

the right at any time without notice to change said circuitry and specifications.

For the most current product information visit us at www.national.com.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS

WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body, or

(b) support or sustain life, and whose failure to perform when

properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to result

in a significant injury to the user.

2. A critical component is any component of a life support

device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or

system, or to affect its safety or effectiveness.

BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship

Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned

Substances’’ as defined in CSP-9-111S2.

National Semiconductor

Americas Customer

Support Center

Email: new.feedback@nsc.com

Tel: 1-800-272-9959

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Fax: +49 (0) 180-530 85 86

Email: europe.support@nsc.com

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www.national.com

LM4875 750 mW Audio Power Amplifier with DC Volume Control and Headphone Switch

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DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

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