Product Specification 108-78466 01OCT2007 Rev. A1 MICRO SLP Wire to Board Connector 2Pos, 0.8mm Pitch 1. 1.1 Wire to Board Connector 2pos,0.8mm Pitch 2. 2.1 AMP A. B. C. 109-5000 : 114-5426 : 501-5840 : 2. 2 A. MIL-STD-202 : 1. Scope: 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of Wire to Board Connector 2pos, 0.8mm Pitch. Applicable product description and part numbers are as shown in Appendix 1. 2. Applicable Documents: The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 AMP Specifications: A. 109-5000 : Test Specification, General Requirements for Test Methods B. 114-5426 : Application Specification, C. 501-5840 : Test Report 2.2 Commercial Standards and Specifications: A. MIL-STD-202 :Test Methods for Electronic and Electrical Component Parts. 213-8535 3-5-8 Tyco Electronics AMP K.K. (3-5-8 Hisamoto Takatsu-ku Kawasaki, 213-8535) (c) Copyright 2007 Tyco Electronics AMP K.K. All international rights reserved. * : Trademark 1 of 10 Product Specification 3. 108-78466 3. Requirements 3.1 Design and Construction Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 3.2 Materials: : , Contact : Copper Alloy, Nickel under PL, : Connecting Area: Gold PL finish. : Housing: (UL94V-0) Thermo Plastic (UL94V-0) 3.1. 3.3 Ratings : A. Rate Voltage: 30V (ACDC) B. Current Rating: 0.5A B. : 0.5A C. Operating Temperature Rating: C. : 25 85 25 85 High Limit temperature includes Raised Temperature by Operation. 3.3 A. : 30V (ACDC) 3.4 Fig. 1 Rev. A1 3.4 Performance Requirements and Test Descriptions; The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig. 1. All tests shall be performed in the room temperature, unless otherwise specified. 2 of 10 Product Specification 108-78466 3.5 3.5 Test Requirements and Procedures Summary Para. Test Items 3.5.1 Examination of Product Fig. 1 Requirements Meets requirements of product drawing. Procedures Visual inspection No physical damage Electrical Requirements () 30m() 50m() Contact Resistance (Low Level) 30 m Max. (Initial) 50 m Max. (Final) 100 M Insulation Resistance 100 MMin. 3.5.2 3.5.3 3.5.4 Dielectric withstanding Voltage No creeping discharge or flashover shall occur. . 30 Current Capacity Based upon 30Max. rise above ambient temperature 3.5.5 Fig. 1 () Wire-Board 20mV100mA AMP Spec. 109-5311-1 Subject mated Wire-Board connector to 20 mV Max open circuit at 100mA. AMP Spec. 109-5311-1 250 V DC 1 AMP 109-5302 Impressed voltage 250 V DC. for 1 minute. Test between adjacent circuits of unmated connectors. AMP Spec. 109-5302 250 V AC 1 AMP 109-5301 250 V AC for 1 minute. Test between adjacent circuits of unmated connectors. AMP Spec. 109-5301 AMP 109-5310 Measure temperature rising by energized current. AMP Spec. 109-5310 Fig. 1 (CONT.) Rev. A1 3 of 10 Product Specification Para. Test Items 3.5.6 Durability ( ) 3.5.7 Connector Insertion/Extraction Force (with Housing Lock) Requirements Requirements Mechanical Requirements 50m After test, contact resistance should be 50mMAX. and crack or breakage should not be occurred. 20N MAX 20N MAX Insertion Force 1.0N MIN 0.8N MIN Retention Force Initial 20N MAX After 20N MAX mate/un-ma te 10 times : 0.5N MIN -0. 10: 0.5N MIN. 1.0N MIN 0.8N MIN -0. 10 3.5.8 Connector Extraction Force (without Housing Lock) Initial: 0.5N MIN After mate/un-mate 10times: 0.5N MIN. 108-78466 Procedures 10 Mate and Un-mate the connector for a total of 10 cycles : 25mm/min , Fig.3 Measure extraction force of Wire contact to required to mate/un-mate vertical direction. Extract at speed of 25mm/min. See Fig.3. : 25mm/min 10 Extract at speed of 25mm/min. Measure extraction force required to mate connector without housing Lock. (Fig.4) : 6N : 1.2N Cable should not fail out. Extend cable to (See Fig.4) Coaxial direction: 6N Vertical direction: 1.2N 3.5.9 Cable Retention Force Fig. 1 () Fig. 1 (CONT.) Rev. A1 4 of 10 Product Specification Para. Test Items 3.5.10 Vibration 3.5.11 Physical Shock Requirements 1 sec. 50m() No electrical discontinuity greater than 1sec. shall occur. Contact resistance 50 m Max. (Final) 1sec. 50m (after test) No electrical discontinuity greater than 1sec. shall occur. Contact resistance 100 mMax. (after test) No physical damage allowed. 108-78466 Procedures : 105010Hz, 15/1 : 1.52mm MAX XYZ3 2hrs Subject mated connectors Vibration Frequency: 105010Hz, 15min./1cycle Amplitude: 1.52 mm MAX Test time: 2 hours each of 3 mutually perpendicular planes. : 490m/s2 (50G) : : 11 m sec. : X, Y, Z3 18 AMP 109-5208 A Accelerated Velocity: 490m/s2 (50G) Waveform: Half Sinusoidal Wave Duration: 11m sec. Number of Drops: 3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops. AMP Spec. 109-5208 Condition A Fig. 1 () Fig. 1 (CONT.) Rev. A1 5 of 10 Product Specification Para. Test Items Requirements Environmental Requirements :50m 3.5.12 Contact Resistance: 50m Max. High Temperature () :50m :100M : 108-78466 Procedures 85, 250 AMP 109-5108 Expose Mated connector, 85, 250hrs AMP Spec. 109-5108 9095 % R. H , 40 240 AMP 109-5105 3.5.13 Humidity, Steady State (MIL) 3.5.14 Humidity, Temperature Cycling (MIL Standard) 3.5.15 Thermal Shock Contact Resistance: 50m Max. Insulation Resistance: 100M MIN. , Dielectric withstanding Voltage: No Physical Damage allowed. : 50m :100M : Contact Resistance: 50m Max. Insulation Resistance: 100M MIN. , Dielectric withstanding Voltage: No Physical Damage allowed. : 50m :100M : Contact Resistance: 50m Max. Insulation Resistance: 100M MIN. , Dielectric withstanding Voltage: No Physical Damage allowed. Fig. 1 () Expose Mated connector,, 9095 %RH, 40, 240hours AMP Spec.109-5105 2565,9095%RH 24 1 10 Fig.5 Expose Mated connector; 2565, 95%RH, 24 hours per cycle, repeat 10 cycles. See Fig.5 55 / 30 85 / 30 125 AMP 109-5103 Expose Mated connector, 55/30min 85/30min. Making this one cycle, repeat 25 cycles. AMP Spec. 109-5103 Fig. 1 (CONT.) Rev. A1 6 of 10 Product Specification Para. Test Items 3.5.16 Resistance to Cold 3.5.17 Salt spray 3.5.18 (H2S) Gas (H2S) Requirements :50m 108-78466 Procedures -25C, 48 1 AMP 109-5108 Contact Resistance: 50m Max. Expose Mated connector, -25C, 48hrs, then 1hrs Room condition; AMP Spec. 109-5108 51355 48 :50m AMP109-5101 (MIL STD 202 TEST 101-B) Conc.51355 48hours No corrosion which damages function of connector allowed. Unmated connector leaves in the Contact Resistance: 50m Max. alt spray. AMP Spec. 109-5101 (MIL STD 202 TEST 101-B) 3ppm H2S, 40, 80% RH, 96hrs :50m No corrosion which damages function of connector allowed. Contact Resistance: 50m Max. Expose Mated connector, 3ppm H2S, 40, 80% RH, 96hrs : 245 5C : 3 1 AMP 109-5203 No Physical damage allowed. Solder Temperature : 245 5 C Immersion Duration : 3 1 seconds AMP Spec. 109-5203 40010 3 Function as specified electrical Soldering iron temperature and mechanical requirements 40010 after test. 3sec.Max No physical damage allowed. Fig.6 3.5.19 Solder ability 3.5.20 Resistance to Soldering Heat 3.5.21 Resistance to reflow Heat Function as specified electrical and mechanical requirements after test. No physical damage allowed. Temperature profile See Fig.6 Fig. 1 () Fig. 1 (End) Rev. A1 7 of 10 Product Specification 108-78466 4. 4. Product Qualification Test Sequence Test Examination () HSG HSG () H2S Examination of Product Contact Resistance (Low Level) Insulation Resistance Dielectric withstanding Voltage Current Capacity Durability Connector Insertion/Retention Force(with HSG lock) Contact Pulling Force (without HSG lock) Cable Retention Force Vibration Physical Shock Heat Temperature Humidity (Steady State) Fig. 2 1 2 3 4 5 /Test Group 6 7 8 9 10 11 12 13 14 15 16 17 /Test Sequence (a) 1 1,4 1 1,6 1,5 1 1,5 1,4 1,4 1,4 1,4 1,4 1,4 1,4 1,3 1,3 1,3 2 2,7 2,6 2,5 2,5 2,5 2,5 2,5 2,5 2,5 2 3 7 2 6 8 4 6 7 7 3 3,5 2,4 2 3 4 3 3 Humidity Temperature Cycling (MIL STD) Thermal Shock Resistance to Cold Solt Splay H2S Gas Solder ability Resistance to Soldering Heat Resistance to reflow Heat 3 3 3 3 3 2 2 2 (a) /Numbers indicate sequence in which the tests are performed. 1 The applicable product descriptions and part numbers are as shown in Appendix. 1. Product Part No. X-1981812-X 1981813-1 Rev. A1 Product Name MICRO SLP 2pos, 0.8mm Pitch Wire Connector MICRO SLP 2pos, 0.8mm Pitch Board Connector 1 Appendix 1 8 of 10 Product Specification 108-78466 (/ Insertion/Retention Direction (With / without housing lock) Fig.3 Fig.3 Connector Insertion/Retention Force :1.2N Vertical direction: 1.2N :6N Coaxial Direction: 6N Fig.4 Fig.4 Cable Retention Force Rev. A1 9 of 10 Product Specification 108-78466 Fig.5 Fig.5 Humidity, Temperature Cycling Condition for Solder Reflow Peak;260 (1sec Min) Temperature [] 260 240 225 220 200 225 170 180 160 140 120 170 Min 170 Min (100sec Min) (100sec Min) 100 80 225 Min 225 Min (60sec (70sec Min) Min) 60 40 20 0 0 Time [Sec] 200 Fig.6 Reflow Profile Rev. A1 10 of 10