SN74CBT16390
16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035E – OCTOBER 1997 – REVISED OCT OBER 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Member of Texas Instruments’ Widebus
Family
D
5-Ω Switch Connection Between Two Ports
D
TTL-Compatible Input Levels
D
Latch-Up Performance Exceeds 250 mA Per
JESD 17
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
description
The SN74CBT16390 is a 16-bit to 32-bit switch
used in applications in which two separate data
paths must be multiplexed onto, or demultiplexed
from, a single path. This device can be used for
memory interleaving, in which two different banks
of memory must be addressed simultaneously.
This device also can be used to connect or isolate
the PCI bus to one or two slots simultaneously.
Two output enables (OE1 and OE2) control the
data flow. When OE1 is low, A port is connected
to 1B port. When OE2 is low, A port is connected
to 2B port. When both OE1 and OE2 are low, the
A port is connected to both 1B and 2B ports. The
control inputs can be driven with a 5-V CMOS,
5-V TTL, or an LVTTL driver.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SSOP DL
Tube SN74CBT16390DL
CBT16390
40
°
Cto85
°
C
SSOP
–
DL
Tape and reel SN74CBT16390DLR
CBT16390
–
40°C
to
85°C
TSSOP – DGG Tape and reel SN74CBT16390DGGR CBT16390
TVSOP – DGV Tape and reel SN74CBT16390DGVR CY390
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
A1
2B1
2B2
A3
2B3
2B4
A5
2B5
2B6
A7
2B7
2B8
GND
VCC
A9
2B9
2B10
A11
2B11
2B12
A13
2B13
2B14
A15
2B15
2B16
NC
NC
1B1
1B2
A2
1B3
1B4
A4
1B5
1B6
A6
1B7
1B8
A8
GND
VCC
1B9
1B10
A10
1B11
1B12
A12
1B13
1B14
A14
1B15
1B16
A16
OE1
OE2
NC – No internal connection
Copyright 2000, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Widebus is a trademark of Texas Instruments.
SN74CBT16390
16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035E – OCTOBER 1997 – REVISED OCT OBER 2000
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
FUNCTION
OE1 OE2
FUNCTION
L L A = 1B and A = 2B
LH A = 1B
HL A = 2B
H H Isolation
logic diagram (positive logic)
1B16
1B1
A16
A1
OE1
2B1
2B16
OE2
1
31
30
29
56
2
32
26
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DGG package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 48°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 56°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level control input voltage 2 V
VIL Low-level control input voltage 0.8 V
TAOperating free-air temperature –40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
SN74CBT16390
16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035E – OCTOBER 1997 – REVISED OCT OBER 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 V
II
VCC = 0, VI = 5.5 V 10
µA
I
IVCC = 5.5 V, VI = 5.5 V or GND ±1µ
A
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3µA
∆ICC‡Control inputs VCC = 5.5 V, One input at 3.4 V, Other input at VCC or GND 2.5 mA
CiControl inputs VI = 3 V or 0 5 pF
Cio(OFF) VO = 3 V or 0 5.5 pF
§
VI=0
II = 64 mA 5 7
ron
§
VCC = 4.5 V
V
I =
0
II = 30 mA 5 7 Ω
VI = 2.4 V, II = 15 mA 7 12
†All typical values are at VCC = 5 V, TA = 25°C.
‡This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§Measured by the voltage drop between A and B terminals at the indicated current through the switch. On-state resistance is determined by the
lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER FROM
(INPUT) TO
(OUTPUT) MIN MAX UNIT
tpd¶A or B B or A 0.25 ns
ten OE A or B 1.3 5.9 ns
tdis OE A or B 1 5.3 ns
¶The propagation delay is based on the RC time constant of the typical on-state resistance of the switch and a load capacitance of 50 pF, when
driven by an ideal voltage source (zero output impedance).
SN74CBT16390
16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035E – OCTOBER 1997 – REVISED OCT OBER 2000
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 7 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
3 V
0 V
VOH
VOL
0 V
VOL + 0.3 V
VOH – 0.3 V
0 V
Input
3 V
3.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74CBT16390DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16390DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16390DGVRE4 ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16390DGVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16390DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16390DGVR ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16390DL ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16390DLG4 ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBT16390DGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1
SN74CBT16390DGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBT16390DGGR TSSOP DGG 56 2000 346.0 346.0 41.0
SN74CBT16390DGVR TVSOP DGV 56 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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