
Ultra Low VF SMD Schottky Barrier Rectifiers
Reverse Voltage: 20 to 40 Volts
Forward Current: 1.0 Amp
RoHS Device
Page 1
REV: A
Features
-Ultra high-speed switching.
Mechanical data
CDBA120LL-HF Thru. CDBA140LL-HF
Maximum Ratings and Electrical Characteristics
QW-JL019
Comchip Technology CO., LTD.
Ratings at Ta=25°C unless otherwise noted.
Single phase, half wave, 60Hz, resistive or inductive loaded.
For capacitive load, derate current by 20% .
-Low Profile surface mount applications
in order to optimize board space.
-Low power loss, high efficiency.
-Hight current capability, low forward voltage drop.
-Hight surge capability.
-Guarding for overvoltage protection.
-Silicon epitaxial planar chip,metal silicon junction.
NOTES:
1. Thermal resistance from junction to ambient.
2. .F=1MHZ and applied 4V DC reverse Voltage
Unit
mA
°C/W
V
V
V
A
pF
V
A
°C
°C
CDBA140LL-HF
40
28
40
-50 to +100
-50 to +150
1.0
80
130
20
1.0
CDBA130LL-HF
30
21
30
0.35
50
CDBA120LL-HF
0.33
20
14
20
Symbol
VRRM
VRMS
VDC
IFSM
RθJA
TSTG
VF
IR
CJ
IO
TJ
Typical Diode Junction (Note 2) Capacitance
VR=VRRM TJ=100°C
8.3ms single half sine-wave superimposed
VR=VRRM TJ=25°C
Max. Forward Rectified Current (See Fig.1)
Max. Re Peak Reverse Voltagecurrent
Typical Thermal Resistance (Note 1)
Max. Instantaneous Forward Voltage
on rated load (JEDEC method)
Operating Temperature Range
Max. Forward Surge Current,
Storage Temperature Range
Parameter
Max. DC Blocking Voltage
Max. everse Current R
Max. RMS Voltage
@ TA=25°C1.0A,
-Case: JEDEC DO-214AC / SMA, molded plastic.
-Polarity: Indicated by cathode band.
-Weight: 0.055 grams
-Terminals: Solder plated, Solderable per
-MIL-STD-750, method 2026.
-Epoxy: UL 94V-0 rate flame retardant.
-Mounting position: Any.
Halogen free
Dimensions in inches and (millimeter)
DO-214AC (SMA)
0.067 (1.70)
0.047 (1.20) 0.114 (2.90)
0.083 (2.10)
0.181 (4.60)
0.157 (4.00)
0.008(0.20)
0.004(0.10)
0.012 (0.30)
TYP.
0.209 (5.30)
0.185 (4.70)
0.061 (1.55)
0.030 (0.75)
0.098 (2.50)
0.067 (1.70)