Driving the
convergence
of applications
processors and
MCUs
i.MX RT Series of Crossover Processors
Combining high performance with real-time functionality, the i.MX RT series of
crossover processors are designed to support next-generation IoT applications with
a high level of integration and security balanced with MCU-level usability at an
affordable price.
THE NEW CROSSOVER PROCESSOR MARKET
As a leading supplier of both applications processors and
microcontrollers (MCUs), NXP® is in a unique position to
introduce a new class of embedded processors driven by the
growing consumer demand for enhanced user experience in
their smart and secure high-performance products.
} Greater performance
} Real-time operation
} Richer integration
} Ease of use
TARGET APPLICATIONS
} Audio Subsystem—professional microphone, guitar pedals
} Consumer Products—Smart appliances, cameras, LCDs
} Home and Building Automation—HVAC climate control,
security, lighting control panels, IoT gateways
} Industrial Computing Designs—EBS, PLCs, factory
automation, test and measurement, M2M, HMI control
assembly line robotics, QR reader, barcode scanner
} Motor Control and Power Conversion—3D printers,
thermal printers, unmanned autonomous vehicles, robotic
vacuum cleaners
i.MX RT BLOCK DIAGRAM
Secure JTAG Core
8-/16-bit Parallel Camera Interface
24-bit Parallel LCD (RGB)
Up to 2x Dual Channel Quad-SPI
with Bus Encryption Engine
Pixel Processing Pipeline (PXP)
2D Graphics Acceleration
Resize, CSC, Overlay, Rotation
External Memory Controller
8-/16-bit SDRAM
Parallel NOR Flash
NAND Flash
Arm® Cortex®-M7 Up to 8x UART
Up to 8 x 8 keypad
Up to 4 x SPI
Up to 4 x I2C
GPIO
Single Clock Cycle GPIO
1 x CAN FD
3 x I2S/SAI
S/PDIF Tx/Rx
Up to 2x CAN
Up to 2 x USB 2.0 OTG
with PHY
Up to 2 x 10/100 ENET
with IEEE® 1588
Up to 512 KB TCM
Up to 32 KB
D-cache
Up to 32 KB
I-cache
FPU
PLL, OSC
eDMA
4 x Watch Dog
6 x GP Timer
Up to 4 x Quadrature ENC
Up to 4 x QuadTimer
Up to 4 x FlexPWM
IOMUX
Up to 1MB SRAM
96 KB ROM
DC/DC & LDO
Temp Monitor
Ciphers & RNG Secure RTCeFuse HAB
Up to 2 x ADC (20-ch.)
Up to 4 x ACMP
4 MB Flash
Available on certain product families
Up to 2x EMMC 4.5/SD 3.0
Main CPU Platform
Multimedia
Internal Memory
Power Management
External Memory
Security
ADC/DAC
System ControlConnectivity
i.MX RT BLOCK DIAGRAM
NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All other product or service names are the
property of their respective owners. Arm, Cortex, Keil and Mbed are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The
related technology may be protected by any or all of patents, copyrights, designs and trade secrets. All rights reserved. All rights reserved. © 2019 NXP B.V.
Document Number: IMXRTSERIESFS REV 5
Release Date: January 2019
www.nxp.com/iMXRT
APPLICATIONS PROCESSOR
PERFORMANCE + MCU USABILITY
} Move Fast, React Fast with real-time,
low latency response
} Create Advanced Multimedia with
advanced on-chip integration
} Connect and Protect with a high level
of security
} Save Time and Money by leveraging
existing MCU toolchains
PERFORMANCE HIGHLIGHTS
} Highest performing Arm® Cortex®-M7
– 3020 CoreMark®/1284 DMIPS @
600 MHz
} Real-time, low-latency response
– Up to 512 KB tightly coupled
memory (TCM)
– Fastest real-time response with
latency as low as 20 ns
} Low-power operation
– Industry’s lowest dynamic power with
integrated DC-DC converter
– Low-power run modes at 24 MHz
USABILITY HIGHLIGHTS
Highly Integrated
} Advanced multimedia for GUI and
enhanced HMI
– 2D graphics acceleration engine
– Parallel camera sensor interface
– LCD display controller (up to WXGA
1366 x 768)
– 3 x I2S for high-performance,
multichannel audio
} Extensive external memory interface
options
– NAND, eMMC, QuadSPI NOR flash,
and Parallel NOR flash
} Wireless connectivity interface for
– Wi-Fi®, Bluetooth®, BLE, ZigBee® and
Thread™
Easy to Use
} MCU customers can leverage current
toolchain
– MCUXpresso, IAR, Keil®
} Rapid and easy prototyping and
development
– FreeRTOS™, SDK, Arm® Mbed™,
Zephyr™, and the global Arm
ecosystem
} Faster development using low-cost
evaluation kit (EVK)
} Single voltage input simplifies power
circuit design
Low BOM Cost
} 10k resale sub $1.50
} DC-DC converter—eliminates need for
external PMIC
} LQFP and BGA packages with
optimized pinout for low-cost 2-layer
and 4-layer PCB design
Feature i.MX RT1015 i.MX RT1020 i.MX RT1050 i.MX RT1060/
RT1064
Core/Speed Cortex-M7 @ 500
MHZ
Cortex-M7 @ 500
MHz
Cortex-M7 @ 600
MHz
Cortex-M7 @ 600
MHz
Cache 16 KB-I, 16 KB-D 16 KB-I, 16 KB-D 32 KB-I, 32 KB-D 32 KB-I, 32 KB-D
TCM Up to 128 KB Up to 256 KB Up to 512 KB Up to 512 KB
On-chip Flash ---Up to 4 MB
On-chip RAM 128 KB 256 KB 512 KB 1 MB
External
Memory
-8-/16-bit interface for
SDRAM, SRAM, NOR,
NAND
8-/16-bit interface for
SDRAM, SRAM, NOR,
NAND
8-/16-bit interface for
SDRAM, SRAM, NOR,
NAND
SDIO -SD3.0/eMMC4.5 x 2 SD3.0/eMMC4.5 x 2 SD3.0/eMMC4.5 x 2
QSPI /
HyperBus
Dual Channel / 8-bit Dual-channel/8-bit Dual-channel/8-bit Up to 2 x Dual-
channel/8-bit
Ethernet -10/100 Mbit/s x 1 10/100 Mbit/s x 1 10/100 Mbit/s x 2
USB with PHY OTG, HS/FS x 1 OTG, HS/FS x 1 OTG, HS/FS x 1 OTG, HS/FS x 1
CAN -FlexCAN x 2 FlexCAN x 2 FlexCAN x 2 +
CANFD x 1
Graphics - - PxP for 2D
acceleration
PxP for 2D
acceleration
CSI - - 8-/10-/16-bit parallel 8-/10-/16-bit parallel
LCD - - 8-/16-/18-/24-bit
parallel
8-/16-/18-/24-bit
parallel
Security TRNG, AES-128, SHA,
Secure Boot
TRNG, AES-128, SHA,
Secure Boot
TRNG, AES-128, SHA,
Secure Boot
TRNG, AES-128, SHA,
Secure Boot
UART/SPI/I2C4/2/2 8/4/4 8/4/4 8/4/4
I2S/SPDIF 3/1 3/1 3/1 3/1
ADC 1M sample/s x 1 1M sample/s x 2 1M sample/s x 2 1M sample/s x 2
ACMP 0444
Quad ENC/
Quad Timer/
FlexPWM
1/1/1 2/2/2 4/4/4 4/4/4
GP Timer /
WDOG
6/4 6/4 6/4 6/4
Package LQFP-100 LQFP-100, LQFP-144 BGA-196 BGA-196
Pin-to-Pin
Compatible
i.MX RT1020 LQFP-
100
i.MX RT1015 LQFP-
100
i.MX RT1060/RT1064 i.MX RT1050
Temperature Consumer: 0 to
95 °C (Tj)
Consumer: 0 to
95 °C (Tj)
Consumer: 0 to
95 °C (Tj)
Consumer: 0 to
95 °C (Tj)
Industrial: -40 to
105 °C (Tj)
Industrial: -40 to 105
°C (Tj)
Industrial: -40 to
105 °C (Tj)
Industrial: -40 to
105 °C (Tj)
