REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 02-05-22 Raymond Monnin B Boilerplate update, part of 5 year review. ksr 08-09-05 Robert M. Heber REV SHEET REV B B B B B B B B B SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Jeff Bowling APPROVED BY Raymond Monnin DRAWING APPROVAL DATE 97-07-03 REVISION LEVEL B MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE FLASH PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-97599 23 5962-E517-08 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97599 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 Generic number Circuit function 7C375i 7C375i Toggle Speed (Mhz) 128 Macrocell CPLD 128 Macrocell CPLD 66 83 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z Descriptive designator CMGA7-P160 See figure 1 See figure 1 Terminals Package style 160 160 160 Pin grid array Quad flat package (with ring) Quad flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) ............................................. Programming supply voltage range (VPP) ........................ DC input voltage range .................................................... Maximum power dissipation ............................................ Lead temperature (soldering, 10 seconds) ...................... Thermal resistance, junction-to-case (JC): Case outline X ............................................................... Case outline Y and Z ..................................................... Junction temperature (TJ) ................................................ Storage temperature range ............................................. Endurance ..................................................................... Data retention .................................................................. -2.0 V dc to +7.0 V dc -2.0 V dc to +13.5 V dc 2/ -2.0 V dc to +7.0 V dc 2/ 2.5 W 3/ +260C See MIL-STD-1835 7.2 C/W +175C 4/ -65C to +150C 25 erase/write cycles (minimum) 10 years (minimum) 1.4 Recommended operating conditions. 5/ Case operating temperature range (TC) .......................... Supply voltage relative to ground (VCC) ........................... Ground voltage (GND) .................................................... Input high voltage (VIH) .................................................... Input low voltage (VIL) ...................................................... -55C to +125C +4.5 V dc minimum to +5.5 V dc maximum 0 V dc 2.0 V dc minimum 0.8 V dc maximum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation. ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 - IC Latch-Up Test. (Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA 22201; http://www.jedec.org.) _______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Minimum dc input voltage is -0.5 V, which may overshoot to -2.0 V for periods less than 20 ns. Maximum dc voltage on output pins is VCC + 0.5 V, which may overshoot to +7.0 V for periods less than 20 ns under load conditions. 3/ Must withstand the added PD due to short circuit test (e.g., IOS). 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ All voltage values in this drawing are with respect to VSS. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 3 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that may affect this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 42 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A Subgroups Device Limits type Min Unit Max High Level output voltage VOH VCC = 4.5 V, VIL = 0.8V IOH = -2.0 mA, VIH = 2.0 V Low level output voltage VOL VCC = 4.5 V, IOL = 12.0 mA VIL = 0.8 V, VIH = 2.0 V High level input voltage 1/ VIH Low level input voltage 1/ VIL Input leakage current IIX VCC = 5.5 V, VIN = 0 V and 5.5 V -10 +10 A Output leakage current IOZ VCC = 5.5 V, VIN = output disabled and 5.5 V -50 +50 A IOS VCC = 5.5 V, VOUT = 0.5 V -30 -160 mA ICC VCC = 5.5 V, IOUT = 0 mA, VIN = 0 V and 5.5 V f = 1.0 MHz 250 mA Input bus hold low sustained current IBHL VCC = 4.5 V,VIL = 0.8 V +75 A Input bus hold high sustained current IBHH VCC = 4.5 V,VIH = 2.0 V -75 A Input bus hold low sustained overdrive current IBHLO VCC = 5.5 V +500 A Input bus hold high sustained overdrive current IBHLO VCC = 5.5 V -500 A CIN See 4.4.1e 4 All COUT See 4.4.1e 4 All See 4.4.1c 7, 8A, 8B All See figures 4 and 5 (circuit A) 9, 10, 11 Output short circuit current Power supply current 2/ 3/ 4/ Input capacitance 2/ Output capacitance 2/ Functional test Input to combinatorial output 5/ tPD 1, 2, 3 All 2.4 V 0.5 V 2.0 7.0 V -0.5 0.8 V 8 pF 15 pF 01 20 ns 02 15 5 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Input to output through transparent input or output latches 5/ 6/ tPDL Input to output through transparent input or output latches 5/ 6/ tPDLL Input to output enable see figure 3 test waveforms 5/ 6/ Input to output disable see figure 3 test waveforms 5/ 6/ Clock or latch enable input high time 2/ 5/ Clock or latch enable input low time 2/ 5/ Input register or latch set-up time 5/ Input register or latch hold time 5/ tEA Group A Subgroups See figures 4 and 5 (circuit A) 9, 10, 11 Device Limits type Min See figures 4 and 5 (circuit B) tER tWH See figures 4 and 5 (circuit A) tWL tIS tIH Input register clock or latch enable to combinatorial output 5/ tICO Input register clock or latch enable to output through transparent output latch 5/ 6/ tICOL Clock or latch enable to output 5/ tCO Register or latch data hold time 5/ Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Max 01 22 02 18 01 24 02 19 01 24 02 19 01 24 02 19 01 5 02 4 01 5 02 4 01 4 02 3 01 4 02 3 ns ns ns ns ns ns ns ns 01 24 02 19 01 26 02 21 01 10 02 8 All tH Unit ns ns ns 0 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Set-up time from input to clock or latch enable 5/ tS Set-up time from input through transparent latch to output register clock or latch enable 5/ 6/ tSL Output clock or latch enable to output delay (through memory array) 5/ 6/ tCO2 Output clock or latch enable to output clock or latch enable (through memory array) 5/ 6/ tSCS Hold time for input through transparent latch from output register clock or latch enable 5/ 6/ Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A Subgroups 9,10,11 See figures 4 and 5 (circuit A) Unit Device Limits type Min 01 10 02 8 01 20 02 15 Max ns ns 01 24 02 19 ns ns 01 15 02 12 tHL All 0 ns Maximum frequency with internal feedback in output register mode (least of 1/tSCS, 1/(tS + tH), or 1/tCO) 2/ 5/ fMAX1 01 66 MHz 02 83 Maximum frequency data path in output register/latched mode (lesser of 1/(tWL + tWH), 1/(tS + tH), or 1/tCO) 2/ 5/ fMAX2 01 100 02 125 Maximum frequency with external feedback (lesser of 1/(tCO + tS),or 1/(tWL + tWH) 2/ 5/ fMAX3 01 50 02 62.5 Maximum frequency in pipelined mode (least of 1/(tCO + tIS), 1/tICS, 1/(tWL + tWH), 1/(tIS + tIH),or 1/tSCS 2/ 5/ fMAX4 01 66.6 02 83.3 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Output data stable from output clock minus input register hold time for device 2/ 5/ 7/ Symbol tOH-tIH Input register clock to output register clock 6/ tICS Asynchronous preset width 2/ 5/ 6/ tPW Asynchronous preset recovery time 2/ 5/ 6/ tPR Asynchronous preset to output 5/ 6/ tPO Asynchronous reset width 5/ 6/ tRW Asynchronous reset recovery time 5/ 6/ tRR Asynchronous reset to output 5/ 6/ tRO Top controller frequency fTAP Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A Subgroups Device Limits type Min Max 9, 10, 11 See figures 4 and 5 (circuit A) Unit All 0 ns 01 15 ns 02 12 01 20 02 15 01 22 02 17 ns ns 01 26 02 21 01 20 02 15 01 22 02 17 ns ns 01 26 02 21 All ns ns 500 KHz 1/ These are absolute values with respect to device ground, and all overshoots due to system or tester noise are included. 2/ Tested initially and after any design or process changes that affect this parameter. 3/ Not more than one output should be tested at a time. Duration of the short circuit should not exceed 1 second. VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation. 4/ Measured with 16-bit counter programmed into each logic block. 5/ All AC parameters are measured with 16 outputs switching. 6/ May not be tested but shall be guaranteed to the limits specified in table I. 7/ This specification is intended to guarantee interface compatibility with the other members of the device family, contact manufacturer for additional information. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 8 Case Y Figure 1. Case outline. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 9 Case Z Figure 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 10 Case outline X Device type All Device type All Device type All Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 D1 D2 D3 D4 D7 D8 D9 D12 D13 D14 D15 E1 E2 E3 E13 E14 E15 F1 F2 F3 F13 F14 F15 G1 G2 G3 G4 G12 G13 G14 G15 H1 H2 H3 H4 H12 H13 H14 H15 J1 J2 J3 J4 J12 J13 J14 J15 K1 K2 K3 K13 K14 K15 L1 L2 L3 L13 L14 L15 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O/SMODE I/O I/O I/O I/O I/O GND I/O/SDO I/O GND I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCC GND VCC VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O VCC VCC CLK1/I I/O I/O I/O GND CLK2/I GND GND CLK0/I GND I/O I/O I/O CLK3/I VCC VCC CLK I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O M1 M2 M3 M4 M7 M8 M9 M12 M13 M14 M15 N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 N15 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 I/O I/O I/O VCC VCC GND VCC GND I/O I/O/SCLK I/O I/O I/O/SDI I/O I/O I/O I/O I/O ISREN I/O GND I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 11 Case outline Y and Z Device type All Device type All Device type All Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 GND I/O I/O I/O I/O I/O/SCLK I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O CLK/I VCC GND CLK/I I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O VCC GND I/O I/O I/O I/O I/O/SMODE I/O I/O I/O GND I/O I/O I/O I/O 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 I/O I/O I/O I/O I VCC GND VCC I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O/SDO I/O I/O I/O VCC GND I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O CLK2/I VCC GND CLK3/I I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O/SD1 I/O I/O I/O VCC GND I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O ISREN VCC GND VCC I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O VCC FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 12 Truth table Input pins Output pins I/CLK I I/O X X Z NOTES: 1. X = Don't care 2. Z = High impedance FIGURE 3. Truth table (unprogrammed). FIGURE 4. Output load circuits and test conditions. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 13 Test Waveforms Input pulses FIGURE 4. Output load circuits and test conditions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 14 FIGURE 5. Switching waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 15 FIGURE 5. Switching waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 16 FIGURE 5. Switching waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 17 FIGURE 5. Switching waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 18 3.11 Processing CPLDs. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.11.1 Erasure of CPLDs. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.6 herein. 3.11.2 Programmability of CPLDs. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics specified in 4.7 herein. 3.11.3 Verification of erasure or programmed CPLDs. When specified, devices shall be verified as either programmed (see 4.7 herein) to the specified pattern or erased (see 4.6 herein). As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure, and shall be removed from the lot. 3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitor. This reprogrammability test shall be done only for initial characterization and after any design or process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall be under document control and shall be made available upon request. 3.13 Data Retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be done for initial characterization and after any design or process changes which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with the test data. 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Delete the sequence specified as initial (pre-burn-in) electrical parameters through interim (post-burn-in) electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein. b. Prior to burn-in, the devices shall be programmed (see 4.7 herein) with a checkerboard pattern or equivalent (manufacturers at their option may employ an equivalent pattern provided it is topologically true alternating bit pattern). The pattern shall be read before and after burn-in. Devices having bits not in the proper state after burn-in shall constitute a device failure and shall be removed from the lot. The manufacturer as an option may use built-in test circuitry by testing the entire lot to verify programmability and AC performance without programming the user array. c. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125C, minimum. d. Interim and final electrical test parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 19 TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ 7/ Line no. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, TM 5005, table I) Device class V Device class Q Device class M 1, 7, 9 or 2, 8A, 10 1 Interim electrical parameters (see 4.2) 2 Static burn-in (method 1015) 3 Same as line 1 4 Dynamic burn-in (method 1015) 5 Final electrical parameters (see 4.2) 6 Group A test requirements (see 4.4) 7 Required Not required Not required 1*, 7* Required Required Required 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 Group C end-point electrical parameters (see 4.4) 2, 3, 7, 8A, 8B 2, 3, 7, 8A, 8B 1, 2, 3, 7, 8A, 8B, 9, 10, 11 8 Group D end-point electrical parameters (see 4.4) 2, 3, 8A, 8B 2, 3, 8A, 8B 2, 3, 8A, 8B 9 Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 1/ 2/ 3/ 4/ 5/ 6/ Blank spaces indicate tests are not applicable. Any or all subgroups may be combined when using high-speed testers. Subgroups 7 and 8 functional tests shall verify the truth table. * indicates PDA applies to subgroup 1 and 7. ** see 4.4.1e. indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be computed with reference to the previous interim electrical parameters (see line 1). 7/ See 4.4.1d. TABLE IIB. Delta limits at +25C. Parameter 1/ Device types All IOZ 10% of the specified value in table I IIX 10% of the specified value in table I 1/ The above parameter shall be recorded before and after the required burn-in and life tests to determine the delta . STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 20 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7, 8A and 8B tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7, 8A and 8B shall include verifying the functionality of the device. d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may affect the performance of the device. For device class M, procedures and circuits shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity upon request. For device classes Q and V, the procedures and circuits shall be under the control of the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing activity or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up test shall be considered destructive. Information contained in JESD 78 may be used for reference. e. Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHz. Sample size is three devices with no failures, and all input and output terminals tested. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 21 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta measurements or within 24 hours after life test perform final electrical parameter tests, subgroups 1, 7, and 9. 4.6 Erasure procedures. Erasure procedures shall be as specified by the device manufacturer and shall be made available upon request. 4.7 Programming procedures. The programming procedures shall be as specified by the device manufacturer and shall be made available upon request. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43218-3990, or telephone (614) 692-0547. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 22 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97599 A REVISION LEVEL B SHEET 23 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 08-09-05 Approved sources of supply for SMD 5962-97599 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-9759901QXC 0C7V7 CY7C375i-66GMB 5962-9759901QYC 3/ CY7C375i-66UMB 5962-9759901QZC 0C7V7 CY7C375i-66UMB 5962-9759902QXC 0C7V7 CY7C375i-83GMB 5962-9759902QYC 3/ CY7C375i-83UMB 5962-9759902QZC 0C7V7 CY7C375i-83UMB Vendor similar PIN 2/ 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 0C7V7 Vendor name and address QP Semiconductor 2945 Oakmead Village Ct Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.