1C2D20120D Rev. H
C2D20120D
Silicon Carbide Schottky Diode
Zero recovery® RectifieR
Features
• 1.2kVSchottkyRectier
• ZeroReverseRecovery
• ZeroForwardRecovery
• High-FrequencyOperation
• Temperature-IndependentSwitchingBehavior
• ExtremelyFastSwitching
• PositiveTemperatureCoefcientonVF
Benets
• ReplaceBipolarwithUnipolarRectiers
• EssentiallyNoSwitchingLosses
• HigherEfciency
• ReductionofHeatSinkRequirements
• ParallelDevicesWithoutThermalRunaway
Applications
• SwitchModePowerSupplies
• PowerFactorCorrection
• MotorDrives
Package
TO-247-3
Maximum Ratings (TC=25°Cunlessotherwisespecied)
Symbol Parameter Value Unit Test Conditions Note
VRRM RepetitivePeakReverseVoltage 1200 V
VRSM SurgePeakReverseVoltage 1200 V
VDC DCBlockingVoltage 1200 V
IFContinuousForwardCurrent(PerLeg/Device)
31/62
14.5/29
10/20
A
TC=25˚C
TC=135˚C
TC=152˚C
IFRM RepetitivePeakForwardSurgeCurrent 50*A TC=25˚C,tP=8.3ms,HalfSineWave
IFSM Non-RepetitivePeakForwardSurgeCurrent 250*A TC=25˚C,tP=10µs,Pulse
Ptot PowerDissipation(PerLeg/Device) 312/624
135/270 WTC=25˚C
TC=110˚C
TJ,Tstg OperatingJunctionandStorageTemperature -55 to
+175 ˚C
TO-247MountingTorque 1
8.8
Nm
lbf-in
M3Screw
6-32Screw
*PerLeg,**PerDevice
Part Number Package Marking
C2D20120D TO-247-3 C2D20120
VRRM = 1200 V
IF (TC=135˚C) =29A**
Qc  =122nC**
2C2D20120D Rev. H
Electrical Characteristics (Per Leg)
Symbol Parameter Typ. Max. Unit Test Conditions Note
VFForwardVoltage 1.6
2.5
1.8
3.0 VIF = 10 A TJ=25°C
IF = 10 A TJ=175°C
IRReverseCurrent 10
20
200
1000 μA VR = 1200 V TJ=25°C
VR = 1200 V TJ=175°C
QCTotalCapacitiveCharge 61 nC
VR=1200V,IF = 10A
di/dt=500A/μs
TJ=25°C
C TotalCapacitance
1000
80
59
pF
VR=0V,TJ=25°C,f=1MHz
VR=200V,TJ=25˚C,f=1MHz
VR=400V,TJ=25˚C,f=1MHz
Note:
1. Thisisamajoritycarrierdiode,sothereisnoreverserecoverycharge.
Thermal Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
RθJC
ThermalResistancefromJunction
toCase
0.48**
0.24*°C/W
**PerLeg,*BothLegs
Typical Performance (Per Leg)
Figure1.ForwardCharacteristics Figure2.ReverseCharacteristics
V
F
Forward Voltage (V
)
IF Forward Current (A)
20
18
16
14
12
10
8
6
4
2
0
0 1.02.03.04.05.0
V
R
Reverse Voltage (V
)
IR Reverse Current (μA)
200
180
160
140
120
100
80
60
40
20
0
0 500 1000 1500 2000
3C2D20120D Rev. H
100
90
80
70
60
50
40
30
20
10
0
Figure3.CurrentDerating
Figure5.Capacitancevs.ReverseVoltage
Typical Performance
I
F(AVG)
Forward Current (A)
C2D10120
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
Peak Forward Current
Page 1
0.0
10.0
20.0
25 50 75 100 125 150 175
Case Temperature
25 5075100125150175
I
F(PEAK)
Peak Forward Current (A)
10%Duty*
20%Duty*
30%Duty*
50%Duty*
70%Duty*
DC
T
C
Case Temperature (
°
C
)
* Frequency>1KHz
V
R
Reverse Voltage (V
)
C Capacitance (pF)
800
700
600
500
400
300
200
100
0
1 10 100 1000
Figure4.PowerDerating
150
175
200
225
250
275
300
325
350
Power Dissipation (W)
0
25
50
75
100
125
25 50 75 100 125 150 175
Power Dissipation (W)
TcCase Temperature C)
TC ˚C
PTot (W)
4C2D20120D Rev. H
Figure6.TransientThermalImpedance
5C2D20120D Rev. H
Recommended Solder Pad Layout
Package Dimensions
Package TO-247-3 POS Inches Millimeters
Min Max Min Max
A .605 .635 15.367 16.130
B .800 .831 20.320 21.10
C .780 .800 19.810 20.320
D .095 .133 2.413 3.380
E .046 .052 1.168 1.321
F .060 .095 1.524 2.410
G .215 TYP 5.460 TYP
H .175 .205 4.450 5.210
J .075 .085 1.910 2.160
K 21˚ 21˚
L
M
N
P .090 .100 2.286 2.540
Q .020 .030 .508 .762
R 11˚ 11˚
S 11˚ 11˚
T
U
V .137 .144 3.487 3.658
W .210 .248 5.334 6.300
X .502 .557 12.751 14.150
Y .637 .695 16.180 17.653
Z .038 .052 0.964 1.321
AA .110 .140 2.794 3.556
BB .030 .046 0.766 1.168
CC .161 .176 4.100 4.472
W
X
Y
Z
AA
BB
CC
TO-247-3
Part Number Package Marking
C2D20120D TO-247-3 C2D20120
Note: Recommended soldering proles can be found in the applications note here:
http://www.cree.com/power_app_notes/soldering
66 C2D20120D Rev. H
Copyright © 2013 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
• RoHSCompliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred
to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance
with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can
be obtained from your Cree representative or from the Product Documentation sections of www.cree.com.
• REAChCompliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemi-
cal Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable
future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration.
REACh banned substance information (REACh Article 67) is also available upon request.
• This product has not been designed or tested for use in, and is not intended for use in, applications implanted into
the human body nor in applications in which failure of the product could lead to death, personal injury or property
damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines,
cardiacdebrillatorsorsimilaremergencymedicalequipment,aircraftnavigationorcommunicationorcontrol
systems,airtrafccontrolsystems,orweaponssystems.
Notes
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Cree, Inc.:
C2D20120D