ACCOUNT PRODUCTS SOLUTIONS SUPPORT ABOUT ALL Package : LQFP plastic, low profile quad flat leaded package 48 terminals 0.5 mm pitch 7 mm x 7 mm x 1.4 mm body S08DZ 8-bit MCU, S08 core, 32KB Flash, 40MHz, QFP 48 Data Sheet Product Summary Software & Tools Documentation Operating Characteristics CART Search... MC9S08DZ32ACLF Buy Options ENGLISH Environmental Information Quality Information Shipping Information Operating Characteristics Parameter Value Parameter Value Flash (kB) 32 SPI 1 RAM (kB) 2 Supply voltage [min] (V) 2.7 EEPROM (kB) 1 Supply voltage [max] (V) 5.5 Core Type S08 GPIO 40 Operating Frequency [Max (MHz)] 20 Ambient Operating Temperature (Min-Max) () -40 to 85 I2C 1 SCI 2 Environmental Information Material Declaration PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC Weight (mg) MC9S08DZ32ACLF (935324275557) Yes Yes Certificate Of Analysis (CoA) Yes D e3 REACH SVHC 178.25 Quality Information Material Declaration Safe Assure Functional Safety MC9S08DZ32ACLF (935324275557) Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering 3 260 40 No Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) 854231 3A991A2 MC9S08DZ32ACLF (935324275557) ABOUT NXP RESOURCES FOLLOW US News 26 Jul 2018 Investors Mobile Apps Press, News, Blogs Contact Us Careers Privacy | Terms of Use | Terms of Sale | Feedback NXP Semiconductors Reports Second Quarter 2018 Results Read More (c)2006-2018 NXP Semiconductors. All rights reserved.