BU2006 thru BU2010
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Revision: 11-Jun-12 1Document Number: 84804
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Enhanced isoCink+™ Bridge Rectifiers
* Tested to UL standard for safety electrically isolated
semiconductor devices. UL 1557 4th edition.
Dielectric tested to maximum case, storage and junction
temperature to 150 °C to withstand 1500 V.
Epoxy meets UL 94 V-0 flammability rating.
FEATURES
UL recognition file number E309391 (QQQX2)
UL 1557 (see *)
Thin single in-line package
Available for BU-5S lead forming option
(part number with “5S” suffix, e.g. BU20065S)
Superior thermal conductivity
Solder dip 275 °C max. 10 s, per JESD 22-B106
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
General purpose use in AC/DC bridge full wave rectification
for switching power supply, home appliances and
white-goods applications.
MECHANICAL DATA
Case: BU
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class 1A
whisker test
Polarity: As marked on body
Mounting Torque: 10 cm-kg (8.8 inches-lbs) max.
Recommended Torque: 5.7 cm-kg (5 inches-lbs)
Notes
(1) With 60 W air cooled heatsink
(2) Without heatsink, free air
PRIMARY CHARACTERISTICS
IF(AV) 20 A
VRRM 600 V, 800 V, 1000 V
IFSM 240 A
IR5 μA
VF at IF = 10 A 0.85 V
TJ max. 150 °C
+~~-
-~~+
Case Style BU
+~~ -
isoCink+™
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL BU2006 BU2008 BU2010 UNIT
Maximum repetitive peak reverse voltage VRRM 600 800 1000 V
Average rectified forward current (Fig. 1, 2) TC = 61 °C (1)
IO
20 A
TA = 25 °C (2) 3.5
Non-repetitive peak forward surge current
8.3 ms single sine-wave, TJ = 25 °C IFSM 240 A
Rating for fusing (t < 8.3 ms) TJ = 25 °C I2t 239 A2s
Operating junction and storage temperature range TJ, TSTG - 55 to + 150 °C
BU2006 thru BU2010
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Revision: 11-Jun-12 2Document Number: 84804
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
Notes
(1) With 60 W air cooled heatsink
(2) Without heatsink, free air
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise specified)
Fig. 1 - Derating Curve Output Rectified Current Fig. 2 - Forward Current Derating Curve
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT
Maximum instantaneous forward
voltage per diode (1) IF = 10 A TA = 25 °C VF 0.95 1.05 V
TA = 125 °C 0.85 0.95
Maximum reverse current per diode rated VR
TA = 25 °C IR -5.0
μA
TA = 125 °C 110 350
Typical junction capacitance per diode 4.0 V, 1 MHz CJ 95 - pF
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL BU2006 BU2008 BU2010 UNIT
Typical thermal resistance RJC (1) 2.4 °C/W
RJA (2) 20
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
BU2006-E3/45 4.76 45 20 Tube
BU2006-E3/51 4.76 51 250 Paper tray
BU20065S-E3/45 4.76 45 20 Tube
050 100 150
0
4
12
16
20
24
Case Temperature (°C)
Average Forward Output Current (A)
8
25 75 125
With Heatsink
Sine-Wave, R-Load
T
C
Measured at Device Bottom
T
C
T
C
0
1
2
3
5
Ambient Temperature (°C)
Average Forward Rectified Current (A)
050
25 75 100 125 150
4
Without Heatsink
Sine-Wave, R-Load
Free Air, TA
BU2006 thru BU2010
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Revision: 11-Jun-12 3Document Number: 84804
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Fig. 3 - Forward Power Dissipation
Fig. 4 - Typical Forward Characteristics Per Diode
Fig. 5 - Typical Reverse Characteristics Per Diode
Fig. 6 - Typical Junction Capacitance Per Diode
0 4 8 12162024
0
10
20
30
40
50
Average Forward Current (A)
Forward Power Dissipation (W)
0.3 1.1
0.01
10
0.1
1
100
0.5 0.7 0.9
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1.00.4 0.6 0.8
1000
2010 604030 50 70 90 10080
0.1
1
10
100
Percent of Rated Peak Reverse Volta
g
e (%)
Instantaneous Reverse Current (µA)
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
0.1 110 100
10
1000
Reverse Voltage (V)
Junction Capacitance (pF)
100
BU2006 thru BU2010
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Revision: 11-Jun-12 4Document Number: 84804
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
+-
~~
Case Type BU
0.880 (22.3)
0.860 (21.8)
0.160 (4.1)
0.140 (3.5)
0.075
(1.9) R
0.125 (3.2) x 45°
Chamfer
0.080 (2.03)
0.060 (1.52)
0.050 (1.27)
0.040 (1.02)
0.190 (4.83)
0.210 (5.33)
0.080 (2.03)
0.065 (1.65)
0.100 (2.54)
0.085 (2.16)
0.085 (2.16)
0.065 (1.65)
0.310 (7.9)
0.290 (7.4)
0.020R (TYP.)
Polarity shown on front side of case, positive lead beveled corner
0.64 (16.28) REF.
0.62 (15.78) REF.
0.055 (1.385) REF.
R 0.10
(2.60) REF.
R 0.11
(2.78) REF.
0.094 (2.39) x 45° REF.
0.055 (1.385) REF.
0.161 (4.10)
0.142 (3.60)
0.710 (18.0)
0.690 (17.5)
0.028 (0.72)
0.020 (0.52)
0.740 (18.8)
0.720 (18.3)
View A
0.048 (1.23)
0.039 (1.00)
TYP.
TYP.
BU2006 thru BU2010
www.vishay.com Vishay Semiconductors
Revision: 11-Jun-12 5Document Number: 84804
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FORMING SPECIFICATION: BU-5S in inches (millimeters)
APPLICATION NOTE
(1) Device UL approved for safety use dielectric strength of 1500 V.
(2) If device is mounted in Floating Ground (F. G.) application, insulator is recommended to use to meet safety requirement.
(3) Heat sink shape recommendation:
0.085 (2.16)
0.065 (1.65)
0.310 (7.9)
0.290 (7.4)
0.020R (TYP.)
0.100 (2.54)
0.085 (2.16)
0.160 (4.1)
0.140 (3.5)
0.880 (22.3)
0.860 (21.8)
0.125 (3.2) x 45°
Chamfer
0.075
(1.9) R
+-
~~
0.080 (2.03)
0.060 (1.52)
0.050 (1.27)
0.040 (1.02)
0.213 (5.40)
0.173 (4.40)
0.417 (10.60)
0.370 (9.40) 0.080 (2.03)
0.065 (1.65)
0.319 (8.10)
0.272 (6.90)
0.319 (8.10)
0.272 (6.90)
0.315 (8.0)
0.276 (7.0)
0.028 (0.72)
0.020 (0.52)
0.219 (5.55)
MAX.
0.161 (4.10)
0.142 (3.60)
0.740 (18.8)
0.720 (18.3)
TYP.
TYP.
0.134 (3.40)
0.087 (2.20)
2.5 mm MIN. 2.5 mm MIN.
By Safety Requirements
Heatsink
(3)
Legal Disclaimer Notice
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Revision: 12-Mar-12 1Document Number: 91000
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