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SMT Power Inductors
High Current Molded Power Inductor - PA4343.XXXANLT Series
Height: 6.5mm Max
Footprint: 14.0mm x 12.8mm Max
Current Rating: up to 53A
Inductance Range: 0.22uH to 68uH
Shielded construction and compact design
High current, low DCR, and high efficiency
Minimized acoustic noise and minimized leakage flux
Electrical Specifications @ 25°C - Operating Temperature -55°C to +155°C
Part
Number
Inductance
100KHz, 1V
Rated
Current
DC Resistance Saturation
Current Mechanical
MAX. TYP.
uH±20% A mΩmΩA
PA4343.221ANLT 0.22 53 0.4 0.46 105 Footprint 1
PA4343.331ANLT 0.33 46 0.6 0.70 65 Footprint 1
PA4343.471ANLT 0.47 42 0.88 1.02 58 Footprint 1
PA4343.561ANLT 0.546 37 1.1 1.3 50 Footprint 1
PA4343.681ANLT 0.68 36.5 1.25 1.5 46 Footprint 1
PA4343.821ANLT 0.82 35 1.3 1.65 39 Footprint 1
PA4343.102ANLT 1.0 33 1.5 1.8 36 Footprint 1
PA4343.152ANLT 1.5 29 2.2 2.53 30 Footprint 1
PA4343.222ANLT 2.2 25 3.7 4.2 24 Footprint 2
PA4343.242ANLT 2.4 24.5 3.9 4.5 23.5 Footprint 2
PA4343.332ANLT 3.3 22 5.3 6.2 22.5 Footprint 2
PA4343.472ANLT 4.7 20 6.8 8.0 21 Footprint 2
PA4343.562ANLT 5.6 18 8.3 9.8 19.5 Footprint 2
PA4343.682ANLT 6.8 16.5 9.8 11.3 18 Footprint 2
PA4343.822ANLT 8.2 15 12 13.8 17 Footprint 2
PA4343.103ANLT 10 13 13 15.8 15 Footprint 2
PA4343.223ANLT 22 10 31 35 9 Footprint 2
PA4343.333ANLT 33 9 46 55 8 Footprint 2
PA4343.473ANLT 47 8 58 67 6.8 Footprint 2
PA4343.683ANLT 68 5.8 82 100 5.0 Footprint 2
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SMT Power Inductors
High Current Molded Power Inductor - PA4343.XXXANLT Series
Mechanical
Final Layout SUGGESTED PAD LAYOUT
Series Mechanical A B C D E L G H
PA4343.XXXANLT Footprint 1 13.5±0.5 12.6±0.2 6.2±0.3 2.3±0.3 4.0±0.3 14.5 8.0 5.0
PA4343.XXXANLT Footprint 2 13.5±0.5 12.6±0.2 6.2±0.3 2.3±0.3 4.7±0.3 14.5 8.0 5.0
All Dimensions in mm.
Footprint 2
ACD
E
B
A
C
D
E
B
L
G
H
Footprint 1
PA4343.XXXANLT
Notes:
1. Actual temperature of the component during system operation (ambient plus
temperature rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approxi-
mately 30% at the stated ambient temperature. This current is determined by placing
the compnent in the specified ambient environment and applying a short duration
pulse current (to eliminate self-heating eect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40�C. Take note that the components’ performanc varies depending
on the system condition. It is suggested that the component be tested at the system
level, to verify the temperature rise of the component during system operation.
4. The part temperature (ambient+temp rise) should not exceed 155�C under worst
case operating conditions. Circuit design, PCB trace size and thickness, airflow and
other cooling provisions all aect the part temperature. Part temperature should be
verified in the end application.
5. Parts shown in bold are standard catalog parts and are available through sample
stock and distribution. Parts in lighter font are available but are not necessarily held
in sample stock or distribution and lead times may be longer. Please contact Pulse
for availablity.
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SMT Power Inductors
High Current Molded Power Inductor - PA4343.XXXANLT Series
Pulse Worldwide
Headquarters
15255 Innovation Drive Ste 100
San Diego, CA 92128
U.S.A.
Tel: 858 674 8100
Fax: 858 674 8262
Pulse Europe
Pulse Electronics GmbH
Am Rottland 12
58540 Meinerzhagen
Germany
Tel: 49 2354 777 100
Fax: 49 2354 777 168
Pulse China Headquarters
Pulse Electronics (ShenZhen) CO., LTD
D708, Shenzhen Academy of
Aerospace Technology,
The 10th Keji South Road,
Nanshan District, Shenzhen,
P.R. China 518057
Tel: 86 755 33966678
Fax: 86 755 33966700
Pulse North China
Room 2704/2705
Super Ocean Finance Ctr.
2067 Yan An Road West
Shanghai 200336
China
Tel: 86 21 62787060
Fax: 86 2162786973
Pulse South Asia
3 Fraser Street
0428 DUO Tower
Singapore 189352
Tel: 65 6287 8998
Fax: 65 6280 0080
Pulse North Asia
1F., No.111 Xiyuan Rd
Zhongli City
Taoyuan City 32057
Taiwan (R.O.C)
Tel: 886 3 4356768
Fax: 886 3 4356820
For More Information
Performance warranty of products oered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may
be trademarks or registered trademarks of their respective owners. © Copyright, 2018. Pulse Electronics, Inc. All rights reserved.
Blank portions
Blank portions Chip cavity
200mm or more 400mm or more
Direction of tape
P
W
K
A
G
0
1
SURFACE MOUNTING TYPE, REEL/TAPE LIST
REEL SIZE (mm) TAPE SIZE (mm) QTY
A G P1W K0PCS/REEL
PA4343.XXXANLT Ø330 24.4 16 24 7.0 500
TAPE & REEL INFO
