LM49101
LM49101 Mono Class AB Audio Subsystem with a True Ground Headphone
Amplifierand Earpiece Switch
Literature Number: SNAS475
LM49101 March 23, 2009
Mono Class AB Audio Subsystem with a True Ground
Headphone Amplifier and Earpiece Switch
General Description
The LM49101 is a fully integrated audio subsystem with a
mono power amplifier capable of delivering 540mW of con-
tinuous average power into an 8 BTL speaker load with 1%
THD+N using a 3.3V supply. The LM49101 includes a sepa-
rate stereo headphone amplifier that can deliver 44mW per
channel into 32 loads using a 2.75V supply.
The LM49101 has four input channels. A pair of single-ended
inputs and a fully differential input channel with volume control
and amplification stages. Additionally, a bypass differential
input is available that connects directly to the mono speaker
outputs through an analog switch without any amplification or
volume control stages. The LM49101 features a 32–step dig-
ital volume control on the input stage and an 8–step digital
volume control on the headphone output stage.
The digital volume control and output modes, programmed
through a two-wire I2C compatible interface, allows flexibility
in routing and mixing audio channels.
The LM49101 is designed for cellular phones, PDAs, and
other portable handheld applications. The high level of inte-
gration minimizes external components. The True Ground
headphone amplifier eliminates the physically large DC block-
ing output capacitors reducing required board space and
reducing cost.
Key Specifications
■ Supply Voltage (VDDLS) 2.7V VDDLS 5.5V
■ Supply Voltage (VDDHP) 1.8V VDDHP 2.9V
■ I2C Supply Voltage 1.7V I2CVDD 5.5V
■ Output power
  VDDLS = 5V, VDDHP = 2.75V
   1% THD+N
RL = 8Ω speaker 1.3W (typ)
RL = 32Ω headphone 45mW (typ)
■ Output Power
  VDDLS = 3.3V, VDDHP = 2.75V
  1% THD+N
RL = 8Ω speaker 540W (typ)
RL = 32Ω headphone 40mW (typ)
■ PSRR:
  VDD = 3.3V, 217Hz ripple, Mono In 90dB (typ)
■ Shutdown power supply current 0.01μA (typ)
Features
Differential mono input and stereo single-ended input
Separate earpiece (receiver) differential input
Analog switch for a separate earpiece path
32-step digital volume control (-80 to +18dB)
Three independent volume channels (Left, Right, Mono)
Separate headphone volume control
Flexible output for speaker and headphone output
True Ground headphone amplifier eliminates large DC
blocking capacitors reducing PCB space and cost.
Hardware reset function
RF immunity topology
Click and Pop” suppression circuitry
Thermal shutdown protection
Micro-power shutdown
I2C control interface
Available in space-saving microSMD package
Applications
Portable electronic devices
Mobile Phones
PDAs
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2009 National Semiconductor Corporation 300862 www.national.com
LM49101Mono Class AB Audio Subsystem with a True Ground Headphone Amplifier and
Earpiece Switch
Typical Application
30086203
FIGURE 1. Typical Audio Application Circuit
www.national.com 2
LM49101
Connection Diagrams
25 Bump micro SMD Package
30086202
Top View
(Bump Side Down)
Order Number LM49101TM, LM49101TMX
See NS Package Number TMD25BCA
micro SMD Markings
30086204
Top View
XY - Date Code
TT - Die Traceability
G- Boomer Family
L4 - LM49101TM
Ordering Information
Order
Number
Package Package DWG
#
Transport Media MSL Level Green Status Features
LM49101TM 25 Bump micro
SMD TMD25BCA 250 units on tape and reel 1 RoHS and no Sb/Br
LM49101TMX 25 Bump micro
SMD TMD25BCA 3000 units on tape and reel 1 RoHS and no Sb/Br
3 www.national.com
LM49101
Bump Descriptions
Bump Name Pin Function Type
A1 CPGND Charge pump ground terminal Ground
A2 VSSCP Negative charge pump power supply Power Output
A3 HPR Right headphone output Analog Output
A4 VDDHP Headphone amplifier power supply Power Input
A5 MIN+ Positive input pin for the mono, differential input Analog Input
B1 C1N Negative terminal of the charge pump flying capacitor Analog Output
B2 C1P Positive terminal of the charge pump flying capacitor Analog Output
B3 HPL Left headphone output Analog Output
B4 HPGND Headphone signal ground Ground
B5 MIN- Negative input pin for the mono, differential input Analog Input
C1 VDDCP Charge pump power supply Power Input
C2 SDA I2C data Digital Input
C3 GND Ground Ground
C4 RIN Single-ended input for the right channel Analog Input
C5 LIN Single-ended input for the left channel Analog Input
D1 BYPASS_IN- Earpiece negative input, bypass volume control and amplifier Analog Input
D2 I2CVDD I2C power supply Power Input
D3 SCL I2C clock Digital Input
D4 HW RESET
Hardware reset function, active low. When pin is low (<0.6V) the
LM49101 goes into shutdown mode and will remain in shutdown
mode until pin goes to logic high (>1.6V) and is activated by I2C
control. When reset all registers are set to the default value of 0.
Digital Input
D5 BYPASS_IN+ Earpiece positive input, bypass volume control and amplifier Analog Input
E1 MONO+ Positive loudspeaker output Analog Output
E2 VDDLS Main power supply Power Input
E3 GND Ground Ground
E4 MONO- Negative loudspeaker output Analog Output
E5 BIAS Half-supply bias, capacitor bypassed Analog Output
www.national.com 4
LM49101
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Loudspeaker,
VDDLS) 6.0V
Supply Voltage (Headphone, VDDHP) 3.0V
Storage Temperature −65°C to +150°C
Voltage at Any Input Pin GND − 0.3 to VDD LS + 0.3
Power Dissipation (Note 3) Internally Limited
ESD Rating (Note 4) 2000V
ESD Rating (Note 5) 200V
Junction Temperature (TJMAX)150°C
Soldering Information
Vapor Phase (60sec.) 215°C
Infrared (15sec.) 220°C
See AN-1112 “Micro SMD Wafer Level Chip Scale
Package”
Thermal Resistance
 θJA (Note 8) 51°C/W
Operating Ratings
Temperature Range
TMIN TA TMAX −40°C TA 85°C
Supply Voltage (VDDLS) 2.7V VDDLS 5.5V
Supply Voltage (VDDHP) 1.8V VDDHP 2.9V
VDDHP VDDLS
Supply Voltage (VDDCP) VDDCP = VDD HP
Supply Voltage (I2CVDD)1.7V I2CVDD 5.5V
I2CVDD VDDLS
Electrical Characteristics VDDLS = 3.3V, VDDHP = 2.75V (Notes 1, 2)
The following specifications apply for VDDLS = 3.3V, VDDHP = 2.75V, TA = 25°C, all volume controls set to 0dB, unless otherwise
specified. LS = Loudspeaker, HP = Headphone, EP = Earpiece.
Symbol Parameter Conditions
LM49101 Units
(Limits)
Typical
(Note 6)
Limits
(Note 7)
IDD Quiescent Power Supply Current
VIN = 0, No Load
EP Receiver
(Output Mode Bit EP Bypass = 1) 0.03 0.045 mA (max)
LS only (Mode 1), GAMP_SD = 0
VDDLS
VDDHP
2.5
0
4.2 mA (max)
mA
LS only (Mode 1), GAMP_SD = 1
VDDLS
VDDHP
2
0
mA
mA
HP only (Mode 8), GAMP_SD = 0
VDDLS
VDDHP
VDDLS +VDDHP
1.6
3.1
2.0
4.5
6.45
mA (max)
mA (max)
mA (max)
HP only (Mode 8), GAMP_SD = 1
VDDLS
VDDHP
2.8
3.3
mA
mA
LS+HP (Mode 10), GAMP_SD = 0
VDDLS
VDDHP
VDDLS +VDDHP
2.8
3.1
3.8
4.5
8
mA (max)
mA (max)
mA (max)
ISD Shutdown Current Power_On = 0 0.01 2 µA (max)
VOS Output Offset Voltage
VIN = 0V, Mode 10
LS output, RL = 8Ω BTL
HP output, RL = 32Ω SE
2.5
0.5
22
5
mV (max)
mV (max)
POOutput Power
LS output, Mode 1, RL = 8Ω BTL
THD+N = 1%, f = 1kHz, LS_Gain = 6dB 540 480 mW (min)
HP output, Mode 8, RL = 32Ω SE
THD+N = 1%, f = 1kHz 44 40 mW (min)
5 www.national.com
LM49101
Symbol Parameter Conditions
LM49101 Units
(Limits)
Typical
(Note 6)
Limits
(Note 7)
THD+N Total Harmonic Distortion + Noise
LS output, f = 1kHz, RL = 8Ω BTL
PO = 250mW, Mode 1, LS_Gain = 6dB 0.065 %
HP output, f = 1kHz, RL = 32Ω SE
PO = 20mW, Mode 8 0.015 %
SNR Signal-to-Noise Ratio
LS output, f = 1kHz, Mode 1
VREF = VOUT (1%THD+N)
Vol. Gain & LS_GAIN = 0dB
A-Wtg, LIN & RIN AC terminated
105 dB
HP output, f = 1kHz, Mode 8
VREF = VOUT (1%THD+N)
Vol. Gain = 0dB, A-weighted
LIN & RIN AC terminated
100 dB
PSRR Power Supply Rejection Ratio
VRIPPLE on VDDLS = 200mVPP, fRIPPLE = 217Hz, CB = 2.2μF
All inputs AC terminated to GND, output referred
LS: Mode 1, 5, 9, 13, RL = 8Ω BTL 90 dB (max)
LS: Mode 2, 6, 10 ,14, RL = 8Ω BTL 75 dB (max)
HP: Mode 4, 5, 6, 7, RL = 32Ω SE 85 dB (max)
HP: Mode 8, 9, 10, 11, RL = 32Ω SE 81 dB (max)
CMRR Common-Mode Rejection Ratio
f = 217Hz, VCM = 1VP-P
LS: RL = 8Ω BTL, Mode 1
HP: RL = 32Ω SE, Mode 4
60
60
dB
dB
XTALK Crosstalk HP PO = 20mW
f = 1kHz, Mode 8 72 dB
ZIN MIN, LIN, and RIN Input Impedance
Maximum Gain setting 12.5 10
15
KΩ (min)
KΩ (max)
Maximum Attenuation setting 110 90
130
KΩ (min)
KΩ (max)
RON On Resistance Analog Switch On 3.4
VOL Digital Volume Control Range Maximum Gain
Maximum Attenuation
18
–80 dB
dB
VOL Volume Control Step Size Error ±0.02 dB
TWU Wake-Up Time from Shutdown CB = 2.2μF, HP, Normal Turn-On Mode 30 ms
CB = 2.2μF, HP, Fast Turn-On Mode 15 ms
www.national.com 6
LM49101
Electrical Characteristics VDDLS = 5.0V, VDDHP = 2.75V (Notes 1, 2)
The following specifications apply for VDDLS = 5.0V, VDDHP = 2.75V, TA = 25°C, all volume controls set to 0dB, unless otherwise
specified. LS = Loudspeaker, HP = Headphone, EP = Earpiece.
Symbol Parameter Conditions
LM49101 Units
(Limits)
Typical
(Note 6)
Limits
(Note 7)
IDD Quiescent Power Supply Current
VIN = 0, No Load
EP Receiver
(Output Mode Bit EP Bypass = 1) 0.05 0.07 mA (max)
LS only (Mode 1), GAMP_SD = 0
VDDLS
VDDHP
2.9
0
4.4 mA (max)
mA
LS only (Mode 1), GAMP_SD = 1
VDDLS
VDDHP
2.1
0
mA
mA
HP only (Mode 8), GAMP_SD = 0
VDDLS
VDDHP
VDDLS+VDDHP
1.8
3.1
2.15
4.5
6.6
mA (max)
mA (max)
mA (max)
HP only (Mode 8), GAMP_SD = 1
VDDLS
VDDHP
1.3
3.1
mA
mA
LS+HP only (Mode 10), GAMP_SD = 0
VDDLS
VDDHP
VDDLS+VDDHP
3
3.1
4.1
4.5
8.35
mA (max)
mA (max)
mA (max)
ISD Shutdown Current Power_On = 0 0.01 2 µA (max)
VOS Output Offset Voltage
VIN = 0V, Mode 10
LS output, RL = 8Ω BTL
HP output, RL = 32Ω SE
2.5
0.5
22
5
mV (max)
mV (max)
POOutput Power
LS output, Mode 1, RL = 8Ω BTL
THD+N = 1%, f = 1kHz, LS_Gain = 6dB 1.3 W
HP output, Mode 8, RL = 32Ω SE
THD+N = 1%, f = 1kHz 45 mW
THD+N Total Harmonic Distortion + Noise
LS output, f = 1kHz, RL = 8Ω BTL
PO = 600mW, Mode 1, LS_Gain = 6dB 0.055 %
HP output, f = 1kHz, RL = 32Ω SE
PO = 20mW, Mode 8 0.015 %
SNR Signal-to-Noise Ratio
LS output, f = 1kHz, Mode 1
VREF = VOUT (1%THD+N)
Vol. Gain & LS_GAIN = 0dB
A-Wtg, LIN & RIN AC terminated
108 dB
HP output, f = 1kHz, Mode 8
VREF = VOUT (1%THD+N)
Vol. Gain = 0dB, A-weighted
LIN & RIN AC terminated
100 dB
PSRR Power Supply Rejection Ratio
VRIPPLE on VDDLS = 200mVPP, fRIPPLE = 217Hz, CB = 2.2μF
All inputs AC terminated to GND, output referred
LS: Mode 1, 5, 9, 13, RL = 8Ω BTL 90 dB
LS: Mode 2, 6, 10, 14, RL = 8Ω BTL 74 dB
HP: Mode 4, 5, 6, 7, RL = 32Ω SE 84 dB
HP: Mode 8, 9, 10, 11, RL = 32Ω SE 79 dB
7 www.national.com
LM49101
Symbol Parameter Conditions
LM49101 Units
(Limits)
Typical
(Note 6)
Limits
(Note 7)
CMRR Common-Mode Rejection Ratio
f = 217Hz, VCM = 1VP-P
LS: RL = 8Ω BTL, Mode 1
HP: RL = 32Ω SE, Mode 4
60
60
dB
dB
XTALK Crosstalk HP PO = 20mW
f = 1kHz, Mode 8 72 dB
ZIN MIN, LIN, and RIN Input Impedance
Maximum Gain setting 12.5 10
15
KΩ (min)
KΩ (max)
Maximum Attenuation setting 110 90
130
KΩ (min)
KΩ (max)
RON On Resistance Analog Switch On 2
VOL Digital Volume Control Range Maximum Gain
Maximum Attenuation
18
–80 dB
dB
VOL Volume Control Step Size Error ±0.02 dB
TWU Wake-Up Time from Shutdown CB = 2.2μF, HP, Normal Turn-On Mode 30 ms
CB = 2.2μF, HP, Fast Turn-On Mode 15 ms
www.national.com 8
LM49101
I2C Interface 2.2V I2C_VDD 5.5V, (Notes 1, 2)
The following specifications apply for VDDLS = 5.0V and 3.3V, 2.2V I2C_VDD 5.5V, TA = 25°C, unless otherwise specified.
Symbol Parameter Conditions
LM49101 Units
(Limits)
Typical
(Note 4)
Limits
(Notes 7, 9)
t1I2C Clock Period 2.5 µs (min)
t2I2C Data Setup Time 100 ns (min)
t3I2C Data Stable Time 0 ns (min)
t4Start Condition Time 100 ns (min)
t5Stop Condition Time 100 ns (min)
t6I2C Data Hold Time 100 ns (min)
VIH I2C Input Voltage High 0.7xI2CVDD V (min)
VIL I2C Input Voltage Low 0.3xI2CVDD V (max)
I2C Interface 1.7V I2C_VDD 2.2V, (Notes 1, 2)
The following specifications apply for VDDLS = 5.0V and 3.3V, TA = 25°C, 1.7V I2C_VDD 2.2V, unless otherwise specified.
Symbol Parameter Conditions
LM49101 Units
(Limits)
Typical
(Note 6)
Limits
(Notes 7, 9)
t1I2C Clock Period 2.5 µs (min)
t2I2C Data Setup Time 250 ns (min)
t3I2C Data Stable Time 0 ns (min)
t4Start Condition Time 250 ns (min)
t5Stop Condition Time 250 ns (min)
t6I2C Data Hold Time 250 ns (min)
VIH I2C Input Voltage High 0.7xI2CVDD V (min)
VIL I2C Input Voltage Low 0.3xI2CVDD V (max)
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified
Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature, TA. The maximum
allowable power dissipation is PDMAX = (TJMAX - TA) / θJA or the number given in Absolute Maximum Ratings, whichever
Note 4: Human body model, applicable std. JESD22-A114C.
Note 5: Machine model, applicable std. JESD22-A115-A.
Note 6: Typical values represent most likely parametric norms at TA = +25°C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed.
Note 7: Datasheet min/max specification limits are guaranteed by test or statistical analysis.
Note 8: The given θJA is for an LM49101 mounted on a demonstration board.
Note 9: Refer to the I2C timing diagram, Figure 2.
9 www.national.com
LM49101
Typical Performance Characteristics
THD+N vs Frequency
VDDLS = 3.3V, RL = 8Ω BTL, PO = 250mW
Mode 1 (Mono), 80kHz BW
30086219
THD+N vs Frequency
VDDLS = 3.3V, RL = 8Ω BTL, PO = 250mW
Mode 2 (Left + Right), 80kHz BW
30086220
THD+N vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, RL = 32Ω SE,
PO = 5mW/Ch, Mode 4 (Mono), 80kHz BW
30086221
THD+N vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, RL = 32Ω SE,
PO = 5mW/Ch, Mode 8 (Left/Right ), 80kHz BW
30086222
THD+N vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, RL = 8Ω BTL, RL = 32Ω SE,
PO = 250mW BTL, PO = 5mW/Ch SE, Mode 5 (Mono)
LS (EP Mode) = 0, 80kHz BW
30086226
THD+N vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, RL = 8Ω BTL, RL = 32Ω SE,
PO = 250mW BTL, PO = 5mW/Ch SE, Mode 10 (L/R)
LS (EP Mode) = 0, 80kHz BW
30086229
www.national.com 10
LM49101
THD+N vs Frequency
VDDLS = 5V, RL = 8Ω BTL, PO = 600mW,
Mode 1 (Mono), 80kHz BW
30086223
THD+N vs Frequency
VDDLS = 5V, RL = 8Ω BTL, PO = 600mW,
Mode 2 (Let + Right), 80kHz BW
30086224
THD+N vs Frequency
VDDLS = 5V, VDDHP = 2.75V, RL = 32Ω SE,
PO = 20mW/Ch, Mode 4 (Mono), 80kHz BW
30086225
THD+N vs Frequency
VDDLS = 5V, VDDHP = 2.75V, RL = 32Ω SE,
PO = 20mW/Ch, Mode 8 (Left/Right), 80kHz BW
30086228
THD+N vs Frequency
VDDLS = 5V, VDDHP = 2.75V, RL = 8Ω BTL, RL = 32Ω SE,
PO = 600mW BTL, PO = 20mW/Ch SE, Mode 5 (Mono)
LS (EP Mode) = 0, 80kHz BW
30086227
THD+N vs Frequency
VDDLS = 5V, VDDHP = 2.75V, RL = 8Ω BTL, RL = 32Ω SE,
PO = 600mW BTL, PO = 20mW/Ch SE, Mode 10 (L/R)
LS (EP Mode) = 0, 80kHz BW
30086230
11 www.national.com
LM49101
THD+N vs Output Power
VDDLS = 3.3V & 5V, f = 1kHz, RL = 8Ω BTL
Mode 1 (Mono), 80kHz BW
30086243
THD+N vs Output Power
VDDLS = 3.3V & 5V, f = 1kHz, RL = 8Ω BTL
Mode 2 (Left + Right), 80kHz BW
30086244
THD+N vs Output Power
VDDLS = 3.3V, VDDHP = 1.8V & 2.75V, f = 1kHz,
RL = 32Ω SE, Mode 4 (Mono), 80kHz BW
30086245
THD+N vs Output Power
VDDLS = 3.3V, VDDHP = 1.8V & 2.75V, f = 1kHz,
RL = 32Ω SE, Mode 8 (Left/Right), 80kHz BW
30086246
THD+N vs Output Power
VDDLS = 3.3V & 5V, VDDHP = 2.75V, f = 1kHz,
RL = 8Ω BTL, Mode 5 (Mono), 80kHz BW
30086242
THD+N vs Output Power
VDDLS = 3.3V, VDDHP = 1.8V & 2.75V, f = 1kHz,
RL = 32Ω SE, Mode 10 (Left/Right), 80kHz BW
30086247
www.national.com 12
LM49101
PSRR vs Frequency
VDDLS = 3.3V, VRIPPLELS = 200mVPP, RL = 8Ω BTL,
Mode 1 (Mono), 80kHz BW
30086211
PSRR vs Frequency
VDDLS = 3.3V, VRIPPLELS = 200mVPP, RL = 8Ω BTL,
Mode 2 (Left + Right), 80kHz BW
30086213
PSRR vs Frequency
VDDLS = 5V, VRIPPLELS = 200mVPP, RL = 8Ω BTL,
Mode 1 (Mono), 80kHz BW
30086212
PSRR vs Frequency
VDDLS = 5V, VRIPPLELS = 200mVPP, RL = 8Ω BTL,
Mode 2 (Left + Right), 80kHz BW
30086214
PSRR vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, VRIPPLEHP = 200mVPP,
RL = 32Ω SE, Mode 4 (Mono), 80kHz BW
30086215
PSRR vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, VRIPPLEHP = 200mVPP,
RL = 32Ω SE, Mode 8 (Left/Right), 80kHz BW
30086217
13 www.national.com
LM49101
PSRR vs Frequency
VDDLS = 3.3V, VDDHP = 2.75V, VRIPPLEHP = 200mVPP,
RL = 32Ω SE, Mode 4 (Mono), 80kHz BW
30086248
PSRR vs Frequency
VDDLS = 3.3V, VDDHP = 2.75V, VRIPPLEHP = 200mVPP,
RL = 32Ω SE, Mode 8 (Left/Right), 80kHz BW
30086249
Power Dissipation vs Output Power
VDDLS = 3.3V & 5V, VDDHP = 2.75V, RL = 8Ω BTL,
Mode 3 (Mono + Left + Right), 80kHz BW
30086235
Power Dissipation vs Output Power
VDDLS = 5V, VDDHP = 1.8V & 2.75V, RL = 32Ω SE,
Mode 12 (Mono + Left/ Right), 80kHz BW
30086236
Crosstalk vs Frequency
VDDLS = 3.3V, VDDHP = 1.8V, VIN = 1VPP,
RL = 32Ω SE, Mode 8 (Left/Right), 80kHz BW
30086231
Crosstalk vs Frequency
VDDLS = 3.3V, VDDHP = 2.75V, VIN = 1VPP,
RL = 32Ω SE, Mode 8 (Left/Right), 80kHz BW
30086232
www.national.com 14
LM49101
Supply Current vs Supply Voltage (VDDLS)
VDDHP = 2.75V, No Load, Gain_SD = 0 & 1
LS (EP_Mode) = 0 & 1, Mode 1
30086237
Supply Current vs Supply Voltage (VDDLS)
VDDHP = 2.75V, No Load, Gain_SD = 0 & 1
LS (EP_Mode) = 0 & 1, Mode 2
30086239
Supply Current vs Supply Voltage (VDDHP)
VDDLS = 3.3V, No Load, Gain_SD = 0 or 1
HPR_SD = 0 & 1, Modes 4, 8, 15
30086238
Supply Current vs Supply Voltage (VDDLS)
VDDHP = 2.75V, No Load, Gain_SD = 0 or 1
LS (EP_Mode) = 0 & 1, Mode 15
30086240
Output Power vs Supply Voltage (VDDLS)
VDDHP = 2.75V, RL = 8Ω BTL,
Mode 1
30086234
Output Power vs Supply Voltage (VDDHP)
VDDLS = 3.3V, RL = 32Ω SE,
Mode 4
30086233
15 www.national.com
LM49101
Application Information
I2C COMPATIBLE INTERFACE
The LM49101 is controlled through an I2C compatible serial
interface that consists of a serial data line (SDA) and a serial
clock (SCL). The clock line is uni-directional. The data line is
bi-directional (open drain). The LM49101 and the master can
communicate at clock rates up to 400kHz. Figure 2 shows the
I2C interface timing diagram. Data on the SDA line must be
stable during the HIGH period of SCL. The LM49101 is a
transmit/receive slave-only device, reliant upon the master to
generate the SCL signal. Each transmission sequence is
framed by a START condition and a STOP condition (Figure
3). Each data word, device address and data, transmitted
over the bus is 8 bits long and is always followed by an ac-
knowledge pulse (Figure 4). The LM49101 device address is
11111000.
I2C INTERFACE POWER SUPPLY PIN (I2CVDD)
The LM49101's I2C interface is powered up through the
I2CVDD pin. The LM49101's I2C interface operates at a volt-
age level set by the I2CVDD pin which can be set independent
to that of the main power supply pin VDDLS. This is ideal
whenever logic levels for the I2C interface are dictated by a
microcontroller or microprocessor that is operating at a lower
supply voltage than the VDDLS voltage.
I2C BUS FORMAT
The I2C bus format is shown in Figure 4. The START signal,
the transition of SDA from HIGH to LOW while SCL is HIGH,
is generated, alerting all devices on the bus that a device ad-
dress is being written to the bus.
The 7-bit device address is written to the bus, most significant
bit (MSB) first, followed by the R/W bit. R/W = 0 indicates the
master is writing to the slave device, R/W = 1 indicates the
master wants to read data from the slave device. Set R/W =
0; the LM49101 is a WRITE-ONLY device and will not re-
spond to the R/W = 1. The data is latched in on the rising edge
of the clock. Each address bit must be stable while SCL is
HIGH. After the last address bit is transmitted, the master de-
vice releases SDA, during which time, an acknowledge clock
pulse is generated by the slave device. If the LM49101 re-
ceives the correct address, the device pulls the SDA line low,
generating an acknowledge bit (ACK).
Once the master device registers the ACK bit, the 8-bit reg-
ister data word is sent. Each data bit should be stable while
SCL is HIGH. After the 8-bit register data word is sent, the
LM49101 sends another ACK bit. Following the acknowl-
edgement of the register data word, the master issues a
STOP bit, allowing SDA to go high while SCL is high.
300862s0
FIGURE 2. I2C Timing Diagram
300862s1
FIGURE 3. Start and Stop Diagram
www.national.com 16
LM49101
300862s2
FIGURE 4. Start and Stop Diagram
TABLE 1. Chip Address
A7 A6 A5 A4 A3 A2 A1 A0
Chip
Address 1 1 1 1 1 0 0 0
TABLE 2. Control Registers
Register D7 D6 D5 D4 D3 D2 D1 D0
General Control 0 0 1 GAMP_SD (1) LS
(EP_Mode) (2) 0Turn_On
_Time (3) Power_On (4)
Output Mode Control 0 1 EP
Bypass (5) HPR_SD (6) Mode_ Control (7)
Output Gain Control 1 0 0 Input_Mute (8) LS_Gain (9) HP_Gain (10)
Mono Input Volume
Control 1 0 1 Mono_Vol (11)
Left Input Volume
Control 1 1 0 Left_Vol (11)
Right Input Volume
Control 1 1 1 Right_Vol (11)
Notes: All registers default to 0 on initial power-up.
1. GAMP_SD: Is used to shut down gain amplifiers not in use
and reduce current consumption. See Table 3.
2. LS (EP_Mode): Loudspeaker power amplifier bias current
reduction. See Table 3.
3. Turn_On_Time: Reduces the turn on time for faster acti-
vation. See Table 3.
4. Power_On: Master Power on bit. See Table 3.
5. EP Bypass: Earpiece bypass mode to allow BYPASS in-
puts to drive speaker outputs. See Table 4
6. HPR_SD: Will shutdown one channel of the headphone
amplifier. See Table 4.
7. Mode_Control: Sets the output mode. See Table 4.
8. Input Mute: Controls muting of the inputs except the BY-
PASS inputs. See Table 5.
9. LS_Gain: Sets the gain of the loudspeaker amplifier to 0dB
or 6dB. See Table 5.
10. HP_Gain: Sets the headphone amplifier output gain. See
Table 5.
11. Mono_Vol/Left_Vol/Right_Vol: Sets the input volume for
Mono, Left and Right inputs. See Table 6.
17 www.national.com
LM49101
TABLE 3. General Control Register
Bit Name Value Description
0 Power_On
This bit is a master shutdown control bit and sets the device to be on or off.
Value Status
0 Master power off, device disable.
1 Master power on, device enable.
1 Turn_On_Time
This bit sets the turn on time of the device.
Value Status
0 Normal Turn-on time
1 Fast Turn-on time
3 LS (EP Mode)
This bit enables EP Mode reducing loudspeaker output stage bias current by 500μA.
Value Status
0 Normal loudspeaker power amplifier operation.
1Enables EP Mode reducing loudspeaker output stage bias current
by 500μA.
4 GAMP_SD
This bit is used to reduce IDD by shutting down gain amplifiers not in use.
0 Normal operation of all gain amplifiers.
1
Disables the input gain amplifiers that are not in use to reduce
current from VDDLS. Recommended for Output Modes 1, 2, 4, 5,
8, 10.
www.national.com 18
LM49101
TABLE 4. Output Mode Control Register (see key below table)
Bits Field Description
3:0 Mode_Control These bits determine how the input signals are mixed and routed to the outputs.
D3 D2 D1 D0
Headphone Loudspeaker
D3D2D1D0Mode Left
Headphone
Right
Headphone
0000 0 SD SD SD
0001 1 SD SD GM x M
0010 2 SD SD 2 x (GL x L + GR x R)
0011 3 SD SD 2 x (GL x L + GR x R)
+ GM x M
0100 4GM x M/2 GM x M/2 SD
0101 5 GM x M/2 GM x M/2 GM x M
0110 6 GM x M/2 GM x M/2 2 x (GL x L + GR x R)
0111 7 GM x M/2 GM x M/2 2 x (GL x L + GR x R)
+ GM x M
1000 8GL x L GR x R SD
1001 9 GL x L GR x R GM x M
1010 10 GL x L GR x R 2 x (GL x L + GR x R)
1011 11 GL x L GR x R 2 x (GL x L + GR x R)
+ GM x M
1100 12 GL x L + GM x
M/2
GR x R + GM x
M/2 SD
1101 13 GL x L + GM x
M/2
GR x R + GM x
M/2 GM x M
1110 14 GL x L + GM x
M/2
GR x R + GM x
M/2 2 x (GL x L + GR x R)
1111 15 GL x L + GM x
M/2
GR x R + GM x
M/2
2 x (GL x L + GR x R)
+ GM x M
4 HPR_SD
This bit sets the headphone amplifiers to normal mode or mono mode.
Value Status
0 Normal stereo headphone operation.
1 Disable right headphone output.
5 EP Bypass
This bit is used to control the analog switch to have the BYPASS inputs drive the loudspeaker outputs.
Value Status
0 Normal output mode operation with analog switch off.
1Loudspeaker and headphone amplifiers go into shutdown mode and Bypass (Receiver) path
enable with the analog switch on.
M : MIN, Mono differential input
L : LIN, Left single-ended input
R : RIN, Right single-ended input
SD : Shutdown
GM : Mono_Vol setting determined by the Mono Input Volume Control register, See Table 6.
GL : Left_Vol setting determined by the Left Input Volume Control register, See Table 6.
GR : Right_Vol setting determined by the Right Input Volume Control register, See Table 6.
19 www.national.com
LM49101
TABLE 5. Output Gain Control Register
Bits Field Description
2:0 HP_GAIN
These bits set the gain of the headphone output amplifiers.
Value Gain (dB)
000 0
001 –1.2
010 –2.5
011 –4.0
100 –6.0
101 –8.5
110 –12
111 –18
3 LS_GAIN
This bit sets the loudspeaker output amplifier gain.
Value Status
0 Loudspeaker output amplifier gain is set to 0dB.
1 Loudspeaker output amplifier gain is set to 6dB.
4 INPUT MUTE
This bit will set all the inputs except the BYPASS inputs to be in Mute mode.
Value Status
0 Normal operation of all inputs.
1
Mutes all inputs except BYPASS with over 80dB of attenuation
with out adjusting the volume settings. This bit can be used to
mute the inputs to eliminate noise or transients from other
systems and ICs. See the section Input Mute Bit in the
Application Information section for a detailed explanation.
www.national.com 20
LM49101
TABLE 6. Input Volume Control Registers
Bits Fields Description
4:0 Mono_Vol
Right_Vol
Left_Vol
These bits set the input volume for each input volume register listed.
Volume Step Value Gain (dB)
1 00000 –80.0
2 00001 –46.5
3 00010 –40.5
4 00011 –34.5
5 00100 –30.0
6 00101 –27.0
7 00110 –24.0
8 00111 –21.0
9 01000 –18.0
10 01001 –15.0
11 01010 –13.5
12 01011 –12.0
13 01100 –10.5
14 01101 –9.0
15 01110 –7.5
16 01111 –6.0
17 10000 –4.5
18 10001 –3.0
19 10010 –1.5
20 10011 0.0
21 10100 1.5
22 10101 3.0
23 10110 4.5
24 10111 6.0
25 11000 7.5
26 11001 9.0
27 11010 10.5
28 11011 12.0
29 11100 13.5
30 11101 15.0
31 11110 16.5
32 11111 18.0
21 www.national.com
LM49101
HW RESET FUNCTION
The LM49101 can be globally reset without using the I2C con-
trols. When the HW RESET pin is set to a logic low the
LM49101 will enter into shutdown, the mode control bits of the
Output Mode Control register, volume control registers and
Power_On bits will be set to the default value of zero. The
other bits will retain their values. The LM49101 cannot be ac-
tivated until the HW RESET pin is set to a logic high voltage.
When the HW RESET is set to a logic high then the I2C con-
trols can activate and set the register control bits.
GAMP_SD BIT
The GAMP_SD bit allows for reduced power consumption.
When set to '1' the gain amplifiers on unused inputs will be
shutdown saving approximately 0.4mA per input in shutdown.
For example, in Mode 1 only the mono inputs are in use. Set-
ting GAMP_SD to '1' will shut down the gain amplifiers for the
left and right inputs reducing current draw from the VDDLS
supply by approximately 0.8mA. The GAMP_SD bit does not
need to be set each time when changing modes as the
LM49101 will automatically activate and deactivate the need-
ed inputs based on the mode selected.
When operating with GAMP_SD set to '1', a transient may be
observed on the outputs when changing modes. During pow-
er up, the LM49101 uses a start up sequence to eliminate any
pops and clicks on the outputs. The volume control circuitry
is powered up first followed by the other internal circuitry with
the output amplifiers being powered up last. If a mode change
requires a gain amplifier to turn on then a potential transient
may be created that is amplified on the already active outputs.
To eliminate unwanted noise on the outputs the Power_On
bit should be used to turn off the LM49101 before changing
modes, perform a mode change, then turn the LM49101 back
on. This procedure will cause the LM49101 to follow the start
up sequence.
LS (EP_MODE) BIT
The LS (EP_Mode) bit selects the amount of bias current in
the loudspeaker amplifier. Setting the LS (EP_Mode) bit to a
'1' will reduce the amount of current from the VDDLS supply
by approximately 0.5mA. The THD performance of the loud-
speaker amplifier will be reduced as a result of lower bias
current. See the performance graphs in the Typical Perfor-
mance Characteristics section above.
TURN_ON_TIME BIT
The Turn_On_Time bit determines the delay time from the
Power_On bit set to '1' and the internal circuits ready. For
input capacitor values up to 0.47μF the Turn_On_Time bit can
be set to fast mode by setting the bit to a '1'. When the input
capacitor values are larger than 0.47μF then the
Turn_On_Time bit should be set to '0' for normal turn-on time
and higher delay. This allows sufficient time to charge the in-
put capacitors to the ½ VDDLS bias voltage.
POWER_ON BIT
The Power_On bit is the master control bit to activate or de-
activate the LM49101. All registers can be loaded indepen-
dent of the Power_On bit setting as long as the IC is powered
correctly. Cycling the Power_On bit does not change the val-
ues of any registers nor return all bits to the default power on
value of zero. The Power_On bit only determines whether the
IC is on or off.
EP BYPASS BIT
The EP Bypass bit is used to set the LM49101 to earpiece
mode. When this bit is set the analog switch is activated and
the rest of the IC blocks except for the I2C circuitry will go into
shutdown for minimal current consumption.
HPR_SD BIT
The HPR_SD bit will deactivate the right headphone output
amplifier. This bit is provided to reduce power consumption
when only one headphone output is needed.
MODE_CONTROL BITS
The LM49101 includes a comprehensive mixer multiplexer
controlled through the I2C interface. The mixer/multiplexer al-
lows any input combination to appear on any output of
LM49101. Multiple input paths can be selected simultane-
ously. Under these conditions, the selected inputs are mixed
together and output on the selected channel. Table 4 shows
how the input signals are mixed together for each possible
input selection.
INPUT MUTE BIT
The Input Mute bit will mute all inputs except the Bypass in-
puts when set to a '1'. This allows complete and quick mute
of the Mono, Left, and Right inputs without changing the Vol-
ume Control registers or HP_Gain bits. The volume and
HP_Gain bits retain their values when the Input Mute is en-
abled or disabled.
The Input Mute bit can be used to mute all the inputs when
other chips in a system, such as the baseband IC, create
transients causing unwanted noise on the outputs of the
LM49101. This added feature eliminates the need for power
cycling the LM49101.
LS_GAIN BIT
The loudspeaker amplifier can have an additional gain of 0dB
or 6dB by using the LS_Gain bit. The Mono input has 6dB of
attenuation before the volume control (see Figure 1) while the
Left and Right inputs do not. The LS_Gain bit is used to ac-
count for the different attenuation levels for each input and to
achieve maximum output power. To obtain maximum output
power on the loudspeaker outputs, the LS_Gain bit should be
se to '1' for Modes 1, 5, 9, 13.
HP_GAIN BITS
The headphone outputs have an additional, single volume
control set by the three HP_Gain bits in the Output Gain Con-
trol register. The HP_Gain volume setting controls the output
level for both the left and the right headphone outputs.
VOLUME CONTROL BITS
The LM49101 has three independent 32-step volume con-
trols, one for each of the inputs. The five bits of the Volume
Control registers sets the volume for the specified input chan-
nel.
SHUTDOWN FUNCTION
The LM49101 features the following shutdown controls.
Bit D4 (GAMP_SD) of the GENERAL CONTROL register
controls the gain amplifiers. When GAMP_SD = 1, it disables
the gain amplifiers that are not in use. For example, in Modes
1, 4 and 5, the Mono inputs are in use, so the Left and Right
input gain amplifiers are disabled, causing the IDD to be min-
imized.
Bit D0 (Power_On) of the GENERAL CONTROL register is
the global shutdown control for the entire device. Set
Power_On = 0 for normal operation. Power_On = 1 overrides
any other shutdown control bit.
www.national.com 22
LM49101
DIFFERENTIAL AMPLIFIER EXPLANATION
The LM49101 features a differential input stage, which offers
improved noise rejection compared to a single-ended input
amplifier. Because a differential input amplifier amplifies the
difference between the two input signals, any component
common to both signals is cancelled. An additional benefit of
the differential input structure is the possible elimination of the
DC input blocking capacitors. Since the DC component is
common to both inputs, and thus cancelled by the amplifier,
the LM49101 can be used without input coupling capacitors
when configured with a differential input signal.
BRIDGE CONFIGURATION EXPLAINED
By driving the load differentially through the MONO outputs,
an amplifier configuration commonly referred to as “bridged
mode” is established. Bridged mode operation is different
from the classical single-ended amplifier configuration where
one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential drive
to the load, thus doubling output swing for a specified supply
voltage. Four times the output power is possible as compared
to a single-ended amplifier under the same conditions. This
increase in attainable output power assumes that the ampli-
fier is not current limited or clipped.
A bridge configuration, such as the one used in LM49101,
also creates a second advantage over single-ended ampli-
fiers. Since the differential outputs are biased at half-supply,
no net DC voltage exists across the load. This eliminates the
need for an output coupling capacitor which is required in a
single supply, single-ended amplifier configuration. Without
an output coupling capacitor, the half-supply bias across the
load would result in both increased internal IC power dissipa-
tion and also possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a suc-
cessful amplifier, whether the amplifier is bridged or single-
ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. The power dissipation of the
LM49101 varies with the mode selected. The maximum pow-
er dissipation occurs in modes where all inputs and outputs
are active (Modes 6, 7, 8, 9, 10, 11, 13, 14, 15). The power
dissipation is dominated by the Class AB amplifier. The max-
imum power dissipation for a given application can be derived
from the power dissipation graphs or from Equation 1.
PDMAX = 4*(VDD)2/(2π2RL) (1)
It is critical that the maximum junction temperature (TJMAX) of
150°C is not exceeded. TJMAX can be determined from the
power derating curves by using PDMAX and the PC board foil
area. By adding additional copper foil, the thermal resistance
of the application can be reduced from the free air value, re-
sulting in higher PDMAX. Additional copper foil can be added
to any of the leads connected to the LM49101. It is especially
effective when connected to VDD, GND, and the output pins.
Refer to the application information on the LM49101 refer-
ence design board for an example of good heat sinking. If
TJMAX still exceeds 150°C, then additional changes must be
made. These changes can include reduced supply voltage,
higher load impedance, or reduced ambient temperature. In-
ternal power dissipation is a function of output power. Refer
to the Typical Performance Characteristics curves for
power dissipation information for different output powers and
output loading.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible. Typical appli-
cations employ a 5V regulator with 10µF tantalum or elec-
trolytic capacitor and a ceramic bypass capacitor which aid in
supply stability. This does not eliminate the need for bypass-
ing the supply nodes of the LM49101. The selection of a
bypass capacitor, especially CB, is dependent upon PSRR
requirements, click and pop performance, system cost, and
size constraints.
GROUND REFERENCED HEADPHONE AMPLIFIER
The LM49101 features a low noise inverting charge pump that
generates an internal negative supply voltage. This allows the
headphone outputs to be biased about GND instead of a
nominal DC voltage, like traditional headphone amplifiers.
Because there is no DC component, the large DC blocking
capacitors (typically 220μF) are not necessary. The coupling
capacitors are replaced by two small ceramic charge pump
capacitors, saving board space and cost. Eliminating the out-
put coupling capacitors also improves low frequency re-
sponse. In traditional headphone amplifiers, the headphone
impedance and the output capacitor from a high-pass filter
that not only blocks the DC component of the output, but also
attenuates low frequencies, impacting the bass response.
Because the LM49101 does not require the output coupling
capacitors, the low frequency response of the device is not
degraded by external components. In addition to eliminating
the output coupling capacitors, the ground referenced output
nearly doubles the available dynamic range of the LM49101
headphone amplifiers when compared to a traditional head-
phone amplifier operating from the same supply voltage.
HEADPHONE & CHARGE PUMP SUPPLY VOLTAGE
(VDDHP & VDDCP)
The headphone outputs are centered at ground by using dual
supply voltages for the headphone amplifier. The positive
power supply is set by the voltage on the VDDHP pin while the
negative supply is created with an internal charge pump. The
negative supply voltage is equal in magnitude but opposite in
voltage to the voltage on the VDDCP pin.
INPUT CAPACITOR SELECTION
Input capacitors may be required for some applications, or
when the audio source is single-ended. Input capacitors block
the DC component of the audio signal, eliminating any conflict
between the DC component of the audio source and the bias
voltage of the LM49101. The input capacitors create a high-
pass filter with the input resistors RIN. The -3dB point of the
high-pass filter is found using Equation (2) below.
f = 1 / 2πRINCIN (Hz) (2)
Where the value of RIN is given in the Electrical Characteris-
tics Table as ZIN.
When the LM49101 is using a single-ended source, power
supply noise on the ground is seen as an input signal. Setting
the high-pass filter point above the power supply noise fre-
quencies, 217Hz in a GSM phone, for example, filters out the
noise such that it is not amplified and heard on the output.
23 www.national.com
LM49101
Capacitors with a tolerance of 10% or better are recommend-
ed for impedance matching and improved CMRR and PSRR.
CHARGE PUMP FLYING CAPACITOR (C1)
The flying capacitor (C1), see Figure 1, affects the load regu-
lation and output impedance of the charge pump. A C1 value
that is too low results in a loss of current drive, leading to a
loss of amplifier headroom. A higher valued C1 improves load
regulation and lowers charge pump output impedance to an
extent. Above 2.2μF, the RDS(ON) of the charge pump switches
and the ESR of C1 and Cs3 dominate the output impedance.
A lower value capacitor can be used in systems with low max-
imum output power requirements.
CHARGE PUMP HOLD CAPACITOR (CS3)
The value and ESR of the hold capacitor Cs3 directly affects
the ripple on VSSCP. Increasing the value of Cs3 reduces out-
put ripple. Decreasing the ESR of Cs3 reduces both output
ripple and charge pump output impedance. A lower value ca-
pacitor can be used in systems with low maximum output
power requirements.
SELECTION OF INPUT RESISTORS
The Bypass_In inputs connect to the loudspeaker output
through an FET switch when EP Bypass is active (see Figure
5). Because THD through this path is mainly dominated by
the switch impedance variation, adding input resistors (R3 and
R4 in Figure 5) will help reduce impedance effects resulting in
improved THD. For example, a change in the switch
impedance from 2 to 3 is a 67% change in impedance. If
10 input resistors are used then the impedance change is
from 12 to 13, only 7.7% impedance variation. The analog
switch impedance is typically 2 to 3.4. The switch
impedance change is a result of heating and the increase in
RDS(ON) of the FETs.
The value of the input resistors must be balanced against the
amount of output current and the load impedance on the loud-
speaker outputs. A higher value input resistor reduces the
effects of switch impedance variation but also causes voltage
drop and reduced power to the load on the loudspeaker out-
puts.
The current through the FET switch should not exceed 500mA
or die heating may cause thermal shut down activation and
potential IC damage.
MINIMUM POWER OPERATION
The LM49101 has several options to reduce power consump-
tion and is designed to conserve power when possible. When
a speaker only mode is selected the headphone sections are
shutdown and the current drawn from the VDDHP/VDDCP
power supply will be zero. When a headphone mode is se-
lected the current drawn from the VDDLS supply is also re-
duced by shutting down unused circuitry. See the various
Supply Current vs Supply Voltage graphs in the Typical Per-
formance Characteristics section.
To reduce power consumption further, the additional control
bits GAMP_SD, LS (EP Mode), and HPR_SD are provided.
When low power consumption is more important than the
THD performance of the loudspeaker the LS (EP_mode) bit
should be set to '1' saving approximately 0.5mA from the
VDDLS supply. The GAMP_SD bit should be set on to save
approximately 0.4mA for each input shut down. For modes
where only the mono input is used, up to 0.8mA can be saved
from the VDDLS supply. Also, the HPR_SD bit can be used to
shut down the right headphone channel reducing power con-
sumption when only one amplifier headphone output is need-
ed.
Additionally, the supply voltages for the different VDD pins
(VDDLS, VDDHP, and VDDCP) can be set to the minimum
needed values to obtain the output power levels required by
the design. By reducing the supply voltage the total power
consumption will be reduced.
For best system efficiency, a DC-DC converter (buck) can be
used to power the VDDHP and VDDCP voltages from the
VDDLS supply instead of a linear regulator. DC-DC converters
achieve much higher efficiency (> 90%) than even a low
dropout regulator (LDO).
www.national.com 24
LM49101
Demo Board Circuit
30086201
FIGURE 5. Demo Board Circuit
Demonstration Board
The demonstration board (see Figure 5) has connection and
jumper options to be powered partially from the USB bus or
from external power supplies. Additional options are to power
the I2C logic and loudspeaker amplifier (VDDLS) from a single
power supply or separate power supplies. The headphone
amplifier and charge pump can also be powered from the
same supply as long as the voltage limits for each power sup-
ply are not exceeded, although the option is not built into the
board. See theOperating Ratings for each supply's range lim-
it. When powered from the USB bus the I2CVDD will be set to
3.3V and the VDDLS will be set to 5V. Jumper headers J13 and
J12 must be set accordingly. If a single power supply for
I2CVDD and VDDLS is desired then header J5 should be used
with a jumper added to header J11 to connect I2CVDD to the
external supply voltage connected to J5 (see Figure 5).
Connection headers J1 and J2 are provided along with the
stereo headphone jack J4 for easily connection and monitor-
ing of the headphone outputs.
25 www.national.com
LM49101
LM49101 microSMD Demo Board Views
30086209
Composite View
30086205
Silk Screen
30086206
Top Layer
30086208
Internal Layer 1
30086207
Internal Layer 2
30086210
Bottom Layer
www.national.com 26
LM49101
LM49101 Reference Demo Board Bill Of Materials
TABLE 7. Bill Of Materials
Designator Vlaue Tolerance Part Description Comment
R1, R25.1k5% 1/10W, 0603 Resistors
R3, R410Ω 1% 1/10W, 0603 Resistors
R5100k5% 1/10W, 0805 Resistor
CIN1, CIN2
CIN3, CIN4
F10% 1206, X7R Ceramic Capacitor
CS1, CS4
CS5, CB
2.2μF10% Size A, Tantalum Capacitor
CS2 0.1μF10% 0805, 16V, X7R Ceramic Capacitor
CS3, C12.2μF10% 0603, 10V, X7R Ceramic Capacitor
U1 LM49101TM
J1, J2, J3
J5, J7, J8
J9, J10, J14
0.100" 1x2 header, vertical mount Input, Output, VDD, GND
J11, J12, J13 0.100" 1x3 header, vertical mount VDD Selects, VDD, I2CVDD,
GND
J6 16 pin header I2C Connector
J4 Headphone Jack
SW1 Momentary Push Switch RESET function
PCB Layout Guidelines
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout
Recommendations
SINGLE-POINT POWER AND GROUND CONNECTIONS
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing high frequency noise coupling between the ana-
log and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital
and analog ground traces to minimize noise coupling.
PLACEMENT OF DIGITAL AND ANALOG COMPONENTS
All digital components and high-speed digital signals traces
should be located as far away as possible from analog com-
ponents and circuit traces.
AVOIDING TYPICAL DESIGN AND LAYOUT PROBLEMS
Avoid ground loops or running digital and analog traces par-
allel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each other
from the top to the bottom side as much as possible will min-
imize capacitive noise coupling and cross talk.
27 www.national.com
LM49101
Revision History
Rev Date Description
0.01 10/18/08 Initial released.
www.national.com 28
LM49101
Physical Dimensions inches (millimeters) unless otherwise noted
25 Bump micro SMD Package
NS Package Number TMD25BCA
X1 = 2.040±0.030mm X2 = 2.066±0.030mm, X3 = 0.600±0.075mm
29 www.national.com
LM49101
Notes
LM49101Mono Class AB Audio Subsystem with a True Ground Headphone Amplifier and
Earpiece Switch
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
Products Design Support
Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench
Audio www.national.com/audio App Notes www.national.com/appnotes
Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns
Data Converters www.national.com/adc Samples www.national.com/samples
Interface www.national.com/interface Eval Boards www.national.com/evalboards
LVDS www.national.com/lvds Packaging www.national.com/packaging
Power Management www.national.com/power Green Compliance www.national.com/quality/green
Switching Regulators www.national.com/switchers Distributors www.national.com/contacts
LDOs www.national.com/ldo Quality and Reliability www.national.com/quality
LED Lighting www.national.com/led Feedback/Support www.national.com/feedback
Voltage Reference www.national.com/vref Design Made Easy www.national.com/easy
PowerWise® Solutions www.national.com/powerwise Solutions www.national.com/solutions
Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero
Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic
Wireless (PLL/VCO) www.national.com/wireless Analog University® www.national.com/AU
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2009 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: support@nsc.com
Tel: 1-800-272-9959
National Semiconductor Europe
Technical Support Center
Email: europe.support@nsc.com
National Semiconductor Asia
Pacific Technical Support Center
Email: ap.support@nsc.com
National Semiconductor Japan
Technical Support Center
Email: jpn.feedback@nsc.com
www.national.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated