ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 1/46
SDRAM 512K x 32 Bit x 4 Banks
Synchronous DRAM
FEATURES
y JEDEC standard 2.5V power supply
y LVTTL compatible with multiplexed address
y Four banks operation
y MRS cycle with address key programs
- CAS Latency ( 2 & 3 )
- Burst Length ( 1, 2, 4, 8 & full page )
- Burst Type ( Sequential & Interleave )
y All inputs are sampled at the positive going edg e of the
system clock
y DQM for masking
y Auto & self refresh
y 15.6μs refresh interval
ORDERING INFORMATION
Product No. MAX FREQ. PACKAGE COMMENTS
M12S64322A-6TG 166MHz TSOPII Pb-free
M12S64322A-7TG 143MHz TSOPII Pb-free
M12S64322A-6BG 166MHz 90BGA Pb-free
M12S64322A-7BG 143MHz 90BGA Pb-free
GENERAL DESCRIPTION
The M12S64322A is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 524,288 words by 32 bits.
Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle.
Range of operating frequenc ies, programmable burst length and programmable l atencies allow the same device to be useful for a
variety of high bandwidth, high performance memory system applications.
PIN ARRANGEMENT Top View
1
2
3
4
5
6
7
8
9
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
86
85
84
83
82
81
80
79
78
66
65
64
63
62
61
60
59
58
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
10
11
12
13
14
15
16
17
18
19
20
DQ5
DQ6
VSSQ
DQ7
NC
VDD
DQM0
W E
CAS
RAS
C S
77
76
75
74
73
72
71
70
69
68
67
DQ10
DQ9
VDDQ
DQ8
NC
VSS
DQM1
NC
NC
CLK
CKE
NC
DQ31
VDDQ
DQ30
DQ29
VSSQ
DQ28
DQ27
VDDQ
DQ26
DQ25
VSSQ
DQ24
VSS
21
22
23
24
25
26
27
28
29
NC
BA0
BA1
A10/AP
A0
A1
A2
DQM2
VDD
30
31
32
33
34
35
36
37
38
39
NC
DQ 16
VSSQ
DQ 17
DQ 18
VDDQ
DQ 19
DQ 20
VSSQ
DQ 21
DQ 22 40
41
42
43
VDDQ
DQ 23
VDD
A9
A8
A7
A6
A5
A4
A3
DQM3
VSS
57
56
55
54
53
52
51
50
49
48
47
46
45
44
86Pin TSOP(II)
(400mil x 875mil)
(0.5mm Pin pitch)
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 2/46
PIN ARRANGEMENT
90 Ball FBGA
1 2 3 4 5 6 7 8 9
A DQ26 DQ24 VSS VDD DQ23 DQ21
B DQ28 VDDQ VSSQ VDDQ VSSQ DQ19
C VSSQ DQ27 DQ25 DQ22 DQ20 VDDQ
D VSSQ DQ29 DQ30 DQ17 DQ18 VDDQ
E VDDQ DQ31 NC NC DQ16 VSSQ
F VSS DQM3 A3 A2 DQM2 VDD
G A4 A5 A6 A10 A0 A1
H A7 A8 NC NC BA1 NC
J CLK CKE A9 BA0 CS RAS
K DQM1 NC NC CAS WE DQM0
L VDDQ DQ8 VSS VDD DQ7 VSSQ
M VSSQ DQ10 DQ9 DQ6 DQ5 VDDQ
N VSSQ DQ12 DQ14 DQ1 DQ3 VDDQ
P DQ11 VDDQ VSSQ VDDQ VSSQ DQ4
R DQ13 DQ15 VSS VDD DQ0 DQ2
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 3/46
DQM0~3
DQ
Mode
Register
Control Logic
Column
Address
Buffer
&
Refresh
Counter
Row
Address
Buffer
&
Refresh
Counter
Bank D
Row Decoder
Bank A
Bank B
Bank C
Sense Amplifier
Column Decoder
Data Control Circuit
Latch Circuit
Input & Output
Buffer
Address
Clock
Generator
CLK
CKE
Command Decoder
CS
RAS
CAS
WE
BLOCK DIAGRAM
PIN DESCRIPTION
PIN NAME INPUT FUNCTION
CLK System Clock Active on the positive going edge to sample all inputs
CS Chip Select Disables or enables device operation by masking or enabling all
inputs except CLK , CKE and DQM0-3.
CKE Clock Enable Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior new command.
Disable input buffers for power down in standby.
A0 ~ A10 Address Row / column address are multiplexed on the same pins.
Row address : RA0~RA10, column address : CA0~CA7
BA0 , BA1 Bank Select Address Selects bank to be activated during row address latch time.
Selects bank for read / write during column addr ess latch time.
RAS Row Address Strobe Latches row addresses on the positiv e going edge of the CLK with
RAS low.
Enab les row access & precharge.
CAS Column Address Strobe Latches co lumn address on the positive going edge of the CLK with
CAS low.
Enables column access.
WE Write Enable Enab les write operation and row precharge.
Latches d ata i n starting from CAS , WE active.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 4/46
PIN NAME INPUT FUNCTION
DQM0~3 Data Input / Output Mask Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when DQM active.
DQ0 ~ DQ31 Data Input / Output Data in puts / outputs are mu ltiplexed on the same pins.
VDD / VSS Power Supply / Ground Power and ground for the input buffers and the core logic.
VDDQ / VSSQ Data Output Power / Ground Isolated power supply and ground for the output buffers to provide
improve d noise immunity.
N.C No Con nection This pin is recommended to be left No Connection on the device.
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Value Unit
Voltage on any pin relative to VSS VIN, VOUT -1.0 ~ 3.6 V
Voltag e on VDD supply relative to VSS VDD, VDDQ -1.0 ~ 3.6 V
Storage temperature TSTG -55 ~ +150 C°
Power dissipation PD 1 W
Short circuit current IOS 50 mA
Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATING are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommende d voltage for extende d periods of time could affect device reliability.
DC OPERATING CONDITION
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70 C°)
Parameter Symbol Min Typ Max Unit Note
Supply voltage VDD, VDDQ 2.375 2.5 2.7 V
Input log ic high voltage VIH 0.8 * VDDQ - VDDQ+0.3 V 1
Input log ic low voltage VIL -0.3 0 0.3 V 2
Output logic h igh voltage VOH VDDQ -0.2 - - V IOH = -0.1mA
Output logic l ow voltage VOL - - 0.2 V IOL = 0.1mA
Input leakage current IIL -5 - 5 μA 3
Output leaka ge current IOL -5 - 5 μA 4
Note: 1. VIH(max) = 3.0V AC for pulse width ≤ 3ns acceptable.
2. VIL(min) = -1.0V AC for pulse width ≤ 3ns acceptable.
3. Any input 0V ≤ V
IN
≤
VDDQ, all other pins are not under test = 0V.
4. Dout is disabled , 0V
≤
VOUT ≤ VDD.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 5/46
CAPACITANCE (VDD = 2.5V, TA = 25 C°, f = 1MHZ)
Parameter Symbol Min Max Unit
Input capacitance (A0 ~ A10, BA0 ~ BA1) CIN1 2.5 4 pF
Input capacitance
(CLK, CKE, CS, RAS , CAS, WE & DQM) CIN2 2.5 4 pF
Data input/output capacitance (DQ0 ~ DQ31) COUT 2 6.5 pF
DC CHARACTERISTICS
Recommended operating condition unless otherwise noted，TA = 0 to 70 C°
Version
Parameter Symbol Test Condition CAS
Latency -6 -7
Unit Note
Operating Current
(One Bank Active) I
CC1 Burst Length = 1
tRC ≥tRC(min)
IOL = 0 mA 100 80 mA 1,2
ICC2P CKE ≤VIL(max), tcc = 15ns 1.5
Precharge Standby Current
in powe
r
-down mode I
CC2PS CKE & CLK
≤
VIL(max), t cc =
∞
1.5 mA
ICC2N CKE ≥VIH(min), CS ≥ VIH(min), tcc = 15ns
Input signals are changed one time during 30ns 20
Precharge Standby Current
in non power-down mode I
CC2NS CKE≥VIH(min), CLK
≤
VIL(max), tcc =
∞
input signals are stable 10
mA
ICC3P CKE ≤VIL(max), tcc = 15ns 10
Active Standby Current
in powe
r
-down mode ICC3PS CKE & CLK
≤
VIL(max), t cc =
∞
10
mA
ICC3N CKE ≥VIH(min), CS ≥ VIH(min), tCC=15ns
Input signals are changed one time during 2clks
All other pins ≥ V
DD-0.2V or ≤ 0.2V
30 mA
Active Standby Current
in non power-down mode
(One Bank Active)
I
CC3NS CKE≥VIH(min), CLK
≤
VIL(max), tcc =
∞
input signals are stable 10 mA
3 200 180
Operating Current
(Burst Mode)
I
CC4 IOL = 0 mA
Page Burst
2 Banks activated 2 180 160
mA
1,2
Refresh Current ICC5 tRC ≥tRC(min) 200 180 mA
Self Refresh Current ICC6 CKE≤0.2V 2 mA
Note : 1. Measured with outputs open.
2. Input signals are changed one time during 2 CLKS.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 6/46
AC OPERATING TEST CON DITIONS (VDD = 2.5V±0.2V ，TA = 0 to 70 C°)
Parameter Value Unit
Input leve ls (Vih/Vil) 0.9 * VDDQ / 0.2 V
Input timing measurement reference level 0.5 * VDDQ V
Input rise an d fall-time tr/tf = 1/1 ns
Output timing measurement reference leve l 0.5 * VDDQ V
Output load condition See Fig. 2
(Fig. 1) DC Output Load Circuit (Fig. 2) AC Output Load Circuit
OPERATING AC PARAMETER
(AC operating conditions unle ss otherwise noted)
Version
Parameter Symbol
-6 -7
Unit Note
Row active to row active delay tRRD(min) 12 14 ns 1
RAS to CAS delay t
RCD(min) 18 20 ns 1
Row precharge time tRP(min) 18 20 ns 1
tRAS(min) 42 42 ns 1
Row active time t
RAS(max) 100 us
Row cycle time @ Operatin g tRC(min) 60 63 ns 1
Last data in to col. address delay tCDL(min) 1 CLK 2
Last data in to row precharge tRDL(min) 2 CLK 2
Last data in to burst stop tBDL(min) 1 CLK 2
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 7/46
Version
Parameter Symbol
-6 -7
Unit Note
Col. ad dress to col. address delay tCCD(min) 1 CLK 3
CAS latency = 3 2
Number of va lid
Output data CAS latency = 2 1
ea 4
Note : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then
rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle c olumn address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
AC CHARACTERISTICS (AC operating condition unless otherwise noted)
-6 -7
Parameter Symbol Min Max Min Max Unit Note
CAS latency = 3 6 7
CLK cycle time CAS latency = 2 tCC 10 1000 10 1000 ns 1
CAS latency = 3 5.5 6 CLK to vali d
output delay CAS latency = 2 tSAC 6 6
ns 1,2
CAS latency = 3 2 2 Output data
hold time CAS latency = 2 tOH 2 2 ns 2
CLK high pulsh width tCH 2.5 2.5 ns 3
CLK low pulsh width tCL 2.5 2.5 ns 3
Input setup ti me tSS 1.5 2 ns 3
Input hol d time tSH 1 1 ns 3
CLK to output in Low-Z tSLZ 1 1 ns 2
CAS latency = 3 5.5 6 CLK to output
in Hi-Z CAS latency = 2 tSHZ 6 6
ns
Note : 1. Parameters depend o n programmed CAS latency.
2. If clock rising time is longer than 1ns. (tr/2 - 0.5) ns should be considered.
3. Assumed input rise and fall time (tr & tf) =1ns.
If tr & tf is longer than 1ns. transient time compensation should be considered.
i.e., [(tr + tf)/2 – 1] ns should be added to the parameter.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 8/46
SIMPLIFIED TRUTH TABLE
COMMAND CKEn-1 CKEn CS RAS CAS WE DQM BA0,1 A10/AP A9~A0 Note
Register Mode Register set H X L L L L X OP CODE 1,2
Auto Refresh H 3
Entry H L L L L H X X 3
L H H H X 3
Refresh Self
Refresh Exit L H H X X X X X 3
Bank Active & Row Addr. H X L L H H X V Row Address
Auto Precharge Disable L 4
Read &
Column Address Auto Precharge Enab le H X L H L H X V H
Column
Address
(A0~A7) 4,5
Auto Precharge Disable L 4
Write &
Column Address Auto Precharge Enab le H X L H L L X V H
Column
Address
(A0~A7) 4,5
Burst Stop H X L H H L X X 6
Bank Selection V L
Precharge All Banks H X L L H L X
X H X
H X X X
Entry H L
L V V V X
Clock Suspend or
Active Power Down
Exit L H
X X X X X
X
H X X X
Entry H L
L H H H X
H X X X
Precharge Power Down Mode
Exit L H
L V V V X
X
DQM H X V X 7
H X X X
No Operating Command H X L H H H X X
(V = Valid , X = Don’t Care. H = Logic High , L = Logic Low )
Note : 1.OP Code : Operating Code
A0~A10 & BA0~BA1 : Program keys. (@ MRS)
2.MRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3.Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge of command is meant by “Auto”.
Auto/self refresh can be issued only at all banks precharge state.
4.BA0~BA1 : Bank select addresses.
If both BA1 and BA0 are “Low” at read ,write , row active and precharge ,bank A is select ed.
If both BA1 is “Low” and BA0 is “High” at read ,write , row active and precharge ,bank B is selected.
If both BA1 is “High” and BA0 is “Low” at read ,write , row active and precharge ,bank C is selected.
If both BA1 and BA0 are “High” at read ,write , row active and precharge ,bank D is selected
If A10/AP is “High” at row precharge , BA1 and BA0 is ignored and all ba nks are selected.
5.During burst read or write with auto precharge. new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issue d at tRP after the end of burst.
6.Burst stop command is valid at every burst length.
7.DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK ( writ e DQM late ncy is 0), but
makes Hi-Z state the data-out of 2 CLK cycles after.(Read DQM latency is 2)
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 9/46
MODE REGISTER FIELD TABLE TO PROGRAM MODES
Register Programmed with MRS
Address BA0~BA1 A10/AP A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Function RFU RFU W.B.L TM CAS Latency BT Burst Length
Test Mo de CAS Latency Burst Type Burst Length
A8 A7 Type A6 A5 A4 Latency A3 Type A2 A1 A0 BT = 0 BT = 1
0 0 Mode Register Set 0 0 0 Reserved 0 Sequential 0 0 0 1 1
0 1 Reserved 0 0 1 Reserved 1 Interleave 0 0 1 2 2
1 0 Reserved 0 1 0 2 0 1 0 4 4
1 1 Reserved 0 1 1 3
0 1 1 8 8
Write Burst Length 1 0 0 Reserved 1 0 0 Reserved Reserved
A9 Length 1 0 1 Reserved 1 0 1 Reserved Reserved
0 Burst 1 1 0 Reserved 1 1 0 Reserved Reserved
1 Single Bit 1 1 1 Reserved
1 1 1 Full Page Reserved
Full Page Length : 256
Note : 1. RFU(Reserved for future use) should stay “0” during MRS cycle.
2. If A9 is high during MRS cycle, “ Burst Read single Bit Write” function will be e nabled.
3. The full column burst (256 bit) is available only at sequential mode of burst type.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 10/46
BURST SEQUENCE (BURST LENGTH = 4)
Initial Address
A1 A0 Sequential Interleave
0 0 0 1 2 3 0 1 2 3
0 1 1 2 3 0 1 0 3 2
1 0 2 3 0 1 2 3 0 1
1 1 3 0 1 2 3 2 1 0
BURST SEQUENCE (BURST LENGTH = 8)
Initial
A2 A1 A0 Sequential Interleave
0 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7
0 0 1 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6
0 1 0 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5
0 1 1 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4
1 0 0 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3
1 0 1 5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2
1 1 0 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1
1 1 1 7 0 1 2 3 4 5 6 7 6 5 4 3 2 1 0
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 11/46
DEVICE OPERATIONS
CLOCK (CLK)
The clock input is used as the reference for all SDRAM
operations.All operations are synchronized to the positive
going edge of the clock. The clock transitions must be
monotonic between VIL and VIH. During operation with CKE
high all inputs are assumed to be in valid state (low or high) for
the duration of setup and hol d time aroun d positive edge of the
clock for proper functionality and Icc specifications.
CLOCK ENABLE(CKE)
The clock enable (CKE) gates the clock onto SDRAM. If CKE
goes low synchronously with clock (set-up and hold time same
as other inputs), the internal clock suspended from the next
clock cycle and the state of output and burst address is frozen
as long as the CKE remains low. All other inputs are ignored
from the next clock cycle after CKE goes low. When all banks
are in the idle state and CKE goes low synchronously with
clock, the SDRAM enters the power down mode from the next
clock cycle. The SDRAM remains in the power down mode
ignoring the other inputs as long as CKE remains low. The
power down exit is synchronous as the internal clock is
suspended. When CKE goes high at least “1CLK + tSS” before
the high going edge of the clock, then the SDRAM becomes
active from the same clock edge accepting all the input
commands.
BANK A DDRESSES (BA0~BA1)
This SDRAM is organized as four independent banks of
524,288 words x 32 b its memor y arrays. The BA0~BA1 i nputs
are latched at the time of assertion of RAS and CAS to
select the bank to be used for the operation. The banks
addressed BA0~BA1 are latched at bank active, read, write,
mode register set and precharge operations.
ADDRESS INPUTS (A0~A10)
The 19 address bits are required to decode the 524,288 word
locations are multiplexed into 11 address input pins (A0~ A10).
The 11 row addresses are latched along with RAS and
BA0~BA1 during bank active command. The 8 bit column
addresses are latched along with CAS, WE and BA0~BA1
during read or with command.
NOP and DEVICE DESELECT
When RAS , CAS and WE are high , The SDRAM
performs no operation (NOP). NOP does not initiate any new
operation, but is needed t o complete operations which require
more than single clock cycle like bank activate, burst read,
auto refresh, etc. The device deselect is also a NOP and is
entered by asserting CS high. CS high disables the
command decoder so that RAS , CAS , WE and all the
address inputs are ignored.
POWER-UP
1.Apply power and start clock, Attempt to maintain CKE =
“H”, DQM = “H” and the other pins are NOP condition at
the inputs.
2.Maintain stable power, stable clock and NOP input
condition for minimum of 200us.
3.Issue precharge commands for all banks of the devices.
4.Issue 2 or more auto-refresh commands.
5.Issue a mode register set command to initialize the
mode register.
cf.) Sequence of 4 & 5 is regardless of the order.
The device is now ready for normal operatio n.
MODE REGISTER SET (MRS)
The mode register stores the data for controlling the
various operating modes of SDRAM. It programs the
CAS latency, burst type, burst length, test mode and
various vendor specific options to make SDRAM useful
for variety of different applications. The default value of
the mode register is not defined, therefore the mode
register must be written after power up to operate the
SDRAM. The mode register is written by asserting low
on CS , RAS , CAS and WE (The SDRAM should
be in active mode with CKE already high prio r to writing
the mode register). The state of address pins A0~A10
and BA0~BA1 in the same cycle as CS , RAS , CAS
and WE going low is the data written in the mode
register. Two clock cycles is required to complete the
write in the mode register. The mode register contents
can be changed using the same command and clock
cycle requirements during operation as long as all
banks are in the idle state. The mode register is divided
into various fields into depending on functionality. The
burst length field uses A0~A2, burst type uses A3, CAS
latency (read latency from column address) use A4~A6,
vendor specific options or test mode use A7~A8,
A10/AP and BA0~BA1, A7~A9, A10/AP and BA0~BA1
must be set to low for normal SDRAM operation. Refer
to the table for specific codes for various burst length,
burst type and CAS latencies.
BANK ACTIVATE
The bank activate command i s used to select a random
row in an idle bank. By asserting low on RAS and
CS with desired row and bank address, a row access
is initiated. The read or write operation can o ccur after a
time delay of tRCD (min) from the time of bank activation.
tRCD is the internal timing parameter of SDRAM,
therefore it is dependent on operating clock frequency.
The minimum number of clock c ycles re quired between
bank activate and read or write command should be
calculated by dividing tRCD (min) with cycle time of the
clock and then rounding of the result to the next higher
integer.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 12/46
DEVICE OPERATIONS (Continued)
The SDRAM has four internal banks in the same chip and
shares part of the internal circuitry to reduce chip area,
therefore it restricts the activation of four banks
simultaneously. Also the noise generated during sensing of
each bank of SDRAM is high requiring some time for power
supplies to recover before another bank can be sensed
reliably. tRRD (min) specifies the minimum time required between
activating different bank. The number of clock cycles required
between different bank activation must be calculated similar to
tRCD (min) specification. T he minimum time required for the bank
to be active to initiate sensing and restoring the complete row
of dynamic cells is determined by tRAS (min). Every SDRAM bank
activate command must satisfy tRAS (min) specification before a
precharge command to that active bank can be asserted. The
maximum time any bank can be in the active state is
determined by tRAS (max) and tRAS (max) can be calculated
similar to tRCD specification.
BURST READ
The burst read command is used to access burst of data on
consecutive clock cycles from an active row in an active bank.
The burst read command is issued by asserting low on CS
and RAS with WE being high on the positive edge of the
clock. The bank must be active for at least tRCD (min) before the
burst read command is issued. The first output appears in CAS
latency number of clock cycles after the issue of burst read
command. The burst length, burst sequence and latency from
the burst read command is determined by the mode register
which is already programmed. The burst read can be initiated
on any column address of the active row. The address wraps
around if the initial address does not start from a boundary
such that number of outputs from each I/O are equal to the
burst length programmed in the mode register. The output
goes into high-impedance at the end of burst, unless a new
burst read was initiated to keep the data output gapless. The
burst read can be terminated by issuing another burst read or
burst write in the same bank or the other active bank or a
precharge command to the same bank. The burst stop
command is valid at every page burst length.
BURST WRITE
The burst write command is similar to burst read command
and is used to write data into the SDRAM on consec utive clock
cycles in adjacent addresses depending on burst length and
burst sequence. By asserting low on CS , CAS and WE
with valid column address, a write burst is initiated. The data
inputs are provided for the initial address in the same clock
cycle as the burst write command. The input buffer is
deselected at the end of the burst length, even though the
internal writing can be completed yet. The writing can be
complete by issuing a burst read and DQM for blocking data
inputs or burst write in the same or another active bank. The
burst stop command is valid at every burst length. The write
burst can also be terminated by using DQM for blocking data
and procreating the bank tRDL after the last data input to be
written into the active row. See DQM OPERATION also.
DQM OPERATION
The DQM is used mask input and output operations. It
works similar to OE during operation and inhibits writing
during write operation. The read latency is two cycles from
DQM and zero cycle for write, which means DQM masking
occurs two cycles later in read cycle and occurs in the
same cycle during write cycle. DQM operation is
synchronous with the clock. The DQM signal is important
during burst interrupts of write with read or precharge in
the SDRAM. Due to asynchronous nature of the internal
write, the DQM operation is critical to avoid unwanted or
incomplete writes when the complete burst write is
required. Please refer to DQM timing diagram also.
PRECHARGE
The precharge is performed on an active bank by
asserting low on clock cycles required between bank
activate and clock cycles required between bank activate
and CS, RAS , WE and A10/AP with valid BA0~BA1
of the bank to be procharged. The precharge command
can be asserted anytime after tRAS (m in) is satisfy from the
bank active command in the desired bank. tRP is defined
as the minimum number of clock cycles required to
complete row precharge is calculated by dividing tRP with
clock cycle time and rounding up to the next higher
integer. Care should be taken to make sure that burst
write is completed or DQM is used to inhibit writing before
precharge command is asserted. The maximum time any
bank can be active is specified by tRAS (max). Therefore,
each bank activate command. At the end of precharge,
the bank enters the idle state and is ready to be activated
again. Entry to power-down, Auto refresh, Self refresh and
Mode register set etc. is possible only when all banks are
in idle state.
AUTO PRECHARGE
The precharge operation can also be performed by using
auto precharge. The SDRAM internally generates the
timing to satisfy tRAS (min) and “tRP” for the programmed
burst length and CAS latency. The auto precharge
command is issued at the same time as burst write by
asserting high on A10/AP, the bank is pr echarge comm an d
is asserted. Once auto precharge command is given, no
new commands are possible to that particular bank until
the bank achieves idle state.
ALL BANKS PRECHARGE
Four banks can be precharged at the same time by using
Precharge all command. Asserting low on CS , RAS ,
and WE with high on A10/AP after all banks have
satisfied tRAS (min) requirement, performs precharge on all
banks. At the end of tRP after performing precharge all, all
banks are in idle state.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 13/46
DEVICE OPERATIONS (Continued)
AUTO REFRESH
The storage cells of SDRAM nee d to be refreshed every 64ms
to maintain data. An auto refresh cycle accomplishes refresh of
a single row of storage cells. The internal counter increments
automatically on every auto refresh cycle to refresh all the
rows. An auto refresh command is issued by asserting low on
CS, RAS and CAS with high on CKE and WE . The auto
refresh command can only be asserted with all banks being in
idle state and the device is not in power down mode (CKE is
high in the previous cycle). The time required to complete the
auto refresh operation is specified by tRC (min). The minimum
number of clock cycles required can be calculated by driving
tRC with clock cycle time and them rounding up to the next
higher integer. T he auto refresh command must be follo wed by
NOP’s until the auto refresh operation is completed. The auto
refresh is the preferred refresh mode when the SDRAM is
being used for normal data transactions. The auto refresh
cycle can be performed once in 15.6us.
SELF REFRESH
The self refresh is another refresh mode available in the
SDRAM. The self refresh is the preferred refresh mode for
data retention and low power operation of SDRAM. In self
refresh mode, the SDRAM disables the internal clock an d
all the input buffers except CKE. The refresh addressing
and timing is internally generated to reduce power
consumption.
The self refresh mode is entered from all banks idle state
by asserting low on CS , RAS , CAS and CKE with
high on WE . Once the self refresh mod e is entered, only
CKE state being low matters, all the oth er inputs including
clock are ignored to remain in the refresh.
The self refresh is exited by restarting the external clock
and then asserting hi gh on C KE. This must be follo wed by
NOP’s for a minimum time of tRC before the SDRAM
reaches idle state to begin normal op eration. 4K cycles of
burst auto refresh is required immediately before self
refresh entry and immediately after self refresh exit.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 14/46
COMMANDS
Mode register set command
(
CS ,RAS ,CAS , WE = Low)
The DRAM has a mode register that defines how the device operates. In this
command, A0 through A10 and BA0~BA1 are the data input pins. After power on, the
mode register set command must be executed to initialize the device.
The mode register can be set only when all banks are in idle state.
During 2CLK following this command, the DRAM cannot accept any other
commands.
Activate command
(CS ,RAS = Low,CAS , WE = High)
The DRAM has four banks, each with 2,048 rows.
This command activates the bank selected by BA1 and BA0 and a row address
selected by A0 through A10.
This command corresponds to a conventional DRAM’s RAS falling.
Precharge command
(CS ,RAS , WE = Low,CAS = High )
This command begins pr echarge operation of the bank selected by BA1 and BA0.
When A10 is High, all banks are prech arged, regardless of BA1 and BA0. When A10
is Low, only the bank selected by BA1 and BA0 is precharged.
After this command, the DRAM can’t accept the activate command to the
precharging bank during tRP (precharge to activate command period).
This command corresponds to a conventional DRAM’s RAS rising.
CLK
CLK
CKE
CKE
CS
CS
RAS
RAS
WE
WE
BA0, BA1
(Bank select)
A10
A10
Add
Add
CAS
CAS
H
H
Row
Row
Fig. 1 Mode re gister set
command
Fig. 2 Row address stroble and
bank active command
CLK
CKE
BA0, BA1
(Bank select)
A10
(Precharg e select)
Add
H
F ig. 3 Precharge command
BA0, BA1
(Bank sel ect)
CS
RAS
WE
CAS
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 15/46
Write command
(
CS ,CAS , WE = Low, RAS = High)
If the mode register is in the burst write mode, this command sets the burst start
address given by the column address to begin the burst write operation. The first
write data in burst can be input with this command with subsequent data on following
clocks.
Read command
(
CS , CAS = Low, RAS , WE = High)
Read data is available afterCAS l atency requirements have been met.
This command sets the burst start address given by the column address.
CBR (auto) refresh command
(
CS , RAS , CAS = Low, WE , CKE = High)
This command is a request to begin the CBR refresh operation. The refresh
address is generated internally.
Before executing CBR refresh, all banks must be precharged.
After this cycle, all banks will be in the idle (precharged) state and ready for a
row activate command.
During tRC period (from refresh command to refresh or activate command), the
DRAM cannot accept any other comman d.
CLK
CLK
CKE
CKE
CS
RAS
WE
BA0, BA1
(Ban k select)
BA0, BA1
(Ban k select)
A10
A10
Add
Add
CAS
H
H
Col.
Fig. 4 Column ad dre ss and
write command
Fig. 5 Col umn ad dre ss and
read command
CLK
CKE
BA0, BA1
(Bank select)
A10
Add
H
Fi g. 6 Au to re fre sh co mmand
Col.
CS
RAS
WE
CAS
CS
RAS
WE
CAS
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 16/46
Self refresh entry command
(
CS ,RAS ,CAS, CKE = Low , WE = High)
After the command execution, self refresh operation continues while CKE
remains low. When CKE goes to high, the DRAM exits the self refresh mode.
During self refresh mode, refresh interval and refresh opera tion are performed
internally, so there is no need for exter nal control.
Before executing self refresh, all banks must be precharged.
Burst stop command
(
CS , WE = Low,RAS ,CAS = High)
This command terminates the current burst operation.
Burst stop is valid at every burst length.
No operation
(CS = Low ,RAS ,CAS , WE = High)
This command is not a execution command. No op erations begin or terminate by
this command.
CLK
CKE
CS
RAS
WE
BA0, BA1
(Bank sel ect)
A10
Add
CAS
CLK
CKE
BA0, BA1
(Bank sel ect)
A10
Add
H
Fig. 7 Self ref resh entry
command
Fi g. 8 Burst sto p command
CLK
CKE
BA0, BA1
(Bank select)
A10
Add
H
Fi g. 9 No ope ration
CS
RAS
WE
CAS
CS
RAS
WE
CAS
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 17/46
BASIC FEATURE AND FUNCTION DESCRIPTIONS
1. CLOCK Suspend
2. DQM Operation
*Note : 1. CKE to CLK disable/enable = 1CLK.
2. DQM masks data out Hi-Z after 2CLKs which should masked by CKE ”L”.
3. DQM masks both data-in and data-out.
CLK
CMD
CKE
Internal
CLK
DQ(CL2)
DQ(CL3)
RD
Q2
Q0 Q1 Q3
Q2
Q0 Q1 Q3D0 D1 D2 D3
D1 D2 D3
D0
WR
Masked by CKE
1) Clock Suspended Du
r
ing W
r
ite (BL=4) 2) Clock Suspended During Read (BL=4)
Not Written Suspended Dout
CLK
CMD
DQM
DQ(CL2)
DQ(CL3)
RD
Q0 Q2 Q3
Q1 Q2 Q3
D0 D1 D3
D1 D3
D0
WR
Masked by DQM
Masked by DQM
CLK
CMD
DQM
DQ(CL2)
DQ(CL3)
CKE
RD
Q0 Q2 Q4
Hi-Z Hi-Z Hi-Z Q6 Q7 Q8
Q5 Q6 Q7
Q1 Q3
Hi-Z Hi-Z Hi-Z
Hi-Z
Hi-Z
1)Write Mask (BL=4) 2)Read Mask (BL=4)
DQM to Data-in Mask=0 DQM to Data-out Mask=2
3)DQM with clcok suspended (Full Page Read) *Note2
Internal
CLK
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 18/46
3. CAS Interrupt (I)
*Note : 1. By “interrupt” is meant to stop burst read/write by external before the end of burst.
By ” CAS interrupt ”, to stop burst read/write by CAS access ; read and write.
2. tCCD :CAS to CAS delay. (=1CLK)
3. tCDL : Last data in to new column address delay. (=1CLK)
CLK
CMD
ADD
DQ(CL2)
DQ(CL3)
RD
QB0 QB2
QA0
CLK
CMD
ADD
DQ
WR
DA0 DB0 DB1
RD
A B
QB1 QB3
QB0 QB2
QA0 QB3
QB1
tCCD
*Note 2
WR
tCCD *Note 2
AB
tCDL
*Note 3
WR RD
tCCD *Note 2
AB
DA0 DQ0 DQ1
tCDL
*Note 3
DA0 DQ0 DQ1
DQ(CL3)
DQ(CL2)
1)Read interrupted by Read (BL=4)
2)Write interrupted by Write (BL=2) 3)Write interrupted by Read (BL=2)
*Note1
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 19/46
4. CAS Interrupt (II) : Read Interrupted by Write & DQM
CLK
i)CMD
DQM
DQ D1 D3
D0 D2
WR
ii)CMD
DQM
DQ
iii)CMD
DQM
DQ
iv)CMD
DQM
DQ
D1 D3
D0 D2
RD WR
RD WR
D1 D3
D0 D2
D1 D3
D0 D2
RD WR
Hi-Z
Q0 *Note1
Hi-Z
Hi-Z
Hi-Z
(a)CL=2,BL=4
RD
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 20/46
*Note : 1. To prevent bus contention, there should be at least one gap between data in and data out.
5. Write Interrupted by Precharge & DQM
*Note : 1. To prevent bus contention, DQM should be issued which makes at least one gap between data in and data out.
2. To inhibit invalid write, DQM should be issued.
3. This precharge command and burst write command should be of the same bank, otherwise it is not precharge interrupt
but only anoth er bank precharge of four banks operation.
CLK
i)CMD
ii)CMD
iii)CMD
iv)CMD
DQM
DQM
DQM
DQM
DQ
DQ
DQ
DQ
D1 D3
D1
D0 D2
D3
D0 D2
WR
(b)CL=3,BL=4
RD WR
RD WR
D1 D3
D0 D2
D1 D3
D0 D2
RD WR
Hi-Z
D1 D3
D0 D2
Q0 *Note1
v)CMD
DQM
DQ
RD WR
Hi-Z
RD
CLK
CMD
DQM
DQ D0 D1 D2
WR *Note3
*Note2
Masked by DQM
D3
1
)
No
r
mal W
r
ite
(
BL=4
)
tRDL(min)
PRE
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 21/46
6. Precharge
.
7. Auto Precharge
*Note : 1. tRDL : Last data in to row precharge delay.
2. Number of valid output data after row precharge : 1,2 for CAS Latency = 2,3 respectively.
3. The row active command of the precharge bank can be issued after tRP from this point.
The new read/write command of other activated bank can be issued from this point.
At burst read/write with auto precharge, CAS interrupt of the same/another bank is illegal.
CLK
CMD
DQ D0 D1 D2 D3
WR
CLK
CMD
DQ(CL2) Q0 Q1 Q2 Q3
RD
DQ(CL3)
*Note3
Auto Precharge starts
Q0 Q1 Q2 Q3
*Note3
Auto Precharge starts
1
)
No
r
mal W
r
ite
(
BL=4
)
2
)
No
r
mal Read
(
BL=4
)
tRDL
CLK
DQ D0 D1 D2 D3
WR
tRDL
*Note1
CLK
CMD
CMD
DQ(CL2) Q0 Q1 Q2
2*Note2
1*Note2
Q3
RD PRE
DQ(CL3) Q0 Q1 Q2 Q3
PRE
1)Normal Write (BL=4) 2)No
r
mal Read (BL=4)
CL=2
PRE CL=3
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 22/46
8. Burst Stop & Interrupted by Precharge
9. MRS
*Note: 1. tRDL : 2 CLK; Last data in to Row Precharge.
2. t
BDL : 1 CLK ; Last data in to burst stop delay.
3. Number of valid output data after burst stop : 1,2 for CAS latency = 2,3 respectiviely.
4. PRE : All banks precharge, if necessary.
MRS can be issued only at all banks precharge state.
CLK
CMD PRE
*Note4
MRS ACT
tRP 2CLK
1
)
Mode Re
g
iste
r
Set
CLK
CMD
DQ(CL2)
DQ(CL3)
CLK
CMD
DQM
DQ D0 D1 D2 D3
WR STOP
*Note2
Q0 Q1
Q0 Q1
RD STOP
*Note3
1)Write Burst Stop (BL=8)
2)Read Burst Stop (BL=4)
D5D4
CLK
CMD
CLK
CMD
DQM
DQ D0 D1 Mask
WR
RD PRE
1)Write interrupted b
y
precharge (BL=4)
2)Read interrupted by precharge (BL=4)
PRE
*Note1
tRDL
tBDL
D2
DQ(CL3)
Q0 Q1
DQ(CL2)
Q1Q0
*Note3
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 23/46
10. Clock Suspend Exit & Power Down Exit
11. Auto Refresh & Self Refresh
*Note : 1. Active power down : one or more banks active state.
2. Precharge power down : all banks precharge state.
3. The auto ref resh is the same as CBR refresh of conventional DRAM.
No precharge commands are required after auto refresh command.
During tRC from auto refresh command, any other command can not be accepted.
4. Before executing auto/self refresh command, all banks must be idle state.
5. MRS, Bank Active, Auto/Self Refresh, Power Down Mode Entry.
6. During self refresh entry, refresh interval and refresh operation are performed internally.
After self refresh entry, self refresh mode is kept while CKE i s low.
During self refresh entry, all inputs expect CKE will be don’t cared, and outputs will be in Hi-Z state.
For the time interval of tRC from self refresh exit command, any other command can not be accepted.
4K cycles of burst auto refresh is required immediately before self refresh entry and immediately after self refresh exit.
CLK
CKE
Internal
CLK
CMD RD
tSS
*Note1
CLK
CKE
Internal
CLK
CMD ACT
tSS
*Note2
NOP
1)Clock Suspend(=
A
ctive Powe
r
Down)Exit 2)Powe
r
Down (=P
r
echa
r
ge Powe
r
Down)
CLK
CMD PRE AR
CKE
CMD
tRP tRC
*Note5
*Note4
CLK
CMD PRE SR
CKE
CMD
tRP tRC
*Note4
1)Auto Refresh & Self Refresh *Note3
2)Self Refresh *Note8
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 24/46
12. About Burst Type Control
Sequential Counting
At MRS A3 = “0”. See the BURST SEQUENCE TABLE. (BL = 4,8)
BL = 1, 2, 4, 8 and full page.
Basic
MODE
Interleave Counting At MRS A3 = “1”. See the BURST SEQUENCE TABLE. (BL = 4,8)
BL = 4, 8 At BL =1, 2 interleave Counting = Sequential Counting
Random
MODE
Random Column Access
tCCD = 1 CLK Every cycle Read/Write Command with random column address can realize Ra ndom
Column Access.
That is similar to Extended Data Out (EDO) Operation of conventional DRAM.
13. About Burst Length Control
1 At MRS A210 = “000”
At auto precharge . tRAS should not be violated.
2 At MRS A210 = “001”
At auto precharge . tRAS should not be violated.
4 At MRS A210 = “010”
8 At MRS A210 = “011”
Basic
MODE
Full Page At MRS A210 = “111”
At the end of the burst length , burst is warp-around.
Random
MODE Burst Stop t
BDL = 1, Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.
Using burst stop command, any burst length control is possible.
RAS Interrupt
(Interrupted by
Precharge)
Before the end of burst. Row precharge command of the same bank stops read /write burst
with auto precharge.
t
RDL = 1 with DQM , Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.
During read/write burst with auto precharge, RAS interrupt can not be issued.
Interrupt
MODE
CAS Interrupt Before the end of burst, new read/write stops read/write burst and starts new read/write
burst.
During read/write burst with auto precharge, CAS interrupt can not be issued.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 25/46
FUNCTION TURTH TABLE (TABLE 1)
Current
State CS RAS CAS WE BA ADDR ACTION Note
H X X X X X NOP
L H H H X X NOP
L H H L X X ILLEGAL 2
IDLE L H L X BA CA, A10/AP ILLEGAL 2
L L H H BA RA Row (&Bank) Active ; Latch RA
L L H L BA A10/AP NOP 4
L L L H X X Auto Refresh or Self Refresh 5
L L L L OP code OP code Mode R egister Access 5
H X X X X X NOP
L H H H X X NOP
L H H L X X ILLEGAL 2
Row L H L H BA CA, A10/AP Begin Read ; latch CA ; determine AP
Active L H L L BA CA, A10/AP Begin Write ; latch CA ; determine AP
L L H H BA RA ILLEGAL 2
L L H L BA A10/AP Precharge
L L L X X X ILLEGAL
H X X X X X NOP (Continue Burst to E nd Æ Row Active)
L H H H X X NOP (Continue Burst to End Æ Row Active)
L H H L X X Term burst Æ Row active
Read L H L H BA CA, A10/AP Term burst, New Read, Determine AP
L H L L BA CA, A10/AP Term burst, New Write, Determine AP 3
L L H H BA RA ILLEGAL 2
L L H L BA A10/AP Term burst, Precharge timing for Reads
L L L X X X ILLEGAL
H X X X X X NOP (Continue Burst to E nd Æ Row Active)
L H H H X X NOP (Continue Burst to End Æ Row Active)
L H H L X X Term burst Æ Row active
Write L H L H BA CA, A10/AP Term burst, New Read, Determine AP 3
L H L L BA CA, A10/AP Term burst, New Write, Determine AP 3
L L H H BA RA ILLEGAL 2
L L H L BA A10/AP Term burst, Precharge timing for Writes 3
L L L X X X ILLEGAL
H X X X X X NOP (Continue Burst to E nd Æ Precharge)
Read with L H H H X X NOP (Contin ue Burst to End Æ Precharge)
Auto L H H L X X ILLEGAL
Precharge L H L X BA CA, A10/AP ILLEGAL
L L H X BA RA, RA10 ILLEGAL 2
L L L X X X ILLEGAL
H X X X X X NOP (Continue Burst to E nd Æ Precharge)
Write with L H H H X X NOP (Continue Burst to End Æ Precharge)
Auto L H H L X X ILLEGAL
Precharge L H L X BA CA, A10/AP ILLEGAL
L L H X BA RA, RA10 ILLEGAL 2
L L L X X X ILLEGAL
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 26/46
Current
State CS RAS CAS WE BA ADDR ACTION Note
H X X X X X NOP Æ Idle after tRP
L H H H X X NOP Æ Idle after tRP
Precharging L H H L X X ILLEGAL 2
L H L X BA CA ILLEGAL 2
L L H H BA RA ILLEGAL 2
L L H L BA A10/AP NOP Æ Idle after tRDL 4
L L L X X X ILLEGAL
H X X X X X NOP Æ Row Active after tRCD
L H H H X X NOP Æ Row Active after tRCD
Row L H H L X X ILLEGAL 2
Activating L H L X BA CA ILLEGAL 2
L L H H BA RA ILLEGAL 2
L L H L BA A10/AP ILLEGAL 2
L L L X X X ILLEGAL
H X X X X X NOP Æ Idle after tRC
L H H X X X NOP Æ Idle after tRC
Refreshing L H L X X X ILLEGAL
L L H X X X ILLEGAL
L L L X X X ILLEGAL
H X X X X X NOP Æ Idle after 2clocks
Mode L H H H X X NOP Æ Idle after 2clocks
Register L H H L X X ILLEGAL
Accessing L H L X X X ILLEGAL
L L X X X X ILLEGAL
Abbreviations : RA = Row Address BA = Bank Address
NOP = No Operation Command CA = Column Address AP = Auto Precharge
*Note : 1. All entries assume the CKE was active (High) during the precharge clock and the current clock cycle.
2. Illegal to bank in specified state ; Function may be legal in the bank indicated by BA, depending on the state of t he
bank.
3. Must satisfy bus contention, bus turn around, and/or write recovery requirements.
4. NOP to bank precharge or in idle state. May precharge bank indicated by BA (and A10/AP).
5. Illegal if any bank is not idle.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 27/46
FUNCTION TRUTH TABLE (TABLE2)
Current
State CKE
( n-1 ) CKE
n CS RAS CAS WE ADDR ACTION Note
H X X X X X X INVALID
L H H X X X X Exit Self Refresh Æ Idle after tRC (ABI) 6
Self L H L H H H X Exit Self Refresh Æ Idle after tRC (ABI) 6
Refresh L H L H H L X ILLEGAL
L H L H L X X ILLEGAL
L H L L X X X ILLEGAL
L L X X X X X NOP (Maintai n Self Refresh)
H X X X X X X INVALID
All L H H X X X X Exit Self Refresh Æ ABI 7
Banks L H L H H H X Exit Self Refresh Æ ABI 7
Precharge L H L H H L X ILLEGAL
Power L H L H L X X ILLEGAL
Down L H L L X X X ILLEGAL
L L X X X X X NOP (Maintain Low Power Mode)
H H X X X X X Refer to Table1
H L H X X X X Enter Power Down 8
H L L H H H X Enter Power Down 8
All H L L H H L X ILLEGAL
Banks H L L H L X X ILLEGAL
Idle H L L L H H RA Row (& Bank) Active
H L L L L H X Enter Self Refresh 8
H L L L L L OP Code Mode Register Access
L L X X X X X NOP
Any State H H X X X X X Refer to Operations in Table 1
other than H L X X X X X Begin Clock Suspend next cycle 9
Listed L H X X X X X Exit Clock Suspend next cycle 9
above L L X X X X X Maintain Clock Suspend
Abbreviations : ABI = All Banks Idle, RA = Row Address
*Note : 6.CKE low to high transition is asynchro nous.
7.CKE low to high transition is asynchronous if restart internal clock.
A minimum setup time 1CLK + tSS must be satisfy before any command other than exit.
8.Power down and self refr esh can be entered only from the all banks idle state.
9.Must be a legal command.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 28/46
Single Bit Read-Write-Read Cycle(Same Page) @ CAS Latency = 3,Burst Length = 1
: D o n ' t C a r e
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 6 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA0,BA1
tCH
tCL
tCC
tRAS
tRC tSH
tSS
tRCD
tSH
tSS
tSH
tSS
Row Active Read Write Read Row Active
Precharge
*Note2
tRP
tSS
Ra
tSH
Rb
tSH
tSS
tSH
tSS
tSS
tOH
tSLZ
tSAC
*Note3
*Note4*Note2,3
*Note2,3
*Note2,3
BS BS BS
Cb Cc
*Note3
Db
Qa
*Note3 *Note4
tSH
BS
BS BS
*Note1
HIGH
tCCD
Ra
*Note2
Ca
Qc
Rb
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 29/46
Note : 1. All input expect CKE & DQM can be don’t care when CS is high at the CLK high going edge.
2. Bank active @ read/write are controlled by BA0~BA1.
BA1 BA0 Active & Read/Write
0 0 Bank A
0 1 Bank B
1 0 Bank C
1 1 Bank D
3. Enable and disable auto precharge function are controlled by A10/AP in read/write command
A10/AP BA1 BA0 Operating
0 0 Disable auto precharge, leave A bank active at end of burst.
0 1 Disable auto precharge, leave B bank active at end of burst.
1 0 Disable auto precharge, leave C bank active at end of burst.
0
1 1 Disable auto prech arge, leave D bank active at end of burst.
0 0 Enable auto precharge , precharge bank A at end of burst.
0 1 Enable auto precharge , precharge bank B at end of burst.
1 0 Enable auto precharge , precharge bank C at end of burst.
1
1 1 Enable auto precharge , precharge bank D at end of burst.
4. A10/AP and BA0~BA1 control ba nk precharge when precharge is asserted.
A10/AP BA1 BA0 Precharge
0 0 0 Bank A
0 0 1 Bank B
0 1 0 Bank C
0 1 1 Bank D
1 X X All Banks
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 30/46
Power Up Sequence
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 6 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
tRP
Key RAa
BA1
BA0
RAa
High-Z
Precharge
(All Banks)
Auto Refresh Auto Refresh Mode Register Set
Row Active
(A-Bank)
: Don't care
tRC tRC
High level is necessary
High level is necessary
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 31/46
Read & Write Cycle at Same Bank @ Burst Length = 4
*Note : 1. Minimum row cycle times is required to complete internal DRAM operation.
2. Row precharge can interrupt burst on any cycle. [CAS Latency-1] number of valid output data is available after Row
precharge. Last valid output will be Hi-Z (tSHZ) after the clock.
3. Output will be Hi-Z after the end of burst. (1,2,4,8 & Full page bit burst)
tRCD
tRC
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA0
BA1
CL=2
CL=3
`
Ra Ca Rb Cb
Ra Rb
tOH
tOH
tSAC
tSAC
tSHZ
tSHZ
Read
Row Active Precharge
(A-Bank)
(A-Bank)
(A-Bank) Precharge
(A-Bank)
Write
(A-Bank)
Row Acti ve
(A-Bank)
*Note3
*Note3
: Don't care
*Note1
Qa0 Qa1
Qa2 Qa3
Db0 Db3
Db1 Db2
Qa0 Qa1
Qa2 Qa3
Db0 Db3
Db1 Db2
HIGH
*Note2
tRDL
tRDL
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 32/46
Page Read & Write Cycle at Same Bank @ Burst Length = 4
Note : 1. To Write data before burst read ends. DQM should be asserted three cycle prior to write command to avoid bus
contention.
2. Row precharge will interrupt writi ng. Last data input , tRDL before row precharge , will be written.
3. DQM should mask invalid i nput data on precharge command cycle when asserting precharge before end of burst . Input
data after Row precharge cycle will be masked internally.
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA1
BA0
CL =2
CL =3
*Note3
Row Active
( A - Bank ) Read
( A - Ba nk ) Read
( A - Bank ) Write
( A - Bank )
Write
( A - Bank ) Precharge
(A - Bank)
: D o n ' t C a r e
Qa0 Qa1 Qb0 Qb1 Dd0 Dd1
tCDL
Dc1
Dc0
Qa1 Qb0 Qb1 Qb2 Dc1 Dd0 Dd1
Dc0
Qa0
Ra
Cc Cd
Ra Ca Cb
*Note1
HIGH
tRCD
tRDL
*Note2
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 33/46
Page Read Cycle at Different Bank @ Burst Length = 4
Note: 1. CS can be don’t cared when RAS , CAS and WE are high at the clock high going edge.
2. To interrupt a burst read by row precharge, both the read and the precharge banks must be the same.
R o w A c t i v e
( A - B a n k )
R o w A c t i v e
( B - B a n k )
R e a d
( A - B a n k )
R o w A c t i v e
( C - B a n k )
R e a d
( B - B a n k )
P r e c h a r g e
( A - B a n k )
R o w A c t i v e
( D - B a n k )
R e a d
( C - B a n k )
P r e c h a r g e
( B - B a n k )
R e a d
( D - B a n k )
P r e c h a r g e
( C - B a n k )
P r e c h a r g e
( D - B a n k )
: D o n ' t C a r e
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 1819
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
CL=2
DQM
A10/AP
BA1
BA0
CL=3
RBb CAa RCc CBb RDd CCc CDd
*Note1
*Note2
RAa
RDd
QBb0 QBb2 QCc0 QCc1 QCc2 QDd0 QDd1
QDd2
QAa1
QAa0 QAa2 QBb1
QAa0 QAa1 QAa2 QBb0 QCc1 QCc2 QDd0 QDd2
QDd1QBb1 QCc0
QBb2
RAa RBb RCc
HIGH
DQ
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 34/46
Page Write Cycle at Different Bank @ Burst Length = 4
*Note : 1. To interrupt burst write by Row prechar ge , DQM should be asserted to mask invalid input data.
2. To interrupt burst write by Row precharge , both the write and the precharge banks must be the same.
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA1
BA0
: Don't care
*Note1
RAa RBb CAa CBb RDd CCc
RCc CDd
*Note2
DAa1DAa0 DBb0 DBb1 DBb3 DDd0 DDd1
DAa2 DBb2 DCc0 DCc1
RAa RBb RCc RDd
DAa3 CDd2
tCDL
R o w A c t i v e
( A - Bank )
R o w A c t i v e
( B - B a n k )
W r i t e
( A - B a n k ) W r i t e
( B - B a n k )
R o w A c t i v e
( C - B a n k ) W r i t e
( C - B a n k )
P r e c h a r g e
( A l l B a n k s )
R o w A c t i v e
( D - B a n k ) W r i t e
( D - B a n k )
HIGH
tRDL
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 35/46
Read & Write Cycle at Different Bank @ Burst Length = 4
*Note : 1. tCDL should be met to complete write.
2. tRCD should be met.
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA1
BA0
CL =2
CL =3
Row Active
(A-Bank) Read
(B-Bank)
: D o n ' t C a r e
QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3
DDb0
QAa0
RAa
CBcRAa CAa
QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3
DDb0
QAa0
Write
(D-Bank)
HIGH
RDb CDb RBc
RBb RAc
QBc0 QBc1 QBc2
QBc0 QBc1
Read
(A-Bank)
Row Active
(D-Bank)
Precharge
(A-Bank)
Row Active
(B-Bank)
tCDL
tRCD *Note1*Note2
192103 4 5 6 7 8 11 12 13 14 1715 18
16 19
0
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 36/46
Read & Write cycle with Auto Precharge @ Burst Length = 4
*Note : 1. tCDL should be controlled to meet minimum tRAS before internal precharge start.
(In the case of Burst Length = 1 & 2)
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA0
BA1
CL =2
CL =3
Row Active
( A - Bank )
Row Active
( D - Bank )
Read with
Auto Precharge
( A - Ban k )
Auto Precharge
Start Point
(D-Bank)
: D o n ' t C a r e
QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3
DDb0
QAa0
Ra
Cb
Ra Ca
Rb
Rb
QAa1 QAa2QAa3 Ddb1 DDb2 DDd3
DDb0
QAa0
Auto Precharge
Start Point
Write with
Auto Precharge
(D-Bank)
HIGH
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 37/46
Clock Suspension & DQM Operation Cycle @ CAS Letency = 2 , Burst Length = 4
*Note : 1. DQM is needed to prevent bus contention.
2. tRCD should be met.
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA1
BA0
Ra Ca Cb Cc
Ra
Qa0 Qa1 Qa2 Qa3
tSHZ
Qb1Qb0
tSHZ
Dc0 Dc2
*Note1
Row Active Read Clock
Supension Read
Read DQM
Write
Write
DQM
Clock
Suspension
Write
DQM
:Don't Care
19210
345678 11 12 13 14 17
15 1816 19
0
tRCD *Note2
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 38/46
Read interrupted by Precharge Command & Read Burst Stop Cycle @ Burst Length = Full page
*Note : 1. About the valid DQs after burst stop, it is same as the case of RAS interrupt.
Both cases are illustrated above timing diagram. See the lable 1,2 on them.
But at burst write, Burst stop and RAS interrupt should be compared carefully.
Refer the timing diagram of “Full page write burst stop cycles”.
2. Burst stop is valid at every burst length.
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA1
BA0
RAa CAa CAb
RAa
QAa0 QAa1 QAb1
QAb0 QAb2
Row Active
(A-Bank) Read
(A-Bank) Burst Stop Read
(A-Bank)
:Don't Care
HIGH
CL=2
CL=3
QAa2 QAa3 QAa4 QAb3 QAb4 QAb5
QAa0 QAa1 QAb1
QAb0 QAb2
QAa2 QAa3 QAa4 QAb3 QAb4 QAb5
11
22
Precharge
(A-Bank)
*Note2
*Note1 *Note1
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 39/46
Write interrupted by Precharge Command & Write Burst Stop Cycle @ Burst Length = Full page
*Note : 1. Data-in at the c ycle of interrupted by precharge can not be written into the corresponding memory cell. It is defined by
AC parameter of tRDL.
DQM at write interrupted by precharge command is needed to prevent invalid write.
DQM should mask invalid input data on precharge command cycle when asserting precharge before end of burst. Input
data after Row precharge cycle will be masked internally.
2. Burst stop is valid at every burst length.
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA1
BA0
RAa CAa CAb
RAa
DAa0 DAa1 DAb1DAb0 DAb2
Row Active
(A-Bank) Write
(A-Bank) Burst Stop Write
(A-Bank)
:Don't Care
HIGH
DAa2 DAa3 DAa4 DAb3 DAb4 DAb5
Precharge
(A-Bank)
tBDL tRDL
*Note1
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 40/46
Active/Precharge Power Down Mode @ CAS Latency = 2, Burst Length = 4
*Note: 1. All banks should be in idle state prior to entering precharge power down mode.
2. CKE should be set high at least 1CLK + tSS prior to Row active command.
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA0
Active
Power-down
Exit
Precharge
: Don't care
*Note3
*Note2
*Note1
tSS tSS tSS
Ra
Ra
Qa0 Qa1 Qa2
tSHZ
Precharge
Power-Down
Entry Precharge
Power-Down
Exit
Row Active
Active
Power-down
Entry
Read
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
Ca
BA1
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 41/46
Self Refresh Entry & Exit Cycle
*Note : TO ENTER SELF REFRESH MODE
1. CS , RAS & CAS with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don’t care except for CKE.
3. The device remains in self refresh mode as long as CKE stays “Low”.
cf.) Once the device enters self refresh mode, minimum t RAS is required before exit from self refresh.
TO EXIT SELF REFRESH MODE
4. System clock restart and be stable before returning CKE high.
5. CS starts from high.
6. Minimum tRC is required after CKE going high to complete self refresh exit.
7. 4K cycles of burst auto refresh is required immediately before self refresh entry and immediately after self refresh exit.
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
A10/AP
BA0,BA1
Self Refresh Entry Auto Refresh
: Don't care
*Note2
*Note1
tSS
*Note3
*Note4 tRC
min
*Note6
Self Refresh Exit
Hi-Z Hi-Z
*Note5
*Note7
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 42/46
Mode Register Set Cycle Auto Refresh Cycle
All banks precharge should be completed before Mode Register Set cycle and auto refresh cycle.
MODE REGISTER SET CYCLE
*Note : 1. CS , RAS , CAS , & WE activation at the same clock cycle with address key will set internal mode register.
2. Minimum 2 clock cycles sh ould be met before new RAS activation.
3. Please refer to Mode Register Set table.
CLOCK
CKE
CS
RAS
CAS
ADDR
WE
DQ
DQM
:Don't Care
HIGH
0 1 2 3 4 5 6 0 1 2 3 4 5 6 7 8 9 10
HIGH
Key Ra
HI-Z HI-Z
*Note2
*Note1
*Note3
tRC
MRS New
Command Auto Refresh New Command
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 43/46
PACKING DIMENSIONS
86 - LEAD TSOP(II) DRAM(400mil)
Symbol Dimension in mm Dimension in inch
Min Norm Max Min Norm Max
A 1.20 0.047
A1 0.05 0.10 0.15 0.002 0.004 0.006
A2 0.95 1.00 1.05 0.037 0.039 0.041
b 0.17 0.27 0.007 0.018
b1 0.17 0.20 0.23 0.007 0.008 0.009
c 0.12 0.21 0.005 0.008
c1 0.10 0.127 0.16 0.004 0.005 0.006
D 22.22 BSC 0.875 BSC
ZD 0.61 REF 0.024 REF
E 11.76 BSC 0.463 BSC
E1 10.16 BSC 0.400 BSC
L 0.40 0.50 0.60 0.016 0.020 0.024
L1 0.80 REF 0.031 REF
e 0.50 BSC 0.020 BSC
R1 0.12 0.005
R2 0.12 0.25 0.005 0.010
θ °0 °8 °0 °8
θ1 °0 °0
θ2 °10 °15 °20 °10 °15 °20
θ3 °10 °15 °20 °10 °15 °20
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 44/46
PACKING DIMENSIONS
90-BALL SDRAM ( 8x13 mm )
Symbol Dimension in mm Dimension in inch
Min Norm Max Min Norm Max
A
1.00
0.039
A1 0.30 0.35 0.40 0.012 0.014 0.016
A2
0.586 0.023
øb 0.40 0.45 0.50 0.016 0.018 0.020
D 7.90 8.00 8.10 0.311 0.315 0.319
E 12.90 13.00 13.10 0.508 0.512 0.516
D1
6.40
0.252
E1
11.20 0.441
e
0.80
0.031
Controlling dimension : Millimeter.
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 45/46
Revision History
Revision Date Description
1.0 2007.05.04 Original
1.1 2009.03.23
1.Move History to the last
2.Modify the test condition of IIL and ICC3N
3.Modify the specification of ICC
4.Modify the descript ion about self refr esh operation
5.Correct typo error
ESMT
M12S64322A
Elite Semiconductor Memory Technology Inc. Publication Date: Mar. 2009
Revision: 1.1 46/46
Important Notice
All rights reserved.
No part of this document may be reproduced or duplicated in any form or by any
means without the prior permission of ESMT.
The contents contained in this document are believed to be accurate at the time of
publication. ESMT assumes no responsibility for any error in this document, and
reserves the right to change the products or specification in this document without
notice.
The information contained herein is presented only as a guide or examples for the
application of our products. No responsibility is assumed by ESMT for any
infringement of patents, copyrights, or other intellectual property rights of third
parties which may result from its use. No license, either express , implied or
otherwise, is granted under any patents, copyrights or other intellectual property
rights of ESMT or others.
Any semiconductor devices may have inherently a certain rate of failure. To minimize
risks associated with customer's application, adequate design and operating
safeguards against injury, damage, or loss from such failure, should be provided by
the customer when making application designs.
ESMT's products are not authorized for use in critical applications such as, but not
limited to, life support devices or system, where failure or abnormal operation may
directly affect human lives or cause physical injury or property damage. If products
described here are to be used for such kinds of application, purchaser must do its
own quality assurance testing appropriate to such applications.
