LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH SCOPE This specification covers the 0.5mm PITCH FFC TO BOARD CONNECTOR series PRODUCT NAME AND PART NUMBER Product Name Material Number Housing Assembly (RA Type) 501864-**21 501864-**21 Embossed Tape Package for 501864-**21 Plug Jacket Plug Jacket Cover 501864-**80 501783-**09 501784-**09 Refer to the drawings. RATINGS Item Standard Rated Voltage (MAX.) 50 V Rated Current (MAX.) 0.5 A *3 [AC ( rms) /DC] *3 *1 Ambient Temperature Range Storage condition -40 +85 *2*3 Temperature -10+50 Humidity 85R.H. 85%R.H. MAX.(No condensation) 6() Term For 6 months after shipping (unopened package) *1 Non-operating connectors after reflow must follow the operating temperature range condition. *2 Including terminal temperature rise. *3FFC FFC must be met ratings specified in this standard. A B C SHEET 1-15 1-20 1-20 REVISE ON PC ONLY REV. REVISED J2015-1609 `15/06/08 A.ISHII C REV. DESCRIPTION STATUS DESIGN CONTROL J DOCUMENT NUMBER PS-501864-002 TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION WRITTEN BY: H.IIJIMA CHECKED BY: APPROVED BY: K.TAKAHASHI K.MORIKAWA DATE: YR/MO/DAY 2006/03/17 FILE NAME SHEET 1 OF 20 EN-037(2013-04 rev.1) PS501864002.docx LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH PERFORMANCE Electrical Performance Item 4-1-1 Contact Resistance 4-1-2 Insulation Resistance 4-1-3 Dielectric Strength Test Condition FFC 20mV 10mA (JIS C5402-2-1) Mate applicable FFC Harness, measure by dry circuit, 20mV MAX., 10mA MAX. (JIS C5402-2-1) FFC DC 500V (JIS C5402-3-1/MIL-STD-202 302) Mate applicable FFC Harness and apply 500V DC between adjacent terminal and ground. (JIS C5402-3-1/MIL-STD-202 Method 302) FFC AC 250V 1 (JIS C5402-4-1/MIL-STD-202 301) Mate applicable FFC Harness, apply 250V AC (rms) for 1 minute between adjacent terminal or ground. (JIS C5402-4-1/MIL-STD-202 Method 301) Requirement 40 milliohm MAX. 50 Megohm MIN. No Breakdown . Mechanical Performance Item 4-2-1 Insertion Force/ Withdrawal Force 4-2-1 Compulsion Withdrawal Force 4-2-3 Terminal/Housing Retention Force 4-2-4 Fitting nail / Housing Retention Force Test Condition 253 mm Insert and withdraw connectors, at the speed rate of 253 mm per minute. FFC 253 mm Mate applicable FFC Harness, apply axial pull out force at the speed rate of 253 mm per minute. 253mm Apply axial pull out force at the speed rate of 253 mm/minute on the terminal assembled in the housing. 253mm Apply axial pull out force at the speed rate of 253 mm/minute on the fitting nail assembled in the housing. REVISE ON PC ONLY Requirement 6 Refer to paragraph 6 9.8 N{ 1.0 kgf} MINIMUM 0.5N {0.05kgf} MIN. 1.0N {0.10kgf} MIN. TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 2 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Environmental Performance and Others Item Test Condition Repeated Mate / Un-matel 4-3-1 Temperature Rise 4-3-2 Vibration 4-3-3 Shock 4-3-4 JAPANESE ENGLISH 1 10 20 When mated up to 20 cycles repeatedly at the speed rate of less than 10 cycles per minute. FFC (UL 498) Mate applicable FFC and measure the temperature rise of contact when the maximum AC rated current is passed. (UL 498) Requirement Contact Resistance 60 milliohm MAX. Temperature Rise 30 C MAX. DC 1mA 3 105510Hz/ Appearance 1.5mm 2 (JIS C 60068-2-6 /MIL-STD-202 201) Mate applicable FPC. Apply 0.1mA DC and Contact subject to the following vibration conditions in Resistance each of 3 mutually perpendicular axes. Amplitude : 1.5 mm P-P Frequency : 10-55-10 Hz / minute. Duration : 2 hours in each Discontinuity (JIS C 60068-2-6 /MIL-STD-202, Method 201) DC 1mA 2 6 490m/s {50G} 3 (JIS C60068-2-27 / MIL-STD-202 213) Mate applicable FPC and subject to the following shock conditions. 3 times of shocks shall be applied for each 6 directions along 3 mutually perpendicular axes, passing DC 1mA current during the test. (Total of 18 shocks) Test pulse : Half Sine 2 Peak value : 490m/s {50G} (JIS C60068-2-27 / MIL-STD-202Method 213) REVISE ON PC ONLY No Damage 60 milliohm MAX. 1 microsecond MAX Appearance No Damage Contact Resistance 60 milliohm MAX. Discontinuity 1 microsecond MAX. TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 3 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Test Condition FFC852 96 12 Heat Resistance 4-3-5 Cold Resistance 4-3-6 Humidity 4-3-7 JAPANESE ENGLISH Requirement Appearance No Damage Contact Resistance 60 milliohm MAX. Appearance No Damage Contact Resistance 60 milliohm MAX. Appearance No Damage Contact Resistance 60 milliohm MAX. Dielectric Strength 4-1-3 Must meet 4-1-3 Insulation Resistance 20 Megohm MIN. (JIS C60068-2-2/MIL-STD-202 108) Mate applicable FPC and expose to 85+2/-2 degrees C for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. ( JIS C60068-2-2/MIL-STD-202 Method 108 ) FFC-403 96 12 ( JIS C60068-2-1 ) Mate applicable FPC and expose to -40+2/-2 degrees C for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. ( JIS C60068-2-1 ) FFC602 9095% 96 12 ( JIS C60068-2-78/MIL-STD-202 103 ) Mate applicable FPC and expose to 60+2/-2 degrees C,relative humidity 90 to 95% for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. ( JIS C60068-2-78/MIL-STD-202 Method 103 ) REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 4 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Temperature Cycling 4-3-8 SO2 Gas 4-3-9 Solder Ability 4-3-10 JAPANESE ENGLISH Test Condition Requirement FFC-55330 +852 30 1 5 5 12 Appearance No Damage (JIS C60068-2-14) Mate applicable FPC and subject to the following conditions for 5 cycles. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. 60 milliohm MAX. Contact (JIS C60068-2-14) Resistance 1 cycle a) -55+3/-3 degrees C 30 minutes b) +85+2/-2 degrees C 30 minutes (Transit time shall be within 3 minutes) FFC402 505ppm 24 Mate applicable FPC and expose them to the following SO2 gas atmosphere. Temperature 40+2/-2 degrees C Gas Density 50+5/-5 ppm Duration 24 hours 0.2mm 0.2mm 3503 5 Dip solder tails and fitting nail into the molten solder(held at 350+3/-3 degrees C)up to 0.2mm from the tip of the solder tails and fitting nails for 5 seconds. REVISE ON PC ONLY Contact Resistance 60 milliohm MAX. Solder Wetting 75% 75% of immersed area must show no voids, pin holes. TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 5 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Test Condition (Reflow by Infrared Reflow Machine) Using the reflow profile condition below Paragraph. Resistance to Soldering Heat 4-3-11 JAPANESE ENGLISH Requirement (Reflow by Manual Soldering iron) 0.3mm Appearance 350103 Using a soldering iron (350+10/-10 degrees C for 3 seconds) heat up the area 0.3mm from the tip of the solder tails and fitting nails. However, do not apply excessive pressure to either the terminals or fitting nails. No Damage ( ) Reference Standard { } Reference Unit 4-3-13 Sn-3Ag-0.5Cu The evaluation samples of each specification test are reflowed according to the recommended Print Circuit Board layout and the recommended metal mask thickness specified in the sales drawing. The reflow conditions followed are specified in the reflow profile in section 4-3-13. Lead free solder (Sn-3Ag-0.5Cu) was used as the soldering paste. REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 6 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH PRODUCT SHAPE, DIMENSIONS AND MATERIALS Refer to the drawing. INSERTION FORCE/WITHDRAWAL FORCE 0.3mmFPCFPC FPCFPCFPC Table shown below is a data of FPC insertion/withdrawal force when using a thickness of 0.3mm FPC. But, there's a case which FPC insertion/withdrawal force doesn't fulfill the data shown below, because FPC specification affects the result of FPC insertion/withdrawal force . NoticeThis chart shows reference value. No. 40 50 of CKT UNIT 1st Insertion Force Withdrawal Force AVG. MAX. MIN. AVG. MAX. MIN. N {kgf} 20.41 {2.08} 21.9 {2.23} 18.1 {1.85} 13.12 {1.34} 13.9 {1.42} 11.4 {1.16} 10 10th N {kgf} 13.84 {1.41} 15.9 {1.62} 11.6 {1.18} 10.64 {1.09} 10.9 {1.11} 10.2 {1.04} 20 20th N {kgf} 12.40 {1.27} 15.5 {1.58} 11.1 {1.13} 9.94 {1.01} 10.6 {1.08} 9.2 {0.94} 1st N {kgf} 21.50 {2.19} 22.9 {2.34} 19.6 {2.00} 16.42 {1.68} 17.1 {1.74} 15.4 {1.57} 10 10th N {kgf} 15.62 {1.59} 16.4 {1.67} 14.8 {1.51} 11.64 {1.19} 13.5 {1.38} 10.9 {1.11} 20 20th N {kgf} 15.12 {1.54} 15.8 {1.61} 14.7 {1.50} 11.00 {1.12} 12.6 {1.29} 10.3 {1.05} REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 7 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH INFRARED REFLOW CONDITION 250() 250 MAX. (PEAK TEMP.) 40(230) 40sec.(230 MIN.) 9030 9030 sec. (150180) (Pre-heat150180MAX.) TEMPERATURE CONDITION GRAPH (Temperature is measured at the soldering area on the surface of the print circuit board) N2 () NOTE: Please investigate the mounting condition (reflow soldering condition) on your own devices beforehand. The mounting conditions may change due to the soldering temperature, soldering paste, air reflow machine, Nitrogen reflow machine, and the type of printed circuit board. The different mounting conditions may have an influence on the product's performance. REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 8 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH INSTRUCTION FOR THE HANDLING OF THE CONNECTOR DESCRIPTION OF EACH PART MOUNTING ON THE PC BOARD The mounting of the PC board is handled by the mounter. If to manually solder, please be cautious to not touch the Terminal and Fitting Nail.(It will create the possibility to cause solderbility failure.) REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 9 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH MATING THE CONNECTOR When mating the connector, hold the JACKET AND JACKET COVER together at either a whole or the center portion of them to insert. WHOLE CENTER REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 10 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH The following method of mating will cause either irreversable functionality failure or product breaking, so please do not mate this way. Please do not hold the FFC part only Please do not hold the JACKET AND edge of the JACKET COVER only FFC WARPED FFC REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 11 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH Please do not hold the FFC like bending it. FFC WARPED FFC REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 12 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH If FFC warps too much, it will touch with the Header housing when mated, andmay possibly cause buckling. FFC TO WARPED FFC TOUCH Please do not hold one side of the JACKET and the JACKET COVER only as shown below. It will be mated in the slant direction and will cause failure REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 13 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH Mating inconsistently will cause failure, so please do not do this. Please be cautious not to put excess load at the lock part after mating and when FFC is pulled and extracted. It may cause damage to the connector and may crack the soldering. REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 14 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH FFC Please be sure to release the lock when unmating the connector. If the FFC is withdrawn without the lock has not been released, please check to make sure that there is no debris on the contact area before inserting the FPC again. FFC FFCFFC FFC There is a possibility that the prescript temperature of FFC is set to single it. When actually using it with connector, Please do the evaluation and the confirmation with an actual equipment to evade the case where reliability cannot be filled (the adhesive line of FFC is deteriorated etc) REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 15 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 9 NOTES 9-1 9-1-1 Although this product may have a small black mark, a weld line or a scratch on the housing, these will not have any influence on the product's performance. 9-1-2 There may be slight differences in the housing coloring, but there will be no influence on the product's performance. 9-1-3 Although the ultraviolet light may potentially change the color, this change has no on the product's performance. 9-2 9-2-1 Max0.02mm The mounting specification for coplanarity does not include the influence of warpage of the printed circuit board. The warpage of the printed circuit board should be a maximum of 0.02mm if measuring from one connector edge to the other. 9-2-2 The product performance was tested using rigid printed circuit board. In case the product needs to be reflowed onto flexible circuit board, please conduct a reflow test on the flexible circuit board in advance. 9-2-3 Please add a stiffener on the flexible printed circuit (FFC) when you mount the connector onto FFC in order to prevent deformation of the FFC. 9-2-4 Depending on the reflow conditions, there may be the possibility of a color change in the housing. However, this color change does not have any effect on the product's performance. REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 16 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 9-2-5 Although there might be some discoloration seen on the soldering tail after reflow, this will not influence the product's performance. 9-2-6 If you leave any soldering area on this product open, there may be the possibility of a missing terminal short circuiting between pins, terminal buckling or the potential for the connector to come off of the printed circuit board. Therefore, please solder all of the terminals and fitting nails on the printed circuit board. 9-2-7 If there is accidental contact with the connector while it is going through the reflow machine, there may be deformation or damage caused to the connector. Please check to prevent this. 9-3 9-3-1 Please do not conduct any "washing process" on the connector because it may damage the product's function. 9-3-2 FFC Please make sure to use the appropriate FFC which has Tin plating (Nickel under plating) on the contact area. 9-3-3 FFC Please check the compatibility between the connector and the FFC prior to moving to mass production. REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 17 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 9-3-4 FFCFFC FFC FFC Please pay special attention not to have any pulling force/tension on the FFC when it is inserted into the connector. This can cause; the actuator to be unlocked, the actuator to come off, cut the traces on the FFC, and/or damage the FFC. Please be especially careful to avoid placing the FFC in a location where it will have a constant force applied on the FFC, If necessary, please fix the FFC directly on the chassis. Also, please avoid pulling the FFC vertically or twisting the FFC back and force horizontally while it is inserted in the connector. 9-3-5 Please do not use the connector in a condition where the wire, the printed circuit board, or the contact area is experiencing a sympathetic vibration of wires and printed circuit board, and constant movement of devices. This may cause a defect in the contact due to the contact area being worn down. Therefore, please fix wires and printed circuit board on the chassis, and reduces sympathetic vibration. 9-3-6 This product is not designed for the mating and unmating of the connectors to be performed under the condition of an active electrical circuit. It may cause a spark and product defect if the connectors are mated and unmated in this way. REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 18 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 9-3-7 FFC The terminals for this product are tin plated. We recommend that a Tin whiskering test is performed between your FFC and the connector beforehand to ensure that they are compatible. 9-3-8 Please keep enough clearance between connector and chassis of your application in order not to apply pressure on the connector. 9-3-9 Please do not stack the printed circuit board directly after mounted the connector on it. 9-4 9-4-1 When conducting manual repairs using a soldering iron, please follow the soldering conditions shown in the product specification. If the conditions in the product spec are not followed, it may cause the terminals to fall off, a change in the contact gap, a deformation of the housing, melting of the housing, and damage the connector. 9-4-2 When conducting manual repairs using a soldering iron, please do not use more solder and flux than needed. This may cause solder wicking and flux wicking issues, and it will eventually cause a contact defect and functional issues. 10 COMPLIANCE WITH ENVIRONMENTAL DIRECTIVE ELVRoHS ELV and RoHS Compliant REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 19 OF 20 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH REV. REV. RECORD DATE EC NO. WRTTN: CH'K: A RELEASED `06/03/17 J2006-2959 H.IIJIMA K.TAKAHASHI B REVISED `13/01/10 J2013-0749 A.ISHII K.TAKAHASHI C REVISED `15/06/08 J2015-1609 A.ISHII K.TAKAHASHI REVISE ON PC ONLY TITLE: 0.5mmPITCH FFC TO BOARD CONNECTOR C SEE SHEET 1 OF 20 REV. DESCRIPTION THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-501864-002 PS501864002.docx 20 OF 20 EN-037(2013-04 rev.1)