WP7113SF4BT-P22 - KINGBRIGHT CORPORATION

DESCRIPTION

zSF4 Made with Gallium Aluminum Arsenide Infrared

Emitting diodes

FEATURES

zMechanically and spectrally matched to the

Phototransistor

zBlue transparent lens

zRoHS compliant

APPLICATIONS

zInfrared Illumination for cameras

zMachine vision systems

zSurveillance systems

zIndustrial electronics

zIR data transmission

zRemote control

PACKAGE DIMENSIONS

WP7113SF4BT-P22

T-1 3/4 (5mm) Infrared Emitting Diode

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Lead spacing is measured where the leads emerge from the package.

4. The specifications, characteristics and technical data described in the datasheet are subject to change

without prior notice.

SELECTION GUIDE

Part Number Emitting Color

(Material) Lens Type

Po (mW/sr) @ 20mA [2] Po (mW/sr) @ 50mA [2] Viewing Angle [1]

Min. Typ. Min. Typ. 2θ1/2

WP7113SF4BT-P22 Infrared (GaAlAs) Blue Transparent 6 15 12 25 20°

Notes:

1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.

2. Radiant Intensity / luminous flux: +/-15%.

3. Radiant intensity value is traceable to CIE127-2007 standards.

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ABSOLUTE MAXIMUM RATINGS at TA=25°C

ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

WP7113SF4BT-P22

Parameter Symbol Emitting Color

Value

Unit

Typ. Max.

Wavelength at Peak Emission IF = 20mA λpeak Infrared 880 - nm

Spectral Bandwidth at 50% Φ REL MAX

IF = 20mA Δλ Infrared 50 - nm

Capacitance C Infrared 90 - pF

Forward Voltage IF = 20mA VF [1] Infrared 1.3 1.6 V

Reverse Current (VR = 5V) IR Infrared - 10 uA

Temperature Coefficient of λpeak

IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Infrared 0.3 - nm/°C

Temperature Coefficient of VF

IF = 20mA, -10°C ≤ T ≤ 85°C TCV Infrared -1.3 - mV/°C

Notes:

1. Forward voltage: ±0.1V.

2. Wavelength value is traceable to CIE127-2007 standards.

3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

Notes:

1. 1/100 Duty Cycle, 10μs Pulse Width.

2. Rth

JA ,Rth

JS Results from mounting on PC board FR4 (pad size ≥ 16 mm2 per pad).

3. 2mm below package base.

4. 5mm below package base.

5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

Parameter Symbol Value Unit

Power Dissipation PD 85 mW

Reverse Voltage VR 5 V

Junction Temperature Tj 125 °C

Operating Temperature Top -40 to +85 °C

Storage Temperature Tstg -40 to +85 °C

DC Forward Current IF 50 mA

Peak Forward Current IFM [1] 1.2 A

Electrostatic Discharge Threshold (HBM) - 8000 V

Lead Solder Temperature [3] 260°C For 3 Seconds

Lead Solder Temperature [4] 260°C For 5 Seconds

Thermal Resistance (Junction / Ambient) Rth JA [2] 350 °C/W

Thermal Resistance (Junction / Solder point) Rth JS [2] 215 °C/W

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0

10

20

30

40

50

0.8 1.0 1.2 1.4 1.6 1.8

Ta = 25 °C

Forward voltage (V)

Forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

0 1020304050

Ta = 25 °C

Forward current (mA)

Radiant intensity normalised

at 20mA

0

10

20

30

40

50

60

70

-40-20 0 20406080100

Ambient temperature (°C)

Permissible forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

-40-200 20406080100

Ambient temperature (°C)

Radiant intensity normalised

at Ta = 25 °C

TECHNICAL DATA

0%

20%

40%

60%

80%

100%

600 650 700 750 800 850 900 950 1000 1050

T

a

= 25 °C

SF4

Wavelength (nm)

Relative Intensity (a. u.)

RELATIVE INTENSITY vs. WAVELENGTH

0.5 0.50.0

-90°

-75°

-60°

-45°

-30°

-15°

75°

60°

45°

30°

0° 15°

90°

1.0 1.0

T

a

= 25 °C

SPATIAL DISTRIBUTION

INFRARED

WP7113SF4BT-P22

RECOMMENDED WAVE SOLDERING PROFILE

Notes:

1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple

attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath

temperature of 260°C

2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).

3. Do not apply stress to the epoxy resin while the temperature is above 85°C.

4. Fixtures should not incur stress on the component when mounting and during soldering process.

5. SAC 305 solder alloy is recommended.

6. No more than one wave soldering pass.

PACKING & LABEL SPECIFICATIONS

Forward Current vs.

Forward Voltage

Radiant Intensity vs.

Forward Current

Radiant Intensity vs.

Ambient Temperature

Forward Current Derating Curve

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WP7113SF4BT-P22

PRECAUTIONS

Storage conditions

1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient

temperature.

2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.

Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the

internal structures and cause failure.

3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead

bend (Fig. 3 ,Fig. 4).

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force

will not be transmitted to the LED lens and its internal structures. Do not perform lead

forming once the component has been mounted onto the PCB. (Fig. 5 )

LED Mounting Method

1. The lead pitch of the LED must match the

pitch of the mounting holes on the PCB

during component placement.

Lead-forming may be required to insure

the lead pitch matches the hole pitch.

Refer to the figure below for proper lead

forming procedures.

Note 1-3: Do not route PCB trace in the contact area between the

leadframe and the PCB to prevent short-circuits.

"

○

"

Correct mounting method " x " Incorrect mounting method

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WP7113SF4BT-P22

Lead Forming Procedures

1. Do not bend the leads more than twice. (Fig. 6 )

2. During soldering, component covers and holders should leave

clearance to avoid placing damaging stress on the LED during

soldering. (Fig. 7)

3. The tip of the soldering iron should never touch the lens epoxy.

4. Through-hole LEDs are incompatible with reflow soldering.

5. If the LED will undergo multiple soldering passes or face other

processes where the part may be subjected to intense heat,

please check with Kingbright for compatibility.

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes

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