IC363 Series (Open Top) Thin Small Outline Package (TSOP - t y p e II) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Contact Force: Operating Force: Mating Cycles: 1,000M min. at 500V DC 700V AC for 1 minute 30m max. at 10mA / 20mV max. -40C to +150C 10,000 insertions min. 20g - 60g per pin 2.5kg max. 10,000 times IC363 - 0** 2 - 00* * Series No. No. of Contact Pins Number of Sides with Contacts Design No. Materials and Finish Positioning Pin: N = Without Positioning Pin P = With Positioning Pin Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features Open Top low actuation force socket with extremely reliable 2-point contact system Applicable Dimensions (Reference Only) Outline Socket Dimensions 20.20 11.88 +0.1 0 +0.08 10.41 0 5.00 0 1.30 -0.1 Positioning Pin D x 12.400.1 D 0.20 0.20 0-80x24=19.200.2 E 0.1 A B C X 4.00 Thru hole X 8.20 ref 8.60 1.00 12.20 Insertion 8.70 ref 14.20 ref 3.200.5 YAMAICHI ELECTRONICS - Munich 089 / 45109-0 2.00 (stroke) Contact Details 0.45 Section X - X (Retracted position) Section X - X Part Number Pin Count A B C D E (Pitch) IC363-0502-001* IC363-0542-002* IC363-0662-003* 50 54 66 26.40 28.00 28.00 20.88 22.75 22.92 19.56 21.18 21.14 23.40 25.00 25.00 0.80 0.80 0.65 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER IC363 Series (Open Top) Thin Small Outline Package (TSOP - Type II) Top View from Socket Recommended IC Dimensions and PCB Layouts IC363-0502-001* 50 pins (TSOP II) 11.76 0.8 12.400.05 10.16 0.1 50-0.70 + 0.1 0 + 0.05 0 1.40 10.670.05 1.13 ref 0.80 x 24 = 19.20 0.1 0.80 0.05 0.145 0.02 21.35 max. 23.400.05 0.27 0.04 Thru hole Thru hole for pos. pins 15.750.05 PCB Layout IC Dimensions IC363-0542-002* 54 pins (TSOP II) 11.76 0.8 12.400.05 10.16 0.1 54-0.70 + 0.1 0 + 0.1 0 1.40 10.670.05 1.20 max. Thru hole for pos. pins 15.750.05 PCB Layout IC Dimensions IC363-0662-003* 66 pins (TSOP II) 11.76 0.8 12.400.05 10.16 0.1 66-0.70 + 0.1 0 0.145 0.02 0.65 0.05 25.000.05 0.65 x 32 = 20.80 0.1 0.24 0.04 Thru hole 22.62 max. YAMAICHI ELECTRONICS - Munich 089 / 45109-0 0.80 x 26 = 20.80 0.1 0.80 0.05 0.145 0.02 22.72 max. 25.000.05 0.30 0.04 Thru hole 1.20 max. 10.670.05 15.750.05 IC Dimensions J + 0.1 0 1.40 Thru hole for pos. pins PCB Layout SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER