DATASHEET
QUADRACLOCK QUADRATURE DELAY BUFFER ICS672-01/02
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 1
ICS672-01/02 REV J 110409
Description
The ICS672-01/02 are zero delay buffers that generate four
output clocks whose phases are spaced at 90° intervals.
Based on IDT’s proprietary low jitter Phase-Locked Loop
(PLL) techniques, each device provides five low-skew
outputs, with clock rates up to 84 MHz for the ICS672-01
and up to 135 MHz for the ICS672-02. By providing outputs
delayed one quarter clock cycle, the device is useful for
systems requiring early or late clocks. The ICS672-01/02
include multiplier selections of x0.5, x1, x2, x3, x4, x5, or x6.
They also offer a mode to power-down all internal circuitry
and tri-state the outputs. In normal operation, output clock
FBCLK is tied to the FBIN pin.
IDT manufactures the largest variety of clock generators
and buffers, and is the largest clock supplier in the world.
Features
Packaged in 16-pin SOIC
Available in Pb (lead) free package
Input clock range from 5 MHz to 150 MHz (depends on
multiplier)
Clock outputs from up to 84 MHz (ICS672-01) and up to
135 MHz (ICS672-02)
Zero input-output delay
Integrated x0.5, x1, x2, x3, x4, x5, or x6 selections
Four accurate (<250 ps) outputs with 0°, 90°, 180°, and
270° phase shift from ICLK, and one FBCLK (0°)
Separate supply for output clocks from 2.5 V to 5 V
Full CMOS outputs (TTL compatible)
Tri-state mode for board-level testing
Includes Power-down for power savings
Advanced, low power, sub-micron CMOS process
3.3 V to 5 V operating voltage
Industrial temperature version available
NOTE: EOL for non-green parts to occur on 5/13/10
per PDN U-09-01
Block Diagram
Control
Logic
CLK0
VDDIO
PLL
Multiplier
and
Quadrature
Generation
FBIN
S2:S0
IN
CLKFB
3
Power Down plus Tri-state
VDD
2
External
Feedback
GND
3
CLK90
CLK180
CLK270
ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 2
ICS672-01/02 REV J 110409
Pin Assignment Output Clock Mode Select Table
Pin Descriptions
12
1
11
2
10
3
9
ICLK
4
CLK90
5
CLK180
6
FBCLK
7
CLK270
8
VDDIO
CLK0
VDD
GND
GND
S2
GND
S1
16
15
14
13
S0
FBIN
VDD
S2 S1 S0 Output Clocks
0 0 0 Power-down + tri-state
001 x1
010 x2
011 x3
100 x4
101 x5
110 x6
111 x0.5
Pin
Number
Pin
Name
Pin
Type
Pin Description
1 ICLK Input Clock input.
2 CLK90 Output Clock output (90° delayed from CLK0).
3 CLK180 Output Clock output (180° delayed from CLK0).
4 CLK270 Output Clock output (270° delayed from CLK0).
5 VDDIO Power Supply voltage for input and output clocks. Must not exceed VDD.
6, 7, 12 GND Power Connect to ground.
8 S0 Input Select input 0. See table above.
9 S1 Input Select input 1. See table above.
10 S2 Input Select input 2. See table above.
11, 13 VDD Power Connect to 3.3 V or 5.0 V.
14 CLK0 Output Clock output phase aligned to ICLK.
15 FBCLK Output Feedback clock output (0° phase shift from CLK0).
16 FBIN Input Feedback clock input. in normal operation, connect to FBCLK.
ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 3
ICS672-01/02 REV J 110409
External Components
The ICS672-01/02 requires a minimum number of external components for proper operation. Decoupling capacitors
of 0.01µF should be connected between VDD and GND on pins 11 and 12, and VDD and GND on pins 13 and 12,
and VDDIO and GND on pins 5 and 6, as close to the device as possible. A series termination resistor of 33 may
be used close to each clock output pin to reduce reflections.
Operation and Applications
The ICS672-01/02 each provide a total of five output clocks with multiple phase shifts relative to the input clock
(ICLK). Phase shifts of 0° (CLK0), 90° (CLK90), 180° (CLK180), and 270° (CLK270) are provided, plus one
feedback clock (FBCLK). All output clocks will be a multiple of the input clock, as determined by the table on page
2. Refer to the illustrations in Figure 1 and Figure 2.
FBCLK is connected to the feedback input (FBIN) to provide a zero delay through the ICS672-01/02. FBCLK has a
0° phase shift from ICLK.
ICLK
CLK0,
FBCLK
CLK90
CLK180
CLK270
Figure 1. Phase alignment of input and output clocks (x1 multiplier)
ICLK
CLK0,
FBCLK
CLK90
CLK180
CLK270
Figure 2. Phase alignment of input and output clocks (x2 multiplier)
ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 4
ICS672-01/02 REV J 110409
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS672-01/02. These ratings, which
are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Recommended Operation Conditions
DC Electrical Characteristics
VDD = VDDIO = 3.3 V, Ambient temperature 0 to +70°C, unless stated otherwise
Item Rating
Supply Voltage, VDD -0.5 V to 7 V
All Inputs and Outputs -0.5 V to VDD+0.5 V
Electrostatic Discharge (MIL-STD-883) 2000 V
Ambient Operating Temperature (commercial) 0 to +70°C
Ambient Operating Temperature (industrial, -02 only) -40 to +85°C
Storage Temperature -65 to +150°C
Junction Temperature 150°C
Soldering Temperature 260°C
Parameter Min. Typ. Max. Units
Ambient Operating Temperature 0 +70 °C
Power Supply Voltage (measured in respect to GND) +3.13 +5.5 V
Parameter Symbol Conditions Min. Typ. Max. Units
Operating Voltage VDD 3.13 5.50 V
Operating Voltage VDDIO 2.375 VDD V
Input High Voltage VIH ICLK only VDDIO/2+0.5 V
Input Low Voltage VIL ICLK only VDDIO/2-0.5 V
Input High Voltage VIH 2V
Input Low Voltage VIL 0.8 V
Output High Voltage VOH IOH = -12 mA 2.4 V
Output Low Voltage VOL IOL = 12 mA 0.4 V
Output High Voltage,
CMOS level
VOH IOH = -8 mA VDDIO-0.4 V
Operating Supply
Current
IDD No Load, S1=1, S0=0,
S2=0, Note 1
11 mA
ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 5
ICS672-01/02 REV J 110409
AC Electrical Characteristics
VDD = VDDIO = 3.3 V, Ambient Temperature 0 to +70°C, unless stated otherwise
Note 1: With ICLK = 20 MHz, FBCLK to FBIN, all outputs at 40 MHz.
Note 2: With ICLK = 66.5 MHz, FBCLK to FBIN, all outputs at 133 MHz.
Note 3: Value depends on multiplier. Must also meet output clock frequency.
Note 4: With CLK0CLK270 equally loaded, and output frequency > 60 MHz.
Note 5: Rising edge of ICLK compared with rising edge of CLk0, with FBCLK connected to FBIN, 15 pF load on
CLK0, and CLK0 > 60 MHz.
Note 6: Commercial grade.
Note 7: Industrial grade.
Thermal Characteristics
Operating Supply
Current
IDD No Load, S1=1, S0=0,
S2=0, Notes 2, 6
22 mA
No Load, S1=1, S0=0,
S2=0, Notes 2, 7
66 mA
Short Circuit Current IOS Each output ±50 mA
Input Capacitance CIN OE, select pins 7 pF
Parameter Symbol Conditions Min. Typ. Max. Units
Input Clock Frequency fIN Note 3 5 150 MHz
Output Clock Frequency ICS672-01 15 84 MHz
Output Clock Frequency ICS672-02 15 135 MHz
Output Rise Time tOR 0.8 to 2.0 V, no load, CL = 15 pF 1.0 ns
Output Fall Time tOF 2.0 to 0.8 V, no load, CL = 15 pF 1.0 ns
Output Clock Duty Cycle,
VDDIO = 3.3 V
tDC At VDDIO/2 45 50 55 %
Phased Outputs
Accuracy
Rising edges at VDDIO/2,
Note 4
-250 250 ps
Input to Output Skew ICLK to CLK0, Note 5 -300 300 ps
Maximum Absolute Jitter 75 ps
Cycle to Cycle Jitter 15 pF loads 150 ps
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θJA Still air 120 °C/W
θJA 1 m/s air flow 115 °C/W
θJA 3 m/s air flow 105 °C/W
Thermal Resistance Junction to Case θJC 58 °C/W
Parameter Symbol Conditions Min. Typ. Max. Units
ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 6
ICS672-01/02 REV J 110409
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
16
D
E
SEATING
PLANE
A1
A
e
- C -
B
.10 (.004) C
C
L
H
h x 45
Millimeters Inches
Symbol Min Max Min Max
A 1.35 1.75 .0532 .0688
A1 0.10 0.25 .0040 .0098
B 0.330.51.013.020
C 0.19 0.25 .0075 .0098
D 9.80 10.00 .3859 .3937
E 3.80 4.00 .1497 .1574
e 1.27 BASIC 0.050 BASIC
H 5.80 6.20 .2284 .2440
h 0.250.50.010.020
L 0.401.27.016.050
α0°8°0°8°
ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER
IDT™ / ICS™
QUADRACLOCK QUADRATURE DELAY BUFFER 7
ICS672-01/02 REV J 110409
Ordering Information
*NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01
“LF” denotes Pb (lead) free package.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
Part / Order Number Marking Shipping Packaging Package Temperature
672M-01* ICS672M-01 Tubes 16-pin SOIC 0 to +70° C
672M-01T* ICS672M-01 Tape and Reel 16-pin SOIC 0 to +70° C
672M-01LF ICS672M-01LF Tubes 16-pin SOIC 0 to +70° C
672M-01LFT ICS672M-01LF Tape and Reel 16-pin SOIC 0 to +70° C
672M-02* ICS672M-02 Tubes 16-pin SOIC 0 to +70° C
672M-02T* ICS672M-02 Tape and Reel 16-pin SOIC 0 to +70° C
672M-02LF ICS672M-02LF Tubes 16-pin SOIC 0 to +70° C
672M-02LFT ICS672M-02LF Tape and Reel 16-pin SOIC 0 to +70° C
672M-02I* ICS672M-02I Tubes 16-pin SOIC -40 to +85° C
672M-02IT* ICS672M-02I Tape and Reel 16-pin SOIC -40 to +85° C
672M-02ILF 672M-02ILF Tubes 16-pin SOIC -40 to +85° C
672M-02ILFT 672M-02ILF Tape and Reel 16-pin SOIC -40 to +85° C
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
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ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER ZERO DELAY BUFFER