Powerful Sensing Solutions for a Better Life
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
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DTOS ACCELEROMETER
Digital Thermal Orientation Sensing Accelerometer
MXC6226XU
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 2 of 15
Features
Fully Integrated Thermal Accelerometer
X/Y Axis, 8 bit, Acceleration A/D Output (± 2g)
Absolute 0G offset less than +/- 50mg
4-position Orientation Detecti on
Shake Detection with Interrupt
Programmable Shake Threshold
Shake Direction Detection
I2C Interface
Power Down Mode
Shock Survival Greater than 50,000 g
Operating Supply Voltage from 2.5V to 5.5V with
1.8V compatible I/O
Produces no Mechanical Sounds ("click")
Package Size 3x3x1mm
Applications
Consumer:
Cell Phones
Digital Still Cameras (DSC)
Digital Video Cameras (DVC)
LCD TV
Toys
MP3, MP4 Players
Household Safety:
Fan Heaters
Halogen Lamps
Iron
Cooling Fans
General Description
The MEMSIC Digital Thermal Orientation Sensor (DTOS) is the world's first
fully-integrated orientation sensor. Its operation is based on our patented
MEMS-thermal technology and is built using a standard 0.18um CMOS process.
DTOS contains no moving parts (such as a ball) and thus eliminates field-reliability
and repeatability issues associated with competitive products. It also eliminates the
"click" sounds typically heard in ball based orientation sensors. Shock survival is
greater than 50,000g. DTOS detects four orientations, shake and shake direction.
In addition, it provides X/Y axis acceleration signals with very low 0g offset. An I2C
interface is used to communicate with this device and an interrupt pin (INT) is
provided for shake and orientation. The DTOS also has a power down enabled
through the I2C interface.
Functional Block Diagram
Figure 1
The DTOS is packaged in a hermetically sealed 6-pin surface mount package (3 mm
x 3 mm x 1mm); the product is RoHS compatible and operates over -20~70
temperature range.
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 3 of 15
Figure 2
Top View
Figure 3
Side View
Figure 4
Bottom View
LCC6 Package Drawing Package Thickness:
1.05mm +/- 0.1mm
Pin Description: LCC6 Package
Pin Name Description
1 INT This pin is the DTOS interrupt output. The logic level on this pin reflects the state of the INT bit in the STATUS
register. INT is set w hen t he or i en t ation differs fro m the l ast or i en t a t io n r ea d by the processo r, or a shake event
is detected. INT is cleared upon reading of the STATUS register.
2 NC During normal operation, this pin must be left floating.
3 VDD This is the power supply input. The DC voltage should be between 2.5 and 5.5 volts.
4 I2C SCL This pin is the s er ial clock line for th e I2C i n te r face. Since the DTOS only oper ates as a slave device, this pin is
always an input.
5 I2C SDA This pin is the serial data line for the I2C interface. It is an I/O pin that functions as an input during a write, and
an output during a read from the DTOS.
6 GND This is the ground pin for the DTOS.
Absolute Maximum Ratings*
Supply Voltage (VDD) ………………...-0.5 V to +7.0V
Storage Temperature ………………..-40°C to +150°C
Acceleration ……………………………… ……..50, 000 g
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
rating only; the functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Specifications1
Parameter (Units) Conditions Minimum Typical Maximum
Operating Voltage Range (V) 2.5 5.5
VIO(I2C interface)(V) 1.62 1.8 VDD
Supply Current (mA) In power-up mode 1.2
In power-down mode 0.0004 0.001
Turn-On Ti me (ms)2 300 500
Turn-off Ti me (ms) 0.5
Operating Temperature Range () -20 +70
VDD Rise Time (ms)3 10
Notes: 1 All specifications are at 3V and room temperature unless otherwise noted. 2 Time to obtain valid data after existing
power-down mode. 3 Maximum allowable power supply rise time from 0.25V to 2.5V (minimum). Slower VDD rise time may cause
erroneous data retrieval from OTP memory at power-up.
Sensor Characteristics1
Parameter (Units) Conditions Minimum Typical Maximum
Measurement Range (g) X/Y Axis ± 2.0
Alignment Error (°) X/Y Axis ± 1.0 ± 2.0
Sensitivity Error (%) X/Y Ax is -5 0 5
Sensitivity (LSB/g) X/Y Axis 64
Sensitivity Drift Over Temperature (%) Delta from 25 (-20 - 70 ) ± 12 ± 18
Zero g Offset Bias Level (mg) X/Y Axis (25 ) -30 +30
Zero g Offset Temperature coefficient (mg/) X/Y Axis (-20 - 70 ) 0.3
3dB Signal Bandwidth (Hz) 10
Notes: 1 All specifications are at 3V and room temperature unless otherwise noted.
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 4 of 15
Figure 5
Digit al Parameters
Symbol Parameter (Units) Minimum Typical Maximum
VIH High Level Input Voltage (Volts) 0.7*VIO
VIL Low Level Input Voltage (Volts) 0.3*VIO
VHYS Hysteresis of Schmitt Trigger Input (Volts) 0.1
IIL Input Leakage, All Inputs (uA) -10 10
VOH High Level Output Voltage (Volts) 0.8*VIO
VOL Low Level Output Vo ltage (Volts) 0.2*VIO
Digit al Switching Characteristics
Symbol Parameter (Units) Minimum Typical Maximum
top Operating Valid Time (ms)1 20
fSCL SCK Clock Frequency (kHz) 0 400
tr Rise Time (us) 0.3
tf Fall Time (us) 0.3
tlow SCL Low Time (us) 1.3
thigh SCL High Time (us) 0.6
tHD;D Data Hold Time (us) 0 0.9
tSU;D Data Set-Up Time (us) 0.1
tSU;S Start Set-Up Time (us) 0.6
tHD;S Start Hold Time (us) 0.6
tSU;P Stop Set-Up Time (us) 0.6
tBF Bus Free Time Between Star t a nd Stop (us) 1.3
Notes: 1 Time to operate DTOS through I2C interface after power being supplied to VDD. 2. It is not recommended to keep both
SCL and SDA signals low for over 10ms.
S
VDD
SDA
SCL
top
tf
tHD;S
tlow tr
tHD;D
tSU;D
thigh tSU;S
Sr
tSU;P
tBF
P S
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 5 of 15
Circuit Schematics
Figure 6
Note:
R1 and R2 are pull-up resistors, the value can be
determined by customer according to the requirement of
the host device, and the recommendation value is
2.7KOhm.
INT does not need any pull-up/pull-down resistor
If INT is not used, keep it disconnected (don't pull up or
pull down)
Leave NC pin as no connection.
Landing Pattern (Unit: mm)
1 INT
2 NC
3 VDD
6 GND
5 SDA
4 SCL
Figure 7
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 6 of 15
Reflow Profile
Figure 8
Reflow Profile
Note:
Reflow is limited to two cycles.
If a second reflow cycle is implemented, it should be applied
only after device has cooled down to 25 (room temperature)
Figure 8 is the reflow profile for Pb free process
The peak temperature on the sensor surface must be limited
to under 260 for 10 seconds.
Follow solder paste supplier’s recommendations for the best
SMT quality.
Manual Soldering
Figure 9
‘606’ is the laser marking designating the product type, and ‘xxx’ is the lot number
Note:
When soldering manually or repairing via soldering iron for the
DTOS, the time must be limited to less than 10 seconds and
the temperature must not exceed 275. If a heat gun is used,
the time must be limited to less than 10seconds and the
temperature must not exceed 270
Avoid bending the PCB after the sensor assembly
Low Temperature Glass
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 7 of 15
Orientation State Bits OR [1,0]
00
01
10
11
Gravity direction
Figure 10
Orient ation/Shake Characteristics
DTOS Output state response to orientation
If the sensor is rotated past the 45 degree threshold, the orientation bits will change only if the
sensor stays in the same state for a defined period of time. If the sensor crosses back before this
time period, the orientation bits remain unchanged. This is to prevent dithering of the orientation
state. Four user programmable hysteresis time periods are available: 160, 320, 640 and 1280ms.
Figure 11 Figure 12
DTOS can detect orientation changes with up to 60 degrees of off-axis tilt
DTOS Shake Detection
Shake and shake direction are orthogonal to screen orientation. An interrupt pin (INT) is set high
and must be cleared by the MCU via the I2C interface. Four user programmable thresholds are
available: 0.5g, 1g, 1.5g and 2g, , and these can be applied either to the X-axis, Y-axis, or both
axes.
Figure 13
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 8 of 15
DTOS I2C Interface
A slave mode I2C interface, capable of operating in standard or fast mode, is implemented on the DTOS. The interface uses a serial data line (SDA)
and a serial clock line (SCL) to achieve bi-directional communication between master and slave devices. A master (typically a microprocessor)
initiates all data transfers to and from the device, and generates the SCL clock that synchronizes the data transfer. The SDA pin on the DTOS
operates both as an input and an open drain output. Since the DTOS only operates as a slave device, the SCL pin is always an input. There are
external pull-up resistors on the I2C bus lines. Devices that drive the I2C bus lines do so through open-drain n-channel driver transistors, creating a
wired NOR type arrangement.
Data on SDA is only allowed to change when SCL is low. A high to low transition on SDA when SCL is high is indicative of a START condition,
whereas a low to high transition on SDA when SCL is high is indicative of a STOP condition. When t he interface is not busy, both SCL and SDA are
high. A data transmission is initiated by the master pulling SDA low while SCL is high, generating a START condition. The data transmission occurs
serially in 8 bit bytes, with the MSB transmitted first. During each byte of transmitted data, the master will generate 9 clock pulses. The first 8 clock
pulses are used to clock the data, the 9th clock pulse is for the acknowledge bit. After the 8 bits of data are clocked in, the transmitting device
releases SDA, and the receiving device pulls it down so that it is stable low during the entire 9th clock pulse. By doing this, the receiving device
"acknowledges" that it has received the transmitted byte. If the slave receiver does not generate an acknowledge, then the master device can
generate a STOP condition and abort the transfer. If the master is the receiver in a data transfer, then it must signal the end of data to the slave by not
generating an acknowledge on the last byte that was clocked out of the slave. The slave must release SDA to allow the master to generate a STOP or
repeated START condition.
The master initiates a data transfer by generating a START condition. After a data transmission is complete, the master may terminate the data
transfer by generating a STOP condition. The bus is considered to be free again a certain time after the STOP condition. Alternatively, the master can
keep the bus busy by generating a repeated START condition instead of a STOP condition. This repeated START condition is functionally identical to
a START condition that follows a STOP. Each device that sits on the I2C bus has a unique 7-bit address.
The first byte transmitted by the master following a START is used to address the slave device.
The first 7 bits contain the address of the slave device, and the 8th bit is the R/W* bit (read = 1, write = 0; the asterisk indicates active low, and is used
instead of a bar). If the transmitted address matches up to that of the DTOS, then the DTOS will acknowledge receipt of the address, and prepare to
receive or send data.
If the master is writing to the DTOS, then the next byte that the DTOS receives, following the address byte, is loaded into the address counter internal
to the DTOS. The contents of the address counter indicate which register on the DTOS is being accessed. If the master now wants to write data to the
DTOS, it just continues to send 8-bit bytes. Each byte of data is latched into the register on the DTOS that the address counter points to. The address
counter is incremented after the transmission of each byte.
If the master wants to read data from the DTOS, it first needs to write the address of the register it wants to begin reading data fro m to the DTOS
address counter. It does this by generating a START, followed by the address byte containing the DTOS address, with R/W* = 0. The next transmitted
byte is then loaded into the DTOS address counter. Then, the master repeats the START condition and re-transmits the DTOS address, but this time
with the R/W* bit set to 1. During the next transmission period, a byte of data from the DTOS register that is addressed by the contents of the address
counter will be transmitted from the DTOS to the master. As in the case of the master writing to the DTOS, the contents of the address counter will be
incremented after the transmission of each byte. The prot ocol for m ultiple byte reads and writes bet ween a master and a slave d evice is depicted in
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
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MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 9 of 15
Figure 14.
Figure 14
The 7-bit I2C address for DTOS is set as 0010110b.
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
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MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 10 of 15
User Register Summary
Address Name Definition Access Default
$00 XOUT 8-bit x-axis acceleration output read 00000000
$01 YOUT 8-bit y-axis acceleration output read 00000000
$02 STATUS orientation and shake status read 00000000
$04 DETECTION Power down, ori entation and shake detection parameters write 00000000
$08 CHIP_ID Chip ID of MXC6226XU read xx100110
The registers available to the user on the DTOS are summarized in the table above. Each register contains 8 bits.
$00: XOUT – 8-bit x-axis acceleration output (read only)
D7 D6 D5 D4 D3 D2 D1 D0
XOUT[7] XOUT[6] XOUT[5] XOUT[4] XOUT[3] XOUT[2] XOUT[1] XOUT[0]
8-bit x-axis acceleration output. Data in 2's complement format with range of -128 to +127.
$01: YOUT – 8-bit y-axis acceleration output (read only)
D7 D6 D5 D4 D3 D2 D1 D0
YOUT[7] YOUT[6] YOUT[5] YOUT[4] YOUT[3] YOUT[2] YOUT[1] YOUT[0]
8-bit y-axis acceleration output. Data in 2's complement format with range of -128 to +127.
$02: STATUS – orientation and shake status register (read only)
D7 D6 D5 D4 D3 D2 D1 D0
INT SH[1] SH[0] TILT ORI[1] ORI[0] OR[1] OR[0]
OR[1:0] is a 2-bit indication of the device orientation, according to the following scheme (also shown visually in Figure 10): OR[1:0] = 00 – device is
vertical in upright orientation; 01 – device is rotated 90 degrees clockwise; 10– device is vertical in inverted orientation; 11 – device is rotated 90
degrees counterclockwise. The bits OR[1:0] are indicative of "long-term" orientation. The orientation is determined by measuring the signs of the
quantities ax – ay, and ax + ay, as shown in Figure 12. The orientation measurement is ignored for any samples in which the magnitudes of ax and ay
are both less than 3/8 g (for example, during a free-fall event). In order for a new value of OR[1:0] to be written to the STATUS register, a valid
measurement of the new orientation must be measured a consecutive number of times determined by the setting of bits ORC[1:0] in the DETECTION
register. This provides a low-pass filtering and hysteresis effect that keeps a display from flickering near orientation boundaries.
ORI[1:0] is the instantaneous device orientation. It follows the same scheme as OR[1:0], except that it is updated every time a valid orientation
measurement is made, not subject to the same low-pass filtering as OR[1:0].
TILT is an indication of whether there is enough acceleration signal strength to make a valid orientation measurement. If TILT = 0, the orientation
measurement is valid, if TILT = 1, then the orientation measurement is invalid. TILT is updated every measurement cycle.
SH[1:0] indicate whether a shake event has taken place, and if so, its direction. Shake can only be detected in a direction perpendicular to the vertical
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 11 of 15
orientation of the device. When an acceleration perpendicular to the device orientation (ax for OR[1:0] = 01 or 11; ay for OR[1:0] = 00 or 10) is sensed
that has a magnitude greater than the value set by bits SHTH[1:0] in the DETECTION register, then shake detection begins. For a shake event to be
written to SH[1:0], the perpendicular acceleration must again exceed the magnitude set by SHTH[1:0] but with the opposite sign (if bit SHM = 0 in the
DETECTION register), or just reverse its sign (if bit SHM = 1 in the DETEC TION register). The above mentioned second acceleration events must
occur within a certain amount of time, set by SHC[1:0] in the DETECTION register, of the original breaking of the threshold.
If a shake is determined to have occurred, then th e direction of the shake can be determined b y the signs of the accelerations. The shake status is
indicated as shown in the following table:
SH[1] SH[0] Comment
0 0 no shake event
0 1 shake left
1 0 shake right
1 1 undefined
INT is the interrupt bit. Setting this bit high will cause the INT pin to output a high level. The INT bit will be set whenever either (1) The orientation, as
indicated by bits OR[1:0] changes, or (2) A shake event occurs. The microprocessor can then service the interrupt by reading the STATUS register.
Once a shake event occurs, no new shake events will be recorded until the interrupt has been serviced, although the orientation bits will continue to
be updated. The INT bit is cleared by reading the STATUS register.
$04: DETECTION – orientation and shake detection parameters (write only)
D7 D6 D5 D4 D3 D2 D1 D0
PD SHM SHTH[1] SHTH[0] SHC[1] SHC[0] ORC[1] ORC[0]
PD = 1 powers down the DTOS to a non-functional low power state with a maximum current drain of 1 uA.
ORC[1:0] sets the orientation hysteresis time period, which is the time period of consecutive valid new instantaneous orientation measurements that
must be made before a new orientation value is written into bits OR[1:0] in the STATUS register. The "long-term" orientation change is set by
ORC[1:0] as follows: 00 – 160ms, 01 – 320ms, 10 – 640ms, 11 – 1280ms nominally.
SHC[1:0] sets the shake events time window, which determines the time window allowed bet ween the first shake event (perpendicular acceleration
exceeding the threshold set by SHTH[1:0]) and the second shake event (acceleration breaking the threshold with opposite sign, SHM = 0, or just
reversing sign, SHM = 1). The time window is set by SHC[1:0] as follows: 00 – 80ms, 01 – 160ms, 10 – 320ms, 11 – 640ms nominally.
SHTH[1:0] sets the shake threshold that the perpendicular acceleration must exceed to trigger the first shake event. The settings for SHTH[1:0] are:
00 - 0.5 g, 01 – 1.0 g, 10 – 1.5 g, 11 – 2.0 g.
SHM is the shake mode bit. If SHM = 0, then for a shake to be detected, and written to SH[1:0] in the STATUS register, the second shake event must
break the threshold set by SHTH[1:0] with the opposite sign of the first shake event, within the time window set by SHC[1:0]. If SHM = 1, then the
second shake event must just have the opposite sign of the first shake event within the time window set by SHC[1:0].
$08 (6LSB): CHIP_ID – Chi p ID of MXC6226XU (read only)
D7 D6 D5 D4 D3 D2 D1 D0
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 12 of 15
ID[7] ID[6] ID[5] ID[4] ID[3] ID[2] ID[1] ID[0]
X X 1 0 0 1 1 0
Device identification register (6LSB) which is set as 26h for MXC6226XU.
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 13 of 15
Sensitivity/Offset Distribution (@ 25 , VDD = 3V)
OffsetX Distribution
0
100
200
300
400
500
600
700
800
900
1000
-24 -16 -9 -1 6 14 21
Offset(mg)
Frequency
Figure 15
OffsetY Distribution
0
100
200
300
400
500
600
700
800
900
1000
-24 -16 -9 -1 6 14 21
Offset(mg)
Frequency
Figure 16
SenX Distribution
0
100
200
300
400
500
600
700
800
61 62 63 64 65 66 67
Sen(LSB/g)
Frequency
Figure 17
Se nY Distri bu tion
0
100
200
300
400
500
600
700
800
61 62 63 64 65 66 67
Sen(LSB/g)
Frequency
Figure 18
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 14 of 15
Over Temperature Characteristics
Normalized OffX TC
-25
-20
-15
-10
-5
0
5
10
15
20
25
-40 -20 0 20 40 60 80
Temp(degC)
OffX(mg)
Figure 19
Normali zed OffY TC
-25
-20
-15
-10
-5
0
5
10
15
20
25
-40-200 20406080
Temp(degC)
OffY(mg)
Figure 20
No r m alized SenX TC
-0.02
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
-40-200 20406080
Temp(degC)
SenX
Figure 21
Normalized SenY TC
-0.02
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
-40-200 20406080
Temp(degC)
SenY
Figure 22
Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER
MXC6226XU: Fully Integrated Thermal Acceleromete
r
MXC6226XU - DTOS Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
July 23, 2013
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o
f
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Document Version 1.3
Page 15 of 15
Device Marking Illustration
Figure 23