08FKZ-SM1-1-TB(LF)(SN) - JST Germany

One world. One KEMET

Overview

KEMET Power Solutions (KPS) High Voltage stacked

capacitors utilize a proprietary lead-frame technology

to vertically stack one or two multilayer ceramic chip

capacitors into a single compact surface mount package.

The attached lead-frame mechanically isolates the

capacitor(s) from the printed circuit board, thereby offering

advanced mechanical and thermal stress performance.

Isolation also addresses concerns for audible microphonic

noise that may occur when a bias voltage is applied. A two-

chip stack offers up to double the capacitance in the same

or smaller design footprint when compared to traditional

surface mount MLCC devices. Providing up to 10 mm of

board ex capability, KPS Series High Voltage capacitors

are environmentally friendly and in compliance with RoHS

legislation.

KEMET’s KPS Series devices in X7R dielectric exhibit a

predictable change in capacitance with respect to time and

voltage, and boast a minimal change in capacitance with

reference to ambient temperature. Capacitance change is

limited to ±15% from −55°C to +125°C. These devices are

capable of Pb-Free reow proles and provide lower ESR,

ESL and higher ripple current capability when compared to

other dielectric solutions.

KPS Series Automotive Grade capacitors meet the demanding

Automotive Electronics Council's AEC–Q200 qualication

requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric,

500 – 630 VDC (Automotive Grade)

Ordering Information

C2220 C474 M C R 2 C AUTO

Ceramic

Case Size

(L" x W ")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance1

Rated

Voltage

(VDC)

Dielectric Failure Rate/

Design Leadframe Finish2Packaging/Grade

(C-Spec)

2220 C = Standard Two signicant

digits and

number of

zeros.

K = ±10%

M = ±20%

C = 500

B = 630

R = X7R 1 = KPS Single

Chip Stack

2 = KPS Double

Chip Stack

C = 100% Matte Sn See “Packaging

C-Spec Ordering

Options Table”

1 Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance.

Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.

2 Additional leadframe nish options may be available. Contact KEMET for details.

Benets

• AEC Q200 automotive qualied

• −55°C to +125°C operating temperature range

• Reliable and robust termination system

• EIA 2220 case size

• DC voltage ratings of 500 V and 630 V

• Capacitance offerings ranging from 0.047 μF up to 0.47 μF

• Available capacitance tolerances of ±10% and ±20%

• Higher capacitance in the same footprint

• Potential board space savings

• Advanced protection against thermal and mechanical stress

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging Type1Packaging/Grade

Ordering Code (C-Spec)2

7" Reel (Embossed Plastic Tape)/Unmarked

AUTO

13" Reel (Embossed Plastic Tape)/Unmarked

AUTO 7289

1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".

2 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

Benets cont'd

• Provides up to 10 mm of board ex capability

• Reduces audible microphonic noise

• Extremely low ESR and ESL

• Lead (Pb)-free, RoHS, and REACH compliant.

• Capable of Pb-free reow proles

• Non-polar device, minimizing installation concerns

• Film alternative

Applications

Typical applications include switch mode power supplies (input lters, resonators, tank circuits, snubber circuits, output

lters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling

capacitors in Ćuk converters. Markets include power supply, LCD uorescent backlight ballasts, HID lighting, telecom

equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive

(electric and hybrid vehicles, charging stations and lighting applications).

Application Note

X7R dielectric is not recommended for AC line ltering or pulse applications.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Quali cation for Passive

Components. These products are supported by a Product Change Noti cation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

component without the requirement to submit a customer Source Controlled Drawing (SCD) or speci cation for review by a

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are

not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited

(see details below.)

Product Change Noti cation (PCN)

The KEMET product change noti cation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form,  t, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

KEMET Automotive

C-Spec

Customer Noti cation Due To: Days Prior To

Implementation

Process/Product change Obsolescence*

KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum

AUTO Yes (without approval) Yes 90 days minimum

1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design records and speci cation requirements are properly

understood and ful lled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

KEMET Automotive

C-Spec

PPAP (Product Part Approval Process) Level

12345

KEMET assigned1●●●●●

AUTO ○ ○

1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.

● Part number speci c PPAP available

○ Product family PPAP only

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Qualication/Certication

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualication for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions.

Dimensions – Millimeters (Inches)

TOP VIEW PROFILE VIEW

Single or Double Chip Stack Double Chip Stack Single Chip Stack

LW LW

Number of

Chips

EIA Size

Code

Metric Size

Code

Length

Width

Height

Lead Width

Mounting

Technique

Single 2220 5650

6.00 (0.236)

±0.50 (0.020)

5.00 (0.197)

±0.50 (0.020)

3.50 (0.138)

±0.30 (0.012)

1.60 (0.063)

±0.30 (0.012) Solder Reow

Only

Double 2220 5650

6.00 (0.236)

±0.50 (0.020)

5.00 (0.197)

±0.50 (0.020)

5.00 (0.197)

±0.50 (0.020)

1.60 (0.063)

±0.30 (0.012)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range −55°C to +125°C

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC) ±15%

1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%

2Dielectric Withstanding Voltage (DWV) 150% of rated voltage for voltage rating of < 1000V

120% of rated voltage for voltage rating of ≥ 1000V

(5±1 seconds and charge/discharge not exceeding 50mA)

Dissipation Factor (DF) Maximum Limit at 25°C

2.5%

4Insulation Resistance (IR) Minimum Limit at 25°C

1,000 megohm microfarads or 100GΩ

(500 VDC applied for 120±5 seconds at 25°C)

1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

3 Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤ 10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance > 10µF

4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known

as Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dielectric Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Shift

Insulation

Resistance

X7R

> 25

All

3.0

±20% 10% of Initial

Limit

16/25

5.0

< 16

7.5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Table 1 – Capacitance Range/Selection Waterfall (2220 Case Sizes)

Capacitance Capacitance

Code

Case Size/Series C2220C

Voltage Code C B D

Rated Voltage (VDC) 500 630 1000

Capacitance

Tolerance

Product Availability and Chip Thickness

Codes – See Table 2 for Chip Thickness

Dimensions

Single Chip Stack

0.047 µF 473 K M JP JP

0.10 µF 104 K M JP JP

0.15 µF 154 K M JP JP

0.22 µF 224 K M JP JP

Double Chip Stack

0.10 µF 104 MJR JR

0.22 µF 224 MJR JR

0.33 µF 334 MJR JR

0.47 µF 474 MJR JR

Capacitance Capacitance

Code

Rated Voltage (VDC)

500

630

1000

Voltage Code

Case Size/Series C2220C

These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.

Table 2 – Chip Thickness/Tape & Reel Packaging Quantities

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity Plastic Quantity

7" Reel 13" Reel 7" Reel 13" Reel

JP 2220 3.50 ± 0.30 0 0 300 1,300

JR 2220 5.00 ± 0.50 0 0 200 800

Package quantity based on nished chip thickness specications.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Table 3 – KPS Land Pattern Design Recommendations (mm)

EIA SIZE

CODE

METRIC

SIZE

CODE

Median (Nominal) Land

Protrusion

2220 5650 2.69 2.08 4.78 7.70 6.00

Soldering Process

KEMET’s KPS Series devices are compatible with IR

reow techniques. Preheating of these components is

recommended to avoid extreme thermal stress. KEMET's

recommended prole conditions for IR reow reect the

prole conditions of the IPC/J–STD–020D standard for

moisture sensitivity testing.

To prevent degradation of temperature cycling capability,

care must be taken to prevent solder from owing into

the inner side of the lead frames (inner side of "J" lead in

contact with the circuit board).

After soldering, the capacitors should be air cooled to

room temperature before further processing. Forced air

cooling is not recommended.

Hand soldering should be performed with care due to the

diculty in process control. If performed, care should be

taken to avoid contact of the soldering iron to the capacitor

body. The iron should be used to heat the solder pad,

applying solder between the pad and the lead, until reow

occurs. Once reow occurs, the iron should be removed

immediately. (Preheating is required when hand soldering to

avoid thermal shock.)

Prole Feature SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

Smin

)100°C 150°C

Temperature Maximum (T

Smax)

150°C 200°C

Time (t

) from T

smin

to T

smax

) 60 – 120 seconds 60 – 120 seconds

Ramp-up Rate (T

to T

)3°C/seconds maximum 3°C/seconds maximum

Liquidous Temperature (T

)183°C 217°C

Time Above Liquidous (t

) 60 – 150 seconds 60 – 150 seconds

Peak Temperature (T

)235°C 250°C

Time within 5°C of Maximum

Peak Temperature (t

)20 seconds maximum 10 seconds maximum

Ramp-down Rate (T

to T

)6°C/seconds maximum 6°C/seconds maximum

Time 25°C to Peak

Temperature 6 minutes maximum 8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reow.

Time

Temperature

Tsmin

Tsmax

TPMaximum Ramp Up Rate = 3°C/second

Maximum Ramp Down Rate = 6°C/second

25°C to Peak

C C

X X V2

Grid Placement Courtyard

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Construction

Dielectric Material

(BaTiO3)

Detailed Cross Section

Barrier Layer

(Ni)

Inner Electrodes

(Ni)

Termination Finish

(Sn)

Barrier Layer

(Ni)

Termination Finish

(Sn)

Inner Electrodes

(Ni)

Dielectric Material

(BaTiO3)

Leadframe Attach

(High Melting Point Solder)

Leadframe

(Phosphor Bronze - Alloy 510)

End Termination/

External Electrode

(Cu)

End Termination/

External Electrode

(Cu)

Product Marking

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

Embossed Carrier

Embossment

Top Tape Thickness

0.10 mm (0.004”)

Maximum Thickness

12 mm (0.472”)

16 mm (0.629”) 180 mm (7.0”)

330 mm (13.0”)

Table 4 – Carrier Tape Con guration – Embossed Plastic (mm)

EIA Case Size Tape Size (W)* Pitch (P

01005 – 0402 8 2

0603 – 1210 8 4

1805 – 1808 12 4

≥ 1812 12 8

KPS 1210 12 8

KPS 1812 & 2220 16 12

Array 0508 & 0612 8 4

*Refer to Figure 1 for W and P1 carrier tape reference locations.

*Refer to Table 5 for tolerance speci cations.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

Center Lines of Cavity

User Direction of Unreeling

Cover Tape

is for tape feeder reference only,

including draft concentric about B

ØD

Embossment

For cavity size,

see Note 1 Table 4

(10 pitches cumulative

tolerance on tape ±0.2 mm)

Table 5 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0

Minimum

Note 1

E1P0P2

R Reference

Note 2

Minimum

Note 3

Maximum

Maximim

8 mm

1.5+0.10/0.0−0.0

(0.059+0.004/−0.0)

1.0

(0.039)

1.75±0.10

(0.069±0.004) 4.0±0.10

(0.157±0.004) 2.0±0.05

(0.079±0.002)

25.0

(0.984)

0.600

(0.024) 0.600

(0.024) 0.100

(0.004)

12 mm 1.5

(0.059) 30

(1.181)

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch

Maximum

Note 4

E2 Minimum F P1

Maximum

A0, B0 & K0

8 mm Single (4 mm)

4.35

(0.171)

6.25

(0.246)

3.5±0.05

(0.138±0.002)

4.0±0.10

(0.157±0.004)

2.5

(0.098)

8.3

(0.327)

Note 512 mm

Single (4 mm) &

Double (8 mm)

8.2

(0.323)

10.25

(0.404)

5.5±0.05

(0.217±0.002)

8.0±0.10

(0.315±0.004)

4.6

(0.181)

12.3

(0.484)

16 mm Triple (12 mm)

12.1

(0.476)

14.25

(0.561)

7.5±0.05

(0.138±0.002)

12.0±0.10

(0.157±0.004)

4.6

(0.181)

16.3

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 5).

3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity de ned by A0, B0 and K0 shall surround the component with suﬃ cient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 3).

(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Maximum Component Rotation

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape Maximum

Width (mm) Rotation (°

8,12 20

16 – 200 10 Tape Maximum

Width (mm) Rotation ( °

8,12 20

16 – 56 10

72 – 200 5

Typical Pocket Centerline

Typical Component Centerline

Figure 3 – Maximum Lateral Movement

0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum

16 mm Tape

Figure 4 – Bending Radius

Bending

Radius

Embossed

Carrier

Punched

Carrier

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Figure 5 – Reel Dimensions

AD(See Note)

Full Radius,

See Note

B(see Note)

Access Hole at

Slot Location

(Ø 40 mm minimum)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

W3(Includes

flange distortion

at outer edge)

W2(Measured at hub)

W1(Measured at hub)

(Arbor hole

diameter)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 6 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size A B Minimum CD Minimum

8 mm 178±0.20

(7.008±0.008)

330±0.20

(13.000±0.008)

1.5

(0.059) 13.0+0.5/−0.2

(0.521+0.02/−0.008) 20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size N Minimum W1 W2 Maximum W3

8 mm

(1.969)

8.4+1.5/−0.0

(0.331+0.059/−0.0)

14.4

(0.567)

Shall accommodate tape

width without interference

12 mm

12.4+2.0/−0.0

(0.488+0.078/−0.0)

18.4

(0.724)

16 mm

16.4+2.0/−0.0

(0.646+0.078/−0.0)

22.4

(0.882)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

Figure 6 – Tape Leader & Trailer Dimensions

Trailer

160 mm minimum

Carrier Tape

END START

Round Sprocket Holes

Elongated Sprocket Holes

(32 mm tape and wider)

Top Cover Tape

Punched Carrier

8 mm & 12 mm only

Embossed Carrier

Components

100 mm

minimum leader

400 mm minimum

Figure 7 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Elongated Sprocket Holes

(32 mm & wider tapes)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, High Voltage, X7R Dielectric, 500 VDC – 630 VDC (Automotive Grade)

KEMET Electronics Corporation Sales Oﬃ ces

For a complete list of our global sales o ces, please visit www.kemet.com/sales.

Disclaimer

All product speci cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speci cally disclaims – any warranty concerning suitability for a speci c customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.