MADL-011009-01340W - M/A-COM Technology Solutions

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

1

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

1

Features

 Low Insertion Loss and Noise Figure

 High Peak and Average Operating Power

 Various P1dB Compression Powers

 Au Doped Devices for Lower Recovery Time

 Non-Au doped devices for Lower Flat Leakage

Power

 Proven Reliable, Silicon Nitride Passivation

 RoHS Compliant

Description

The MA4L and MADL Series are silicon PIN limiter

diodes with small and medium I-region lengths

which are specifically designed for high signal

applications. The devices are designed to provide

low insertion loss, at zero bias, as well as low flat

leakage power with fast signal response/recovery

times. Parts are available as discrete die or

assembled into a variety of surface mount or

ceramic pill packages. See the Available Case Style

table for the specific ceramic package styles and

their availability for individual part numbers.

Applications

The MA4L and MADL Series of PIN limiter diodes

are designed for use in passive limiter control

circuits to protect sensitive receiver components

such as low noise amplifiers (LNA), detectors, and

mixers covering the 10 MHz to 18 GHz frequency

range. Chip Outlines2

2. For the MADL-000301-01340W, MADL-000301-13870G,

MA4L401-134 and MADL-000401-13870G, “B” dimension, is

10 ±1 mils.

ODS Dimension mils mm

134, 1421 ,

1428

A (squared) 15 ±2 0.381 ±0.51

B 7 ±12 0.178 ±0.025

1. Packages not to size, dimensions can be found on the

MACOM website.

31,32

137

1056

30

134

Chip

120

186 1088

1387

1388

Chip with

Flying Leads

1421

1428

Available Packages1

B

Chip

A

ODS134 ODS1421

ODS1428

A

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

2

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

2

Gold Doped Die

Part Number

VB3

(10 µA)

CJ

@ 10 V4

( 1 MHz)

CJ

@ 0 V

( 1 MHz)

RS

@ 10 mA5

(500 MHz)

Carrier

Lifetime5

IF = +10 mA

IR = -6 mA

I-Region

Thickness

Contact

Diameter

CW

Thermal

Resistance5

Min./Max. Typ. Max. Typ. Max. Nominal Characteristics

V pF pF pF Ohms ns µm mils °C/W

MA4L011-134 15/35 0.13 0.18 0.18 2.10 10 2 1.2 35

MA4L021-134 20/35 0.11 0.16 0.20 2.10 10 2 1.2 35

MA4L022-134 20/35 0.12 0.17 0.19 2.00 10 2 1.2 35

MA4L031-134 30/50 0.14 0.20 0.21 2.00 20 3 1.4 34

MA4L032-134 30/50 0.12 0.18 0.20 2.50 15 3 1.5 34

MA4L062-134 60/75 0.08 0.11 0.15 2.50 10 4 1.5 33

MADL-011009-01340W 20/35 0.15 0.20 0.23 1.50 10 2 3.0 35

MADL-011010-01340W 30/50 0.15 0.21 0.24 1.50 15 3 3.0 34

MADL-011011-01340W 60/75 0.10 0.13 0.17 2.30 10 4 3.0 33

MADL-011021-14210G 20/35 0.18 0.23 0.24 2.00 10 2 2.6 x 5.8 35

Non Gold Doped Die

Part Number

VB3

(10 µA)

CJ

@ 10 V4

( 1 MHz)

CJ

@ 0 V

( 1 MHz)

RS

@ 10 mA5

(500 MHz)

Carrier

Lifetime5

IF = +10 mA

IR = -6 mA

I-Region

Thickness

Contact

Diameter

CW

Thermal

Resistance5

Min./Max. Typ. Max. Typ. Max. Nominal Characteristics

V pF pF pF Ohms ns µm mils °C/W

MA4L101-134 100/175 0.07 0.11 0.15 2.00 90 13 3.5 25

MA4L401-134 250/300 0.19 0.22 0.25 1.20 800 25 4.5 16

MADL-000301-01340W 200/300 0.11 0.16 0.20 1.50 200 20 3.0 39

MADL-011052-14280W 20/40 0.16 0.19 0.21 2.0 23 2 2.6 x 5.8 36

MADL-011054-01340W 60/80 0.11 0.15 0.16 1.6 74 4 1.1 38

Electrical Specifications: TA = 25°C

3. Maximum breakdown voltage is sample tested and guaranteed by design. Exceeding this maximum VB value may damage the device.

4. Junction capacitance is measured at 1 MHz @ -10 V reverse voltage. CJ10 @ 1 MHz represents the microwave CJ @ frequency >50 MHz

at 0 V.

5. Test performed with the chip bonded into a ceramic pill package. For thermal resistance package is mounted to an infinite heatsink. Chip

only CW value is approximately 2°C/W lower.

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

3

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

3

Nominal High Signal Performance6:

Freq. = 9.4 GHz, TA = 25°C, Pulse Width = 1 µs, Duty Cycle = 0.1%

Part Number

Incident Peak Power Recovery Time Incident

Peak Power

CW

Input Power

1 dB

Limiting

10 dB

Limiting

15 dB

Limiting

3 dB

Peak Power = 50 W Maximum Maximum

dBm ns Watts Watts

MA4L011-134 7 30 40 10 80 2

MA4L021-134 8 31 41 15 90 3

MA4L022-134 8 31 41 15 90 3

MA4L031-134 10 33 43 25 125 4

MA4L032-134 11 34 44 25 125 4

MA4L062-134 15 38 50 75 200 5

MADL-011009-01340W 8 31 41 10 90 3

MADL-011010-01340W 11 34 44 25 125 4

MADL-011011-01340W 15 38 50 75 200 5

MADL-011021-14210G 8 31 41 10 90 3

6. Measured in a single shunt diode (die) configuration attached directly to the gold plated RF ground of a 50 Ω, SMA connectorized, test

fixture using 1 mil thick conductive silver epoxy . Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire

onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt coil provides the DC return.

Part Number

Incident Peak Power Recovery Time Incident

Peak Power

CW

Input Power

1 dB

Limiting

10 dB

Limiting

15 dB

Limiting

3 dB

Peak Power = 50 W Maximum Maximum

dBm ns dBm dBm

MA4L101-134 20 45 53 100 54 38.0

MA4L401-134 30 52 60 250 60 40.0

MADL-000301-01340W 23 46 57 50 57 38.5

MADL-011052-14280W 7 28 39 50 50 36.0

MADL-011054-01340W 13 37 48 100 53 38.0

Gold Doped Die

Non Gold Doped Die

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

4

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

4

Typical High Signal Peak Power Performance for a Single Shunt in a 50 Ω Circuit

Frequency = 9.4 GHz, Pulse Width = 1 µs, Duty Cycle = 0.1%

Parameter Absolute Maximum

Forward Current 100 mA

RF Peak & CW Incident Power Per Performance Table

Junction Temperature8 +175°C

Operating Temperature -55°C to +125°C

Storage Temperature -55°C to +150°C

Mounting Temperature +320°C for 10 sec.

Absolute Maximum Ratings7 TA = +25°C

7. Exceeding any one or combination of these limits may cause permanent damage to this device.

8. Maintaining diode junction ≤ +175°C will ensure MTBF >1 E+6 hrs for silicon devices.

0

5

10

15

20

25

30

35

40

45

010 20 30 40 50

Output Power (dBm)

Input Power (dBm)

0 dB

Loss Line

10 dB

Loss Line

20 dB

Loss Line

30 dB

Loss Line

MA4L011-134, MA4L021-134, MA4L022-134,

MADL-011009-01340W, MADL-011021-14210G

MA4L031-134, MA4L032-134, MADL-011010-0134W

MA4L062-134, MADL-011011-01340W

MA4L101-134

MA4L401-134

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

5

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

5

Application Circuits

Typical 60 dBm Peak Power, 1 µs P.W., 0.1% Duty Cycle, 20 dBm Flat Leakage Limiter Circuit

Typical 50 dBm Peak Power, 1 µs P.W., 0.1% Duty Cycle, 20 dBm Flat Leakage Limiter Circuit

RF Output

RF Input

MA4L101-134 MA4L032-134

Coil: DC Return

Transmission Line: 90º @ Fo Transmission Line: 90º @ Fo

MA4L401-134

RF Output

MA4L032-134

RF Input

MA4L022-134

Coil: DC Return

Transmission Line: 90º @ Fo

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

6

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

6

Notes for Specification and Nominal High Signal Performance Tables:

Maximum Series Resistance: RS is measured at 500 MHz in the ODS-30 package and is equivalent to the

total diode resistance: RS = RJ (Chip Junction Resistance) + RO (Package Ohmic Resistance).

Maximum High Signal Performance: Test freq.= 9.4 GHz, RF pulse width = 1 µs, Duty Cycle = 0.1%.

Measured with a single shunt diode (die) attached directly to the gold plated RF housing ground with 1 mil thick

conductive silver epoxy in a 50 Ω, SMA, connectorized test fixture. Chip anode contact is thermo-compression

wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt

coil provides the DC return and DC blocks are on the RF Input and Output.

Maximum CW Incident Power: Measured in a 50 Ω, SMA, connectorized housing @ 4 GHz utilizing a TWT

amplifier and the same single diode assembly configuration as stated above.

Die Handling and Mounting Information

Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination from

particulates, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up tools is

strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.

Die Attach: The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1 µm. Die can be

mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and DC ground plane

mounting surface must be free of contamination and should have a surface flatness of < ± 2 mils.

 Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold/tin eutectic solder perform is

recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot

gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be

exposed to a temperatures in excess of 320°C for more than 10 seconds.

 Eutectic Die Attachment Using Reflow Oven: Refer to Application Note M538, “Surface Mounting

Instructions”.

 Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied,

approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible

around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive

silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour.

Wire Bonding: The chip’s top contact (anode) metallization layer is comprised of Ti/Pt/Au with a final gold

thickness of 1 µm. Thermo-compression wedge bonding using a 0.7 or 1 mil diameter gold wire is

recommended. The heat stage temperature should be set to approximately 200°C with a tool tip temperature of

125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary should be adjusted

to the minimum setting required to achieve a good bond. Excessive energy or force applied to the top contact

will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used.

See Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for more detailed

handling and assembly information.

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

7

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

7

Part Numbering and Ordering Information

When ordering : Use the base part number followed by a dash plus the desired package style suffix or base part

only as defined in Table I “Available Case Styles” below.

For example: The MA4L011 in the 186 style package becomes MA4L011-186 or for just the chip MA4L011-134.

Table I Available Case Styles

9. See Table 2 Associated Package Parasitics.

Base Part Available Package Styles9

MA4L011 30, 31, 32, 134 (chip), 137,186, 1056, 1088

MA4L021 31, 120, 134 (chip), 1056

MA4L022 30, 32, 120, 134 (chip), 137, 186, 1056

MA4L031 31, 134 (chip), 186, 1056

MA4L032 31, 32, 134 (chip), 186, 1056

MA4L062-134 Base part (134 chip)

MA4L101 30, 134 (chip), 186

MA4L301 Base Part (MADL-000301-01340W) 31, 1056

MA4L401 30, 31, 120,134 (chip), 1056, MADL-000401-01320G for die in Gel-pack

MADL-000011-13880G Base part (MA4L011-134 chip with flying leads)

MADL-000031-13880G Base part (MA4L031-134 chip with flying leads)

MADL-000032-003000 Base part (MA4L032 chip in 30 package)

MADL-000062-105600 Base part (MA4L062 chip in 1056 package)

MADL-000062-13880G Base part (MA4L062-134 chip with flying leads)

MADL-000101-13880G Base part (MA4L101-134 chip with flying leads)

MADL-000301-01340W Base part (134 chip)

MADL-000301-13870G Base part (MADL-000301-01340W chip with flying leads)

MADL-000401-13870G Base part (MA4L401-134 chip with flying leads)

MADL-011009-01340W Base part (134 chip)

MADL-011010-01340W Base part (134 chip), In Waffle pack, MADL-011010-01340G for Gel pack

MADL-011011-01340W Base part (134 chip) In Waffle pack, MADL-011011-01340G for Gel pack

MADL-011021-14210G Chip with rectangular contact (MADL-011021-1421WR wafer on ring frame)

MADL-011052-14280W Chip with rectangular contact

MADL-011054-01340W Base part (134 chip)

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

8

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

8

Package Style Package Description

Nominal

CPKG

pF

LS

nH

30 Ceramic Pill 0.18 0.60

31 Ceramic Pill 0.18 0.60

32 Ceramic Pill 0.30 0.40

120 Ceramic Pill 0.13 0.40

134 Chip — —

137 Epoxy Encapsulated Ceramic Surface Mount with Leads 0.14 0.70

186 Ceramic Surface Mount with Leads 0.15 0.70

1056 Ceramic Surface Mount with Wrap Around Contacts 0.20 0.70

1088 Epoxy Encapsulated Ceramic Surface Mount with Leads 0.12 0.70

1387 Chip with Flying Leads — —

1388 Chip with Flying Leads — —

1421 Chip with Rectangular Contact — —

1428 Chip with Rectangular Contact and BCB overlay — —

Table 2 Associated Package Parasitics

31,32 137

1056 30 134

Chip

120 186 1088 1387

1388

Chip with

Flying Leads

1421

1428

Chip

Silicon Limiter Diodes

Rev. V24

MA4L & MADL- Series

9

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0003896

9

Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM")

products. These materials are provided by MACOM as a service to its customers and may be used for

informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or

in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM

assumes no responsibility for errors or omissions in these materials. MACOM may make changes to

specifications and product descriptions at any time, without notice. MACOM makes no commitment to update

the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,

to any intellectual property rights is granted by this document.

THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR

IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR

INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR

OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY

OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN

THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR

CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,

WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.

MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM

customers using or selling MACOM products for use in such applications do so at their own risk and agree to

fully indemnify MACOM for any damages resulting from such improper use or sale.