1214GN-280 - MICROSEMI - Datasheet.Live

LP2996

June 29, 2012

DDR Termination Regulator

General Description

The LP2996 linear regulator is designed to meet the JEDEC

SSTL-2 specifications for termination of DDR-SDRAM. The

device contains a high-speed operational amplifier to provide

excellent response to load transients. The output stage pre-

vents shoot through while delivering 1.5A continuous current

and transient peaks up to 3A in the application as required for

DDR-SDRAM termination. The LP2996 also incorporates a

VSENSE pin to provide superior load regulation and a VREF

output as a reference for the chipset and DIMMs.

An additional feature found on the LP2996 is an active low

shutdown (SD) pin that provides Suspend To RAM (STR)

functionality. When SD is pulled low the VTT output will tri-

state providing a high impedance output, but, VREF will remain

active. A power savings advantage can be obtained in this

mode through lower quiescent current.

Features

■Source and sink current

■Low output voltage offset

■No external resistors required

■Linear topology

■Suspend to Ram (STR) functionality

■Low external component count

■Thermal Shutdown

■Available in SO-8, PSOP-8 or LLP-16 packages

Applications

■DDR-I and DDR-II Termination Voltage

■SSTL-2 and SSTL-3 Termination

■HSTL Termination

Typical Application Circuit

20057518

LP2996 DDR Termination Regulator

Connection Diagrams

Top View

20057502

LLP-16 Layout

20057503

PSOP-8 Layout

20057504

SO-8 Layout

Pin Descriptions

SO-8 Pin or

PSOP-8 Pin LLP Pin Name Function

1 2 GND Ground

2 4 SD Shutdown

3 5 VSENSE Feedback pin for regulating VTT.

4 7 VREF Buffered internal reference voltage of VDDQ/2

5 8 VDDQ Input for internal reference equal to VDDQ/2

6 10 AVIN Analog input pin

7 11, 12 PVIN Power input pin

8 14, 15 VTT Output voltage for connection to termination resistors

- 1, 3, 6, 9, 13, 16 NC No internal connection

EP EP Exposed pad thermal connection. Connect to Ground.

Ordering Information

Order Number Package Type NSC Package Drawing Supplied As

LP2996M SO-8 M08A 95 Units per Rail

LP2996MX SO-8 M08A 2500 Units Tape and Reel

LP2996MR PSOP-8 MRA08A 95 Units per Rail

LP2996MRX PSOP-8 MRA08A 2500 Units Tape and Reel

LP2996LQ LLP-16 LQA16A 1000 Units Tape and Reel

LP2996LQX LLP-16 LQA16A 4500 Units Tape and Reel

www.ti.com 2

LP2996

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for

availability and specifications.

AVIN to GND −0.3V to +6V

PVIN to GND -0.3V to AVIN

VDDQ (Note 2) −0.3V to +6V

Storage Temp. Range −65°C to +150°C

Junction Temperature 150°C

SO-8 Thermal Resistance (θJA)151°C/W

PSOP-8 Thermal Resistance (θJA)43°C/W

LLP-16 Thermal Resistance (θJA)51°C/W

Lead Temperature (Soldering, 10 sec) 260°C

ESD Rating (Note 3) 1kV

Operating Range

Junction Temp. Range (Note 4) 0°C to +125°C

AVIN to GND 2.2V to 5.5V

PVIN Supply Voltage 0 to AVIN

SD Input Voltage 0 to AVIN

Electrical Characteristics Specifications with standard typeface are for TJ = 25°C and limits in boldface type

apply over the full Operating Temperature Range (TJ = 0°C to +125°C) (Note 5). Unless otherwise specified,

AVIN = PVIN = 2.5V, VDDQ = 2.5V (Note 6).

Symbol Parameter Conditions Min Typ Max Units

VREF VREF Voltage VIN = VDDQ = 2.3V

VIN = VDDQ = 2.5V

VIN = VDDQ = 2.7V

1.135

1.235

1.335

1.158

1.258

1.358

1.185

1.285

1.385

ZVREF VREF Output Impedance IREF = -30 to +30 μA 2.5 kΩ

VTT VTT Output Voltage IOUT = 0A

VIN = VDDQ = 2.3V

VIN = VDDQ = 2.5V

VIN = VDDQ = 2.7V

1.125

1.225

1.325

1.159

1.259

1.359

1.190

1.290

1.390 V

IOUT = ±1.5A (Note 9)

VIN = VDDQ = 2.3V

VIN = VDDQ = 2.5V

VIN = VDDQ = 2.7V

1.125

1.225

1.325

1.159

1.259

1.359

1.190

1.290

1.390

VosTT/VTT VTT Output Voltage Offset

(VREF-VTT)

IOUT = 0A

IOUT = -1.5A (Note 9)

IOUT = +1.5A (Note 9)

-20

-25

IQQuiscent Current (Note 7) IOUT = 0A (Note 5) 320 500 µA

ZVDDQ VDDQ Input Impedance 100 kΩ

ISD Quiescent Current in

Shutdown (Note 7)

SD = 0V 115 150 µA

IQ_SD Shutdown Leakage Current SD = 0V 2 5µA

VIH Minimum Shutdown High

Level

1.9 V

VIL Maximum Shutdown Low

Level

0.8 V

IVVTT Leakage Current in

Shutdown

SD = 0V

VTT = 1.25V

1 10 µA

ISENSE VSENSE Input Current 13 nA

TSD Thermal Shutdown (Note 8) 165 Celcius

TSD_HYS Thermal Shutdown

Hysteresis

10 Celcius

3 www.ti.com

LP2996

Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating range indicates conditions for which the device is

intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions see Electrical Characteristics.

The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under

the listed test conditions.

Note 2: VDDQ voltage must be less than 2 x (AVIN - 1) or 6V, whichever is smaller.

Note 3: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.

Note 4: At elevated temperatures, devices must be derated based on thermal resistance. The device in the SO-8 package must be derated at θJA = 151.2° C/W

junction to ambient with no heat sink.

Note 5: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality

Control (SQC) methods. The limits are used to calculate National's Average Outgoing Quality Level (AOQL).

Note 6: VIN is defined as VIN = AVIN = PVIN.

Note 7: Quiescent current defined as the current flow into AVIN.

Note 8: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction to ambient thermal resistance, θJA,

and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature and the regulator will go into thermal

shutdown.

Note 9: VTT load regulation is tested by using a 10 ms current pulse and measuring VTT.

www.ti.com 4

LP2996

Typical Performance Characteristics

Iq vs AVIN in SD

20057520

Iq vs AVIN

20057521

VIH and VIL

20057522

VREF vs IREF

20057523

VREF vs VDDQ

20057524

VTT vs IOUT

20057525

5 www.ti.com

LP2996

VTT vs VDDQ

20057526

Iq vs AVIN in SD Temperature

20057527

Iq vs AVIN Temperature

20057528

Maximum Sourcing Current vs AVIN

(VDDQ = 2.5V, PVIN = 1.8V)

20057531

Maximum Sourcing Current vs AVIN

(VDDQ = 2.5V, PVIN = 2.5V)

20057532

Maximum Sourcing Current vs AVIN

(VDDQ = 2.5V, PVIN = 3.3V)

20057533

www.ti.com 6

LP2996

Maximum Sinking Current vs AVIN

(VDDQ = 2.5V)

20057534

Maximum Sourcing Current vs AVIN

(VDDQ = 1.8V, PVIN = 1.8V)

20057535

Maximum Sinking Current vs AVIN

(VDDQ = 1.8V)

20057536

Maximum Sourcing Current vs AVIN

(VDDQ = 1.8V, PVIN = 3.3V)

20057537

Block Diagram

20057505

7 www.ti.com

LP2996

Description

The LP2996 is a linear bus termination regulator designed to

meet the JEDEC requirements of SSTL-2. The output, VTT is

capable of sinking and sourcing current while regulating the

output voltage equal to VDDQ / 2. The output stage has been

designed to maintain excellent load regulation while prevent-

ing shoot through. The LP2996 also incorporates two distinct

power rails that separates the analog circuitry from the power

output stage. This allows a split rail approach to be utilized to

decrease internal power dissipation. It also permits the

LP2996 to provide a termination solution for the next gener-

ation of DDR-SDRAM memory (DDRII). For new designs, the

LP2997 or LP2998 is recommended for DDR-II applications.

The LP2996 can also be used to provide a termination voltage

for other logic schemes such as SSTL-3 or HSTL.

Series Stub Termination Logic (SSTL) was created to im-

prove signal integrity of the data transmission across the

memory bus. This termination scheme is essential to prevent

data error from signal reflections while transmitting at high

frequencies encountered with DDR-SDRAM. The most com-

mon form of termination is Class II single parallel termination.

This involves one RS series resistor from the chipset to the

memory and one RT termination resistor. Typical values for

RS and RT are 25 Ohms, although these can be changed to

scale the current requirements from the LP2996. This imple-

mentation can be seen below in Figure 1.

20057506

FIGURE 1. SSTL-Termination Scheme

www.ti.com 8

LP2996

Pin Descriptions

AVIN AND PVIN

AVIN and PVIN are the input supply pins for the LP2996. AVIN

is used to supply all the internal control circuitry. PVIN, how-

ever, is used exclusively to provide the rail voltage for the

output stage used to create VTT. These pins have the capa-

bility to work off separate supplies depending on the applica-

tion. Higher voltages on PVIN will increase the maximum

continuous output current because of output RDSON limita-

tions at voltages close to VTT. The disadvantage of high

values of PVIN is that the internal power loss will also in-

crease, thermally limiting the design. For SSTL-2 applica-

tions, a good compromise would be to connect the AVIN and

PVIN directly together at 2.5V. This eliminates the need for

bypassing the two supply pins separately. The only limitation

on input voltage selection is that PVIN must be equal to or

lower than AVIN. It is recommended to connect PVIN to volt-

age rails equal to or less than 3.3V to prevent the thermal limit

from tripping because of excessive internal power dissipation.

If the junction temperature exceeds the thermal shutdown

than the part will enter a shutdown state identical to the man-

ual shutdown where VTT is tri-stated and VREF remains active.

VDDQ

VDDQ is the input used to create the internal reference volt-

age for regulating VTT. The reference voltage is generated

from a resistor divider of two internal 50kΩ resistors. This

guarantees that VTT will track VDDQ / 2 precisely. The optimal

implementation of VDDQ is as a remote sense. This can be

achieved by connecting VDDQ directly to the 2.5V rail at the

DIMM instead of AVIN and PVIN. This ensures that the ref-

erence voltage tracks the DDR memory rails precisely without

a large voltage drop from the power lines. For SSTL-2 appli-

cations VDDQ will be a 2.5V signal, which will create a 1.25V

termination voltage at VTT (See Electrical Characteristics Ta-

ble for exact values of VTT over temperature).

VSENSE

The purpose of the sense pin is to provide improved remote

load regulation. In most motherboard applications the termi-

nation resistors will connect to VTT in a long plane. If the output

voltage was regulated only at the output of the LP2996 then

the long trace will cause a significant IR drop resulting in a

termination voltage lower at one end of the bus than the other.

The VSENSE pin can be used to improve this performance, by

connecting it to the middle of the bus. This will provide a better

distribution across the entire termination bus. If remote load

regulation is not used then the VSENSE pin must still be con-

nected to VTT. Care should be taken when a long VSENSE trace

is implemented in close proximity to the memory. Noise pick-

up in the VSENSE trace can cause problems with precise

regulation of VTT. A small 0.1uF ceramic capacitor placed next

to the VSENSE pin can help filter any high frequency signals

and preventing errors.

SHUTDOWN

The LP2996 contains an active low shutdown pin that can be

used to tri-state VTT. During shutdown VTT should not be ex-

posed to voltages that exceed AVIN. With the shutdown pin

asserted low the quiescent current of the LP2996 will drop,

however, VDDQ will always maintain its constant impedance

of 100kΩ for generating the internal reference. Therefore to

calculate the total power loss in shutdown both currents need

to be considered. For more information refer to the Thermal

Dissipation section. The shutdown pin also has an internal

pull-up current, therefore to turn the part on the shutdown pin

can either be connected to AVIN or left open.

VREF

VREF provides the buffered output of the internal reference

voltage VDDQ / 2. This output should be used to provide the

reference voltage for the Northbridge chipset and memory.

Since these inputs are typically an extremely high impedance,

there should be little current drawn from VREF. For improved

performance, an output bypass capacitor can be used, locat-

ed close to the pin, to help with noise. A ceramic capacitor in

the range of 0.1 µF to 0.01 µF is recommended. This output

remains active during the shutdown state and thermal shut-

down events for the suspend to RAM functionality.

VTT

VTT is the regulated output that is used to terminate the bus

resistors. It is capable of sinking and sourcing current while

regulating the output precisely to VDDQ / 2. The LP2996 is

designed to handle peak transient currents of up to ± 3A with

a fast transient response. The maximum continuous current

is a function of VIN and can be viewed in the TYPICAL PER-

FORMANCE CHARACTERISTICS section. If a transient is

expected to last above the maximum continuous current rat-

ing for a significant amount of time then the output capacitor

should be sized large enough to prevent an excessive voltage

drop. Despite the fact that the LP2996 is designed to handle

large transient output currents it is not capable of handling

these for long durations, under all conditions. The reason for

this is the standard packages are not able to thermally dissi-

pate the heat as a result of the internal power loss. If large

currents are required for longer durations, then care should

be taken to ensure that the maximum junction temperature is

not exceeded. Proper thermal derating should always be

used (please refer to the Thermal Dissipation section). If the

junction temperature exceeds the thermal shutdown point

than VTT will tri-state until the part returns below the hysteretic

trip-point.

Component Selections

INPUT CAPACITOR

The LP2996 does not require a capacitor for input stability,

but it is recommended for improved performance during large

load transients to prevent the input rail from dropping. The

input capacitor should be located as close as possible to the

PVIN pin. Several recommendations exist dependent on the

application required. A typical value recommended for AL

electrolytic capacitors is 50 µF. Ceramic capacitors can also

be used, a value in the range of 10 µF with X5R or better would

be an ideal choice. The input capacitance can be reduced if

the LP2996 is placed close to the bulk capacitance from the

output of the 2.5V DC-DC converter. If the two supply rails

(AVIN and PVIN) are separated then the 47uF capacitor

should be placed as close to possible to the PVIN rail. An

additional 0.1uF ceramic capacitor can be placed on the AVIN

rail to prevent excessive noise from coupling into the device.

OUTPUT CAPACITOR

The LP2996 has been designed to be insensitive of output

capacitor size or ESR (Equivalent Series Resistance). This

allows the flexibility to use any capacitor desired. The choice

for output capacitor will be determined solely on the applica-

tion and the requirements for load transient response of VTT.

As a general recommendation the output capacitor should be

sized above 100 µF with a low ESR for SSTL applications with

DDR-SDRAM. The value of ESR should be determined by the

9 www.ti.com

LP2996

maximum current spikes expected and the extent at which the

output voltage is allowed to droop. Several capacitor options

are available on the market and a few of these are highlighted

below:

AL - It should be noted that many aluminum electrolytics only

specify impedance at a frequency of 120 Hz, which indicates

they have poor high frequency performance. Only aluminum

electrolytics that have an impedance specified at a higher fre-

quency (between 20 kHz and 100 kHz) should be used for the

LP2996. To improve the ESR several AL electrolytics can be

combined in parallel for an overall reduction. An important

note to be aware of is the extent at which the ESR will change

over temperature. Aluminum electrolytic capacitors can have

their ESR rapidly increase at cold temperatures.

Ceramic - Ceramic capacitors typically have a low capaci-

tance, in the range of 10 to 100 µF range, but they have

excellent AC performance for bypassing noise because of

very low ESR (typically less than 10 mΩ). However, some

dielectric types do not have good capacitance characteristics

as a function of voltage and temperature. Because of the typ-

ically low value of capacitance it is recommended to use

ceramic capacitors in parallel with another capacitor such as

an aluminum electrolytic. A dielectric of X5R or better is rec-

ommended for all ceramic capacitors.

Hybrid - Several hybrid capacitors such as OS-CON and SP

are available from several manufacturers. These offer a large

capacitance while maintaining a low ESR. These are the best

solution when size and performance are critical, although

their cost is typically higher than any other capacitor.

Thermal Dissipation

Since the LP2996 is a linear regulator any current flow from

VTT will result in internal power dissipation generating heat.

To prevent damaging the part from exceeding the maximum

allowable junction temperature, care should be taken to der-

ate the part dependent on the maximum expected ambient

temperature and power dissipation. The maximum allowable

internal temperature rise (TRmax) can be calculated given the

maximum ambient temperature (TAmax) of the application and

the maximum allowable junction temperature (TJmax).

TRmax = TJmax − TAmax

From this equation, the maximum power dissipation (PDmax)

of the part can be calculated:

PDmax = TRmax / θJA

The θJA of the LP2996 will be dependent on several variables:

the package used; the thickness of copper; the number of vias

and the airflow. For instance, the θJA of the SO-8 is 163°C/W

with the package mounted to a standard 8x4 2-layer board

with 1oz. copper, no airflow, and 0.5W dissipation at room

temperature. This value can be reduced to 151.2°C/W by

changing to a 3x4 board with 2 oz. copper that is the JEDEC

standard. Figure 2 shows how the θJA varies with airflow for

the two boards mentioned.

20057507

FIGURE 2. θJA vs Airflow (SO-8)

Additional improvements can be made by the judicious use of

vias to connect the part and dissipate heat to an internal

ground plane. Using larger traces and more copper on the top

side of the board can also help. With careful layout it is pos-

sible to reduce the θJA further than the nominal values shown

in Figure 2

Layout is also extremely critical to maximize the output cur-

rent with the LLP package. By simply placing vias under the

DAP the θJA can be lowered significantly. Figure 3 shows the

LLP thermal data when placed on a 4-layer JEDEC board with

copper thickness of 0.5/1/1/0.5 oz. The number of vias, with

a pitch of 1.27 mm, has been increased to the maximum of 4

where a θJA of 50.41°C/W can be obtained. Via wall thickness

for this calculation is 0.036 mm for 1oz. Copper.

20057508

FIGURE 3. LLP-16 θJA vs # of Vias (4 Layer JEDEC Board))

Additional improvements in lowering the θJA can also be

achieved with a constant airflow across the package. Main-

taining the same conditions as above and utilizing the 2x2 via

array, Figure 4 shows how the θJA varies with airflow.

www.ti.com 10

LP2996

20057509

FIGURE 4. θJA vs Airflow Speed (JEDEC Board with 4

Vias)

Optimizing the θJA and placing the LP2996 in a section of a

board exposed to lower ambient temperature allows the part

to operate with higher power dissipation. The internal power

dissipation can be calculated by summing the three main

sources of loss: output current at VTT, either sinking or sourc-

ing, and quiescent current at AVIN and VDDQ. During the

active state (when shutdown is not held low) the total internal

power dissipation can be calculated from the following equa-

tions:

PD = PAVIN + PVDDQ + PVTT

Where,

PAVIN = IAVIN * VAVIN

PVDDQ = VVDDQ * IVDDQ = VVDDQ2 x RVDDQ

To calculate the maximum power dissipation at VTT both con-

ditions at VTT need to be examined, sinking and sourcing

current. Although only one equation will add into the total,

VTT cannot source and sink current simultaneously.

PVTT = VVTT x ILOAD (Sinking) or

PVTT = ( VPVIN - VVTT) x ILOAD (Sourcing

The power dissipation of the LP2996 can also be calculated

during the shutdown state. During this condition the output

VTT will tri-state, therefore that term in the power equation will

disappear as it cannot sink or source any current (leakage is

negligible). The only losses during shutdown will be the re-

duced quiescent current at AVIN and the constant impedance

that is seen at the VDDQ pin.

PD = PAVIN + PVDDQ

PAVIN = IAVIN x VAVIN

PVDDQ = VVDDQ * IVDDQ = VVDDQ2 x RVDDQ

11 www.ti.com

LP2996

Typical Application Circuits

Several different application circuits have been shown in Fig-

ure 5 through Figure 14 to illustrate some of the options that

are possible in configuring the LP2996. Graphs of the indi-

vidual circuit performance can be found in the Typical Perfor-

mance Characteristics section in the beginning of the

datasheet. These curves illustrate how the maximum output

current is affected by changes in AVIN and PVIN.

SSTL-2 APPLICATIONS

For the majority of applications that implement the SSTL-2

termination scheme it is recommended to connect all the input

rails to the 2.5V rail. This provides an optimal trade-off be-

tween power dissipation and component count and selection.

An example of this circuit can be seen in Figure 5.

20057510

FIGURE 5. Recommended SSTL-2 Implementation

If power dissipation or efficiency is a major concern then the

LP2996 has the ability to operate on split power rails. The

output stage (PVIN) can be operated on a lower rail such as

1.8V and the analog circuitry (AVIN) can be connected to a

higher rail such as 2.5V, 3.3V or 5V. This allows the internal

power dissipation to be lowered when sourcing current from

VTT. The disadvantage of this circuit is that the maximum

continuous current is reduced because of the lower rail volt-

age, although it is adequate for all motherboard SSTL-2 ap-

plications. Increasing the output capacitance can also help if

periods of large load transients will be encountered.

20057511

FIGURE 6. Lower Power Dissipation SSTL-2 Implementation

The third option for SSTL-2 applications in the situation that

a 1.8V rail is not available and it is not desirable to use 2.5V,

is to connect the LP2996 power rail to 3.3V. In this situation

AVIN will be limited to operation on the 3.3V or 5V rail as PVIN

can never exceed AVIN. This configuration has the ability to

provide the maximum continuous output current at the down-

side of higher thermal dissipation. Care should be taken to

prevent the LP2996 from experiencing large current levels

which cause the junction temperature to exceed the maxi-

mum. Because of this risk it is not recommended to supply

the output stage with a voltage higher than a nominal 3.3V

rail.

www.ti.com 12

LP2996

20057512

FIGURE 7. SSTL-2 Implementation with higher voltage rails

DDR-II APPLICATIONS

With the separate VDDQ pin and an internal resistor divider

it is possible to use the LP2996 in applications utilizing DDR-

II memory. Figure 6 and Figure 7 show several implementa-

tions of recommended circuits with output curves displayed

in the Typical Performance Characteristics. Figure 6 shows

the recommended circuit configuration for DDR-II applica-

tions. The output stage is connected to the 1.8V rail and the

AVIN pin can be connected to either a 3.3V or 5V rail. For new

designs, the LP2997 or LP2998 is recommended for DDR-II

applications.

20057513

FIGURE 8. Recommended DDR-II Termination

If it is not desirable to use the 1.8V rail it is possible to connect

the output stage to a 3.3V rail. Care should be taken to not

exceed the maximum junction temperature as the thermal

dissipation increases with lower VTT output voltages. For this

reason it is not recommended to power PVIN off a rail higher

than the nominal 3.3V. The advantage of this configuration is

that it has the ability to source and sink a higher maximum

continuous current.

20057514

FIGURE 9. DDR-II Termination with higher voltage rails

13 www.ti.com

LP2996

LEVEL SHIFTING

If standards other than SSTL-2 are required, such as SSTL-3,

it may be necessary to use a different scaling factor than 0.5

times VDDQ for regulating the output voltage. Several options

are available to scale the output to any voltage required. One

method is to level shift the output by using feedback resistors

from VTT to the VSENSE pin. This has been illustrated in Figures

10 and 11. Figure 10 shows how to use two resistors to level

shift VTT above the internal reference voltage of VDDQ/2. To

calculate the exact voltage at VTT the following equation can

be used.

VTT = VDDQ/2 ( 1 + R1/R2)

20057515

FIGURE 10. Increasing VTT by Level Shifting

Conversely, the R2 resistor can be placed between VSENSE

and VDDQ to shift the VTT output lower than the internal refer-

ence voltage of VDDQ/2. The equations relating VTT and the

resistors can be seen below:

VTT = VDDQ/2 (1 - R1/R2)

20057516

FIGURE 11. Decreasing VTT by Level Shifting

HSTL APPLICATIONS

The LP2996 can be easily adapted for HSTL applications by

connecting VDDQ to the 1.5V rail. This will produce a VTT and

VREF voltage of approximately 0.75V for the termination re-

sistors. AVIN and PVIN should be connected to a 2.5V rail for

optimal performance.

20057517

FIGURE 12. HSTL Application

www.ti.com 14

LP2996

QDR APPLICATIONS

Quad data rate (QDR) applications utilize multiple channels

for improved memory performance. However, this increase in

bus lines has the effect of increasing the current levels re-

quired for termination. The recommended approach in termi-

nating multiple channels is to use a dedicated LP2996 for

each channel. This simplifies layout and reduces the internal

power dissipation for each regulator. Separate VREF signals

can be used for each DIMM bank from the corresponding

regulator with the chipset reference provided by a local resis-

tor divider or one of the LP2996 signals. Because VREF and

VTT are expected to track and the part to part variations are

minor, there should be little difference between the reference

signals of each LP2996.

OUTPUT CAPACITOR SELECTION

For applications utilizing the LP2996 to terminate SSTL-2 I/O

signals the typical application circuit shown in Figure 11 can

be implemented.

20057518

FIGURE 13. Typical SSTL-2 Application Circuit

This circuit permits termination in a minimum amount of board

space and component count. Capacitor selection can be var-

ied depending on the number of lines terminated and the

maximum load transient. However, with motherboards and

other applications where VTT is distributed across a long plane

it is advisable to use multiple bulk capacitors and addition to

high frequency decoupling. Figure 12 shown below depicts

an example circuit where 2 bulk output capacitors could be

situated at both ends of the VTT plane for optimal placement.

Large aluminum electrolytic capacitors are used for their low

ESR and low cost.

20057519

FIGURE 14. Typical SSTL-2 Application Circuit for Motherboards

In most PC applications an extensive amount of decoupling

is required because of the long interconnects encountered

with the DDR-SDRAM DIMMs mounted on modules. As a re-

sult bulk aluminum electrolytic capacitors in the range of

1000uF are typically used.

15 www.ti.com

LP2996

PCB Layout Considerations

1. The input capacitor for the power rail should be placed

as close as possible to the PVIN pin.

2. VSENSE should be connected to the VTT termination bus

at the point where regulation is required. For

motherboard applications an ideal location would be at

the center of the termination bus.

3. VDDQ can be connected remotely to the VDDQ rail input at

either the DIMM or the Chipset. This provides the most

accurate point for creating the reference voltage.

4. For improved thermal performance excessive top side

copper should be used to dissipate heat from the

package. Numerous vias from the ground connection to

the internal ground plane will help. Additionally these can

be located underneath the package if manufacturing

standards permit.

5. Care should be taken when routing the VSENSE trace to

avoid noise pickup from switching I/O signals. A 0.1uF

ceramic capacitor located close to the SENSE can also be

used to filter any unwanted high frequency signal. This

can be an issue especially if long SENSE traces are used.

6. VREF should be bypassed with a 0.01 µF or 0.1 µF

ceramic capacitor for improved performance. This

capacitor should be located as close as possible to the

VREF pin.

www.ti.com 16

LP2996

Physical Dimensions inches (millimeters) unless otherwise noted

8-Lead Small Outline Package (M8)

NS Package Number M08A

17 www.ti.com

LP2996

16-Lead LLP Package (LD)

NS Package Number LQA16A

8-Lead PSOP Package (PSOP-8)

NS Package Number MRA08A

www.ti.com 18

LP2996

Notes

19 www.ti.com

LP2996

Notes

LP2996 DDR Termination Regulator

www.ti.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP®Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265