Driving the convergence of applications processors and MCUs i.MX RT Series of Crossover Processors Combining high performance with real-time functionality, the i.MX RT series of crossover processors are designed to support next-generation IoT applications with a high level of integration and security balanced with MCU-level usability at an affordable price. THE NEW CROSSOVER PROCESSOR MARKET As a leading supplier of both applications processors and microcontrollers (MCUs), NXP(R) is in a unique position to introduce a new class of embedded processors driven by the growing consumer demand for enhanced user experience in their smart and secure high-performance products. } Greater performance } Real-time operation } Richer integration } Ease of use TARGET APPLICATIONS } Audio Subsystem--professional microphone, guitar pedals } Consumer Products--Smart appliances, cameras, LCDs } Home and Building Automation--HVAC climate control, security, lighting control panels, IoT gateways } Industrial Computing Designs--EBS, PLCs, factory automation, test and measurement, M2M, HMI control assembly line robotics, QR reader, barcode scanner } Motor Control and Power Conversion--3D printers, thermal printers, unmanned autonomous vehicles, robotic vacuum cleaners i.MX DIAGRAM i.MX RT RTBLOCK BLOCK DIAGRAM System Control Main CPU Platform Connectivity Secure JTAG Core Up to 2x EMMC 4.5/SD 3.0 PLL, OSC Arm(R) Cortex(R)-M7 Up to 8x UART eDMA Up to 32 KB I-cache Up to 32 KB D-cache FPU Up to 512 KB TCM 4 x Watch Dog 6 x GP Timer Multimedia Up to 4 x QuadTimer 8-/16-bit Parallel Camera Interface Up to 4 x FlexPWM 24-bit Parallel LCD (RGB) IOMUX Pixel Processing Pipeline (PXP) 2D Graphics Acceleration Resize, CSC, Overlay, Rotation 4 MB Flash External Memory Up to 1MB SRAM Up to 2x Dual Channel Quad-SPI with Bus Encryption Engine 96 KB ROM Power Management DC/DC & LDO External Memory Controller 8-/16-bit SDRAM Parallel NOR Flash NAND Flash Temp Monitor Ciphers & RNG Available on certain product families Up to 4 x I2C GPIO 3 x I2S/SAI S/PDIF Tx/Rx 1 x CAN FD Up to 2x CAN Up to 2 x USB 2.0 OTG with PHY Up to 2 x 10/100 ENET with IEEE(R) 1588 ADC/DAC Up to 2 x ADC (20-ch.) Up to 4 x ACMP Security Secure RTC Up to 4 x SPI Single Clock Cycle GPIO Up to 4 x Quadrature ENC Internal Memory Up to 8 x 8 keypad eFuse HAB APPLICATIONS PROCESSOR PERFORMANCE + MCU USABILITY Feature i.MX RT1015 i.MX RT1020 i.MX RT1050 i.MX RT1060/ RT1064 } Move Fast, React Fast with real-time, low latency response Core/Speed Cortex-M7 @ 500 MHZ Cortex-M7 @ 500 MHz Cortex-M7 @ 600 MHz Cortex-M7 @ 600 MHz Cache 16 KB-I, 16 KB-D 16 KB-I, 16 KB-D 32 KB-I, 32 KB-D 32 KB-I, 32 KB-D } Create Advanced Multimedia with advanced on-chip integration TCM Up to 128 KB Up to 256 KB Up to 512 KB Up to 512 KB On-chip Flash - - - Up to 4 MB On-chip RAM 128 KB 256 KB 512 KB 1 MB } Connect and Protect with a high level of security } Save Time and Money by leveraging existing MCU toolchains PERFORMANCE HIGHLIGHTS } Highest performing Arm(R) Cortex(R)-M7 - 3020 CoreMark(R)/1284 DMIPS @ 600 MHz } Real-time, low-latency response - Up to 512 KB tightly coupled memory (TCM) - Fastest real-time response with latency as low as 20 ns } Low-power operation - Industry's lowest dynamic power with integrated DC-DC converter - Low-power run modes at 24 MHz USABILITY HIGHLIGHTS Highly Integrated } Advanced multimedia for GUI and enhanced HMI - 2D graphics acceleration engine External Memory SDIO QSPI / HyperBus Ethernet -N AND, eMMC, QuadSPI NOR flash, and Parallel NOR flash } Wireless connectivity interface for - Wi-Fi(R), Bluetooth(R), BLE, ZigBee(R) and ThreadTM - SD3.0/eMMC4.5 x 2 SD3.0/eMMC4.5 x 2 SD3.0/eMMC4.5 x 2 Dual Channel / 8-bit Dual-channel/8-bit Dual-channel/8-bit Up to 2 x Dualchannel/8-bit - 10/100 Mbit/s x 1 10/100 Mbit/s x 1 10/100 Mbit/s x 2 OTG, HS/FS x 1 OTG, HS/FS x 1 OTG, HS/FS x 1 CAN - FlexCAN x 2 FlexCAN x 2 FlexCAN x 2 + CANFD x 1 Graphics - - PxP for 2D acceleration PxP for 2D acceleration CSI - - 8-/10-/16-bit parallel 8-/10-/16-bit parallel LCD - - 8-/16-/18-/24-bit parallel 8-/16-/18-/24-bit parallel Security UART/SPI/I2C I2S/SPDIF ADC ACMP Quad ENC/ Quad Timer/ FlexPWM GP Timer / WDOG Package TRNG, AES-128, SHA, TRNG, AES-128, SHA, TRNG, AES-128, SHA, TRNG, AES-128, SHA, Secure Boot Secure Boot Secure Boot Secure Boot 4/2/2 8/4/4 8/4/4 3/1 3/1 3/1 3/1 1M sample/s x 1 1M sample/s x 2 1M sample/s x 2 1M sample/s x 2 0 4 4 4 1/1/1 2/2/2 4/4/4 4/4/4 6/4 6/4 6/4 6/4 LQFP-100 LQFP-100, LQFP-144 BGA-196 BGA-196 i.MX RT1020 LQFP100 i.MX RT1015 LQFP100 i.MX RT1060/RT1064 i.MX RT1050 Temperature Consumer: 0 to 95 C (Tj) Consumer: 0 to 95 C (Tj) Consumer: 0 to 95 C (Tj) Consumer: 0 to 95 C (Tj) Industrial: -40 to 105 C (Tj) Industrial: -40 to 105 C (Tj) Industrial: -40 to 105 C (Tj) Industrial: -40 to 105 C (Tj) Easy to Use Low BOM Cost } MCU customers can leverage current toolchain } 10k resale sub $1.50 - MCUXpresso, IAR, Keil(R) } Rapid and easy prototyping and development -F reeRTOSTM, SDK, Arm(R) MbedTM, ZephyrTM, and the global Arm ecosystem } DC-DC converter--eliminates need for external PMIC } LQFP and BGA packages with optimized pinout for low-cost 2-layer and 4-layer PCB design } Faster development using low-cost evaluation kit (EVK) } Single voltage input simplifies power circuit design www.nxp.com/iMXRT NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All other product or service names are the property of their respective owners. Arm, Cortex, Keil and Mbed are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The related technology may be protected by any or all of patents, copyrights, designs and trade secrets. All rights reserved. All rights reserved. (c) 2019 NXP B.V. Document Number: IMXRTSERIESFS REV 5 Release Date: January 2019 8/4/4 Pin-to-Pin Compatible - LCD display controller (up to WXGA 1366 x 768) } Extensive external memory interface options 8-/16-bit interface for 8-/16-bit interface for 8-/16-bit interface for SDRAM, SRAM, NOR, SDRAM, SRAM, NOR, SDRAM, SRAM, NOR, NAND NAND NAND OTG, HS/FS x 1 USB with PHY - Parallel camera sensor interface - 3 x I2S for high-performance, multichannel audio -