Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
Introduction
Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic
electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of
metal end terminations which are fired to assure permanent bonding with the individual internal electrodes.
Multilayer ceramic capacitors have various features such as large capacitance values in small sizes and excellent high
frequency characteristics.
Moreover, chip capacitors can be used on surface mount assembly equipment. Our fully integrated manufacturing and
total quality control systems ensure unprecedented high standards of quality and reliability.
Chip Capacitor Selection
Selection of the most suitable capacitor for any application is based on the following:
Dielectric Type
The choice of dielectric is largely determined by the temperature stability required.
COG (NPO)
Capacitance change with temperature is 0-30ppm/°C which is less than -0.3%°C from -55°C to +125°C. Typical capacitance
change with life is less than -0.1% for NPOs, one-fifth that shown by most other dielectrics. NPO formulations show no aging
characteristics.
X7R/X5R
Its temperature variation of capacitance is within ±15% from -55°C to +125°C (-55°C to +85°C for X5R). The capacitance change is
Z5U
Despite their capacitance instability, Z5U formulations are very popular because of their small size, temperature range low
ESL, low ESR and excellent frequency response. These features are particularly important for decoupling application where
only a minimum capacitance value is required.
Y5V
Y5V formulations are for general purpose use in a limited temperature range. They have a wide temperature characteristic
of +22% - 82% capacitance change over the operating temperature range of -30°C to +85°C. Y5Vs high dielectric constant
allows the manufacture of very high capacitance values (up to 22MF) in small physical sizes.
Capacitance Value & Tolerance
Determined by circuit requirements. Note that chip prices decrease with lower capacitance value and looser tolerance.
Voltage
Determined by circuit requirements. Units are designed to exceed the withstanding voltage specification, i.e., the user need
not incorporate an additional safety margin.
Capacitor Size
Select the smallest unit permitted by the circuit constraints that provides the required capacitance and voltage rating.
All Cal-Chip capacitors conform to EIA specifications.
Capacitor Termination
Nickel barrier is standard and recommended for units exposed to repeated solder cycles, to minimize leaching of the ter-
mination.
GMC SERIES
non-linear.
1
Capacitance values are represented in 3 digits,
and expressed in pF. The first two digits are
significant, and the third is the number of zeros.
The letter “R” is used as a decimal point.
0.5pF
5pF
10pF
100pF
1000pF
.01uF
.1uF
1.0uF
10uF
0R5
5R0
100
101
102
103
104
105
106
T*
CG (COG) (NPO)
X7R or X5R
Z5U
Y5V
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
GMC21 CG 102 J 50 N TM
Size Code Dielectric Capacitance (pF) Capacitance
Tolerance
(EIA Code)
Voltage Termination Packaging
Code
B
C
D
F
G
J
K
M
Z
6r3
10
16
25
50
100
200
NNickel Barrier
Tape and Reel
Construction
Example
Inner
Electrodes
Solder plate; 100% matte SN; typical thickness 0.003mm to 0.005mm *(please see note)
Nickel Barrier Layer (50 Micro-inches Electroplated Nickel min.)
GMC SERIES
±0.1pf for 10pF
±0.25pF for 10pF
±0.5pF for 10pF
±1%
±2%
±5%
±10%
±20%
-20%~+80%
6.3 DC
10 DC
16 DC
25 DC
50 DC
100 DC
200 DC
<
<
<
Note: Calchip has completed the Lead-Free transition. All parts shipped with or without the "custom designator" LF at the end
of the part number will be Lead-Free. Lead-Free material will still continue to have an LF at the end of the Lot Code and a green
RoHS symbol on the label. Please contact your sales associate if you require non-RoHS material.
2
*Optional "TD" designates
large 10 inch or 13 inch reels
- see packaging on pg.13 & 14
NX* - Optional "SoftTerm"
Available in
select values,
contact your
sales
associate for
more
information
GMC02 = 0201 GMC21 = 0805 GMC40 = 1808 GMC55 = 2220
GMC04 = 0402 GMC31 = 1206 GMC43 = 1812 GMC57 = 2225
GMC10 = 0603 GMC32 = 1210 GMC45 = 1825
0201
DIMENSION (MM) GMC02
L(L1) 0.6 r 0.03
W0.3 r 0.03
H 0.3 r 0.03
BW(L2/L3) 0.15 r 0.05
dielectric NPO/COG X5R X7R Y5V/Z5U
Rated Voltage 25 6.3 10 6.3 10 16 6.3
Ca
p
. Ran
g
e
0.5p
0R5
1.0
1R0
1.2
1R2
1.5
1R5
1.8
1R8
2.2
2R2
2.7
2R7
3.3
3R3
3.9
3R9
4.7
4R7
5.6
5R6
6.8
6R8
8.2 8R2
10
100
12
120
15
150
18
180
22
220
27
270
33
330
39
390
47
470
56
560
68
680
82
820
100
101
120
121
150
151
180
181
220
221
270
271
330
331
390
391
470
471
560
561
680
681
820
821
1.0nF
102
1.2
122
1.5
152
1.8
182
2.2
222
2.7
272
3.3
332
3.9
392
4.7
472
5.6
562
6.8
682
8.2
822
10 103
12
123
15
153
18
183
22
223
27
273
33
333
39
393
47
473
56
563
68
683
82
823
100
104
120
124
150
154
180
184
22
0
224
270
274
330
334
390
394
470
474
560
564
680
684
820
824
1.0uF
105
2.2
225
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
3
L1
H
L2L3
W
0402 & 0603 GMC04 GMC10
Type 0402 0603
Length (L1) mm
inches 1.0r0.05
0.04r0.002 1.6r0.2
0.063r0.008
Width (W) mm
inches 0.5r0.05
0.02r0.002 0.8r0.2
0.031r0.008
Thickness (H) mm
inches 0.5r0.1
0.02r0.004 0.8r0.2
0.031r0.008
Termination Band
(L2+L3) mm
inches
Min
0.1
0.004
Max
0.35
0.014
Min
0.1
0.004
Max
0.4
0.015
Band Gap (L4)mm
(Min) inches 0.3
0.012 0.6
0.015
Dielectric COG X5R X7R Y5V & Z5U COG X5R X7R Y5V & Z5U
Rated Voltage d.c. 25 50 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 25 50 100 6.3 10 16 6.3 10 16 25 50/
100 6.3 10 16 25 50
Cap Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
150 154
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
2.7 275
3.3 335
3.9 395
4.7 475
5.6 565
6.8 685
8.2 825
10 106
15 156
22 226
33 336
47 476
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
4
L1
L4
H
L2L3
W
COG/NPO GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length mm
Inches 2.0r0.3
0.08r0.012 3.2r0.3
0.125r0.012 3.2r0.3
0.125r0.012 4.57r0.25
0.18r0.01 4.5r0.35
0.18r0.014 4.5r0.35
0.18r0.014 5.7r0.4
0.225r0.016 5.7r0.4
0.225r0.016
Width mm
Inches 1.25r0.2
0.05r0.008 1.6r0.2
0.063r0.008 2.5r0.3
0.10r0.012 2.03r0.25
0.08r0.01 3.2r0.3
0.125r0.012 6.3r0.4
0.25r0.016 5.0r0.4
0.197r0.016 6.3r0.4
0.25r0.016
Thick(Max) mm
Inches 1.3
0.051 1.6
0.063 1.8
0.07 2.03
0.08 1.8
0.07 1.8
0.07 1.8
0.07 1.8
0.07
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 16 25 50 25 50 16 25 50/63 50/63 50/63 50/63 50/63 50/63
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.0 8R0
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
33 336
47 476
100 107
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
5
L1
L4
H
L2L3
W
(L2+L3)
(L4)
(H)
(L1)
(W)
COG/NPO (cont.)
GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length (L1) mm
Inches 2.0±0.3
0.08±0.012 3.2±0.3
0.125±0.012 3.2±0.3
0.125±0.012 4.57±0.25
0.18±0.01 4.5±0.35
0.18±0.014 4.5±0.35
0.18±0.014 5.7±0.4
0.225±0.016 5.7±0.4
0.225±0.016
Width (W) mm
Inches 1.25±0.2
0.05±0.008 1.6±0.2
0.063±0.008 2.5±0.3
0.10±0.012 2.03±0.25
0.08±0.01 3.2±0.3
0.125±0.012 6.3±0.4
0.25±0.016 5.0±0.4
0.197±0.016 6.3±0.4
0.25±0.016
Thick(Max) mm
Inches 1.3
0.051 1.6
0.063 1.8
0.07 2.03
0.08 1.8
0.07 1.8
0.07 1.8
0.07 1.8
0.07
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 100 200 100 200 100 200 100 200 100 200 100 200 100 200 100 200
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
33 336
47 476
68 686
100 107
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
6
L1
L4
H
L2L3
W
(L2+L3)
(L4)
(H)
X7R GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length(L1) mm
Inches 2.0r0.3
0.08r0.012 3.2r0.3
0.125r0.012 3.2r0.3
0.125r0.012 4.57r0.25
0.18r0.01 4.5r0.35
0.18r0.014 4.5r0.35
0.18r0.014 5.7r0.4
0.225r0.016 5.7r0.4
0.225r0.016
Width (W) mm
Inches 1.25r0.2
0.05r0.008 1.6r0.2
0.063r0.008 2.5r0.3
0.10r0.012 2.03r0.25
0.08r0.01 3.2r0.3
0.125r0.012 6.3r0.4
0.25r0.016 5.0r0.4
0.197r0.016 6.3r0.4
0.25r0.016
Thick(Max) mm
Inches 1.5
0.059 1.8
0.071 2.8
0.110 3.0
0.118 3.0
0.118 3.2
0.126 3.5
0.138 3.5
0.138
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 6.3 10 16 25 6.3 10 16 25 10 16 25 10 16 25 10 16 25 10 16 25 10 16 25 10 16 25
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
33 336
47 476
68 686
100 107
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
7
L1
L4
H
L2L3
W
(L4)
(L2+L3)
(H)
X7R (cont)
GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length(L1) mm
Inches 2.0±0.3
0.08±0.012 3.2±0.3
0.125±0.012 3.2±0.3
0.125±0.012 4.57±0.25
0.18±0.01 4.5±0.35
0.18±0.014 4.5±0.35
0.18±0.014 5.7±0.4
0.225±0.016 5.7±0.4
0.225±0.016
Width (W) mm
Inches 1.25±0.2
0.05±0.008 1.6±0.2
0.063±0.008 2.5±0.3
0.10±0.012 2.03±0.25
0.08±0.01 3.2±0.3
0.125±0.012 6.3±0.4
0.25±0.016 5.0±0.4
0.197±0.016 6.3±0.4
0.25±0.016
Thick(Max) mm
Inches 1.3
0.051 1.8
0.063 2.8
0.07 3.0
0.08 3.0
0.07 3.2
0.07 3.5
0.07 3.5
0.07
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
8
L1
L4
H
L2L3
W
(L2+L3)
(L4)
(H)
X5R
GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length(L1) mm
Inches 2.0±0.3
0.08±0.012 3.2±0.3
0.125±0.012 3.2±0.3
0.125±0.012 4.57±0.25
0.18±0.01 4.5±0.35
0.18±0.014 4.5±0.35
0.18±0.014 5.7±0.4
0.225±0.016 5.7±0.4
0.225±0.016
Width (W) mm
Inches 1.25±0.2
0.05±0.008 1.6±0.2
0.063±0.008 2.5±0.3
0.10±0.012 2.03±0.25
0.08±0.01 3.2±0.3
0.125±0.012 6.3±0.4
0.25±0.016 5.0±0.4
0.197±0.016 6.3±0.4
0.25±0.016
Thick(Max) mm
Inches 1.5
0.059 1.8
0.070 2.8
0.110 3.0
0.118 3.0
0.118 3.2
0.126 3.5
0.138 3.5
0.138
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 6.3 10 16 6.3 10 16 25 6.3 10/16 25 N/A 6.3 10 16 6.3 10 16 6.310/1625 16 25
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
33 336
47 476
100 107
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
9
L1
L4
H
L2L3
W
(L2+L3)
(L4)
(H)
Y5V/Z5U
GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length(L1) mm
Inches 2.0r0.3
0.08r0.012 3.2r0.3
0.125r0.012 3.2r0.3
0.125r0.012 4.57r0.25
0.18r0.01 4.5r0.35
0.18r0.014 4.5r0.35
0.18r0.014 5.7r0.4
0.225r0.016 5.7r0.4
0.225r0.016
Width (W) mm
Inches 1.25r0.2
0.05r0.008 1.6r0.2
0.063r0.008 2.5r0.3
0.10r0.012 2.03r0.25
0.08r0.01 3.2r0.3
0.125r0.012 6.3r0.4
0.25r0.016 5.0r0.4
0.197r0.016 6.3r0.4
0.25r0.016
Thick(Max) mm
Inches 1.5
0.059 1.8
0.07 2.8
0.110 3.0
0.118 3.0
0.118 3.2
0.126 3.5
0.138 3.5
0.138
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 6.3 10 16 25 6.3 10 16 25/35 6.3 10 16 25/35 6.3 10 16 25 6.3 10 16 25/35 6.3 10 16 25 6.3 10 16 25 6.3 10 16 25
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
33 336
47 476
68 686
100 107
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
10
L1
L4
H
L2L3
W
(L2+L3)
(L4)
(H)
Y5V/Z5U (cont)
GMC21 GMC31 GMC32 GMC40 GMC43 GMC45 GMC55 GMC57
Type 0805 1206 1210 1808 1812 1825 2220 2225
Length (L1) mm
Inches 2.0±0.3
0.08±0.012 3.2±0.3
0.125±0.012 3.2±0.3
0.125±0.012 4.57±0.25
0.18±0.01 4.5±0.35
0.18±0.014 4.5±0.35
0.18±0.014 5.7±0.4
0.225±0.016 5.7±0.4
0.225±0.016
Width (W) mm
Inches 1.25±0.2
0.05±0.008 1.6±0.2
0.063±0.008 2.5±0.3
0.10±0.012 2.03±0.25
0.08±0.01 3.2±0.3
0.125±0.012 6.3±0.4
0.25±0.016 5.0±0.4
0.197±0.016 6.3±0.4
0.25±0.016
Thick(Max) mm
Inches 1.5
0.059 1.8
0.07 2.8
0.110 3.0
0.118 3.0
0.118 3.2
0.126 3.5
0.138 3.5
0.138
Termination Band
mm
Inches
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Min
0.25
0.01
Max
0.75
0.03
Band Gap mm
Inches 0.5
0.019 1.4
0.055 1.4
0.055 2.0
0.078 2.2
0.087 2.2
0.087 2.9
0.114 2.9
0.114
Rated Voltage d.c. 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200
Cap. Range Code
0.5pF 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1.0nF 102
1.2 122
1.5 152
1.8 182
2.2 222
2.7 272
3.3 332
3.9 392
4.7 472
5.6 562
6.8 682
8.2 822
10 103
12 123
15 153
18 183
22 223
27 273
33 333
39 393
47 473
56 563
68 683
82 823
100 104
120 124
150 154
180 184
220 224
270 274
330 334
390 394
470 474
560 564
680 684
820 824
1.0uF 105
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
33 336
47 476
68 686
100 107
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
11
L1
L4
H
L2L3
W
(L2+L3)
(L4)
(H)
12
Operating
Temperature
Range
Temperature
Coefficient
Temperature
Voltage
Coefficient
(∆cMax @
VDCW)
Dissipation
Factor
Insulation
Resistance
Dielectric
withstanding
Voltage
Aging Rate
Test
Parameters
Operating
Temperature
Range
Temperature
Coefficient
Temperature
Voltage
Coefficient
(∆cMax @
VDCW)
Dissipation
Factor
Insulation
Resistance
Dielectric
withstanding
Voltage
Aging Rate
Test
Parameters
COG Dielectric
Ultra stable class I dielectric: linear temperature coefficient, low loss, negligible change of electrical
properties with time, voltage and frequency.
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
-55°C
to
+125°C
0±30ppm°C 0±30ppm/°C 0.1% Max,
0.02% Typical
• 25°C, VDCW::
>100GΩF or
1000ΩF,
whichever is less
•125°C, VDCW:
>10GΩF or
100ΩF
whichever is less
3 X VDCW 0% per
decade hour
• C≤1000pF
f=1MHz
V=1.0Vrms
±0.2Vrms
T=25°C
• C>1000pF
f=1KHz
V=1.0Vrms
±0.2Vrms
T=25°C
X7R/X5R Dielectric
Stable class II dielectric
-55°C
to
+125°C
±15% X7R
Not Applicable
2.5% Max,
1.8% Typical
• 25°C, VDCW::
>100GΩFor
1000ΩF,
whichever is less
•125°C, VDCW:
>10GΩF or
100ΩF
whichever is less
2.5 X VDCW <2% per
decade hour
1KHz,
1.0Vrms
±0.2Vrms
25°C
GMC SERIES
values > or
= to 10uF
1.0Vrms
120Hz
X7R =
-55C to
+125C
X5R =
-55C to
+85C
X7R/X5R
Not Applicable
13
Operating
Temperature
Range
Temperature
Coefficient
Dissipation
Factor
Insulation
Resistance
Dielectric
withstanding
Voltage
Aging Rate Test
Parameters
ABCDEWt R
ABCDEWt R
-30°C
to
+85°C
+22%
-82%
3.0% Max,
2.0% Typical
10GΩor 100ΩF
whichever is
less,
25°C, VDCW
2.5 X VDCW 3.0% per
decade hour
1KHz, 1Vrms 25°C
High capacitance per unit volume: general purpose product
Packaging (Taping)
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors - Z5U (Y5V) Dielectric
ø178
±2.0
ø50
min.
ø13.0
±0.5
ø21.0
±0.8
2.0
±0.5
14.9
±1.5
0.8
±0.2 1.0
Standard Reel Unit:mm
ø250
±2.0
ø50
min.
ø13.0
±0.5
ø21.0
±0.8
2.0
±0.5
10.0
±1.5
0.8
±0.2 1.0
10000 units per reel OPTIONAL Unit:mm
• To peel off the cover tape by the method shown in the
right figure apply a peel-off force of 20 gf - 60 gf (card
board); 35 gf - 75 gf (plastic tape).
• The cover tape should not touch the top or bottom of the
chip.
• If the cover tape has been peeled off it may be difficult to
remove the chip due to punch-hole clearance, dirt, and
debris. Make sure therefore that no paper waste will
adhere to and block the absorption nozzle.
• If the cover tape has been peeled off from the top, stick it
back on with a suitable adhesive.
• Follow the illustration for the start and end of the winding
operation.
(Reel Type-Size)
Carrier Tape (Standard)
Top Cover Tape
Cover Tape tension
direction
Bottom Cover Tape
Carrier Tape
Tape unreeling
direction
165-180°
{
{
{
{
Start
Empty
section
Empty
section
Leader
section
Chip Mounting
section
50 pitch
(200mm)
30 pitch
(120mm)
200mm
Unreeling direction
GMC SERIES
values > or
= to 10uF
1.0Vrms 120Hz
"TD" designator for optional 10/13 inch reels
14
Mounting
Hole
Type A B W F E P1P2P0D0t1t2
Mounting
Hole
Type Mounting
Hole
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
0402
0603
0805
1206
0.7±0.2
1.1±0.2
1.65±0.2
2.0±0.2
1.3±0.2
1.9±0.2
2.4±0.2
3.6±0.2
8.0±0.3 3.5±0.05 1.75±0.1
4.0±0.1 2.0±0.05 4.0±0.1 ø1.5+0.1 1.1 max 1.4 max
Angular
Punch Hole
0805
1206
1210
1.45±0.2
2.0±0.2
2.9±0.2
2.3±0.2
3.6±0.2
3.6±0.2
8.0±0.3 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 4.0±0.1 ø1.5+0.1
-0 0.6 max 2.5 max
Angular
Embossed
Hole
Unit: mm
• Embossed plastic carrier tape for 0805/1206 type and 1210 type
Type A B W F E P1P2P0D0t1t2
1812
1825
2220
2225
3.6±0.2
6.8±0.3
5.5±0.3
6.8±0.3
4.9±0.2
4.9±0.2
6.2±0.3
6.2±0.3
12.0±0.3 5.5±0.05 1.75±0.1 8.0±0.1 2.0±0.05 4.0±0.1 ø1.5±0.1 0.6 max. 6.5 max.
Angular
Embossed
Hole
GMC SERIES
10,000 (20,000)
4,000 (10,000)
•Cardboard carrier tape for 0402,0603 type and 0805/1206 type Unit: mm
•Embossed plastic carrier tape for 1812,1825,2220 and 2225 type Unit: mm
A
B
W
F
E
P1
P2
P0
D0
t1
t2
Std Reel Qty.
7in (10/13in)*
4,000 (10,000)
4,000 (10,000)
3,000 (10,000)
2,000 (4,000)
2,500 (10,000)
500 (1,000)
1,000 (1,500)
1,000 (1,500)
1,000 (2,000)
*quantities listed are considered as "standard" and subject to change
*quantities listed are considered as "standard" and subject to change
*quantities listed are considered as "standard" and subject to change
Std Reel Qty.
7in (10/13in)*
Std Reel Qty.
7in (10/13in)*
15
Item
Capacitance
Dissipation Factor
(tanδor Q)
Insulation
Resistance(IR)
Dielectric
Withstanding
Voltage
Termination
Adherence
Bend Strength
Life Test
(High Temperature
Loading Test)
Specification
Within tolerance shown
by part number code
• Class (I)
C<30pF:Q≥400+20xC
C≥30pF:Q≥1000
• Class (II)
X7R/X5R:DF≤2.5%
Y5V/Z5U:DF≤3.0%
NPO thru X5R:
C≤50,000pF: IR≥100GΩ
C>50,000pF: IR≥500MΩ.
Per Uf.
Y5V/Z5U: IR≥10GΩ
There shall be no evidence
of damage or flash over
during the test
No mechanical damage
No mechanical damage
• Class (I)
No more than ±3% or ±0.3pF
whichever is less
• Class (II)
X7R/X5R:±10% max
Y5V/Z5U:±30% max
• Class (I)
C<10pF:Q>200+10xC
10≤C<30pF:Q≥275+5/2xC
C≥30pF:Q≥350
• Class (II)
X7R/X5R:DF≤5.0%
Y5V/Z5U:DF≤7.5%
1000MΩor 50ΩF, min
whichever is less
Test Method
• Class (I)
C<1000pF:1MHz±10%,
0.5 to 5Vrms
C≥1000pF:1KHz±10%,
1.0±0.2Vrms
• Class (II)
1KHz±10%, 1.0±0.2Vrms
Apply rated voltage for 60
seconds at room temperature
and normal humidity.
(70% RH max)
Apply 3 x rated voltage (Class I)
or 2.5 x rated voltage (Class II) to
both terminations for 5
seconds. Charge and discharge
current are less than 50mA.
Care shall be taken to avoid
thermal shock. 500g of steady
pull is applied in direction of arrow
for 1 minute.
After soldering capacitor on the
glass-epoxy PWB, 2 mm of vend-
ing shall be applied for 10 sec-
onds as shown by drawing.
Applied 2 x rated voltage at
maximum operating temperature
for 1000 hours. The surge current
shall not exceed 50mA after
above testing condition, test sam-
ples shall be kept in room temper-
ature for 24 hours (Class I) or
48 hours (Class II),
and then shall be measured.
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
RELIABILITY AND TEST
CONDITIONS
∆C
Q
or
DF
IR
GMC SERIES
values > or = to 10uF 1.0Vrms 120Hz
16
Item
Moisture Test
Moisture
Resistance
Test
Temperature
Cycle
Solderability
Resistance to
Solder Heat Test
Specification
• Class (I)
No more than ±5%
or ±0.5pF
whichever is larger
• Class (II)
X7R/X5R:±10%
Y5V/Z5U:±30%
• Class (I)
C<10pF:Q>200+10xC
10≤C<30pF:Q≥275+5/2xC
C≥30pF:Q≥350
• Class (II)
X7R/X5R:DF≤5.0%
Y5V/Z5U:DF≤7.5%
1000MΩor 50ΩF,
whichever is less
• Class (I)
No more than ±7.5%
or ±0.75pF
whichever is larger
• Class (II)
X7R/X5R:±10%
Y5V/Z5U:±30%
• Class (I)
C<30pF:Q>100+100/3xC
C≥30pF:Q≥200
• Class (II)
X7R/X5R:DF≤5.0%
Y5V/Z5U:DF≤7.5%
500MΩor 25ΩF, min
whichever is less
• Class (I)
No more than ±2.5%
or ±0.25pF
whichever is larger
• Class (II)
X7R/X5R:±5%
Y5V/Z5U:±20%
To satisfy the specified
initial value.
To satisfy the specified
initial value.
Termination area shall be at
least 95% covered with a new
solder coating. There shall be no
crack and ceramic exposure of
terminated surface by melting.
• Class (I)
No more than ±2.5%
or ±0.25pF
whichever is larger
• Class (II)
X7R/X5R:±5%
Y5V/Z5U:±20%
To satisfy the specified
initial value.
To satisfy the specified
initial value.
Test Method
The capacitors shall be subjected
to 40°C, 90-95%RH for 500 hours.
After above testing condition, samples
shall be kept in room temperature for
24 hours (Class I) or 48 hours (Class II),
and then shall be measured.
Apply rated voltage at 40°C,
90-95%RH for 500 hours.
The surge current shall not exceed
50mA. After testing with above condition,
samples shall be kept in room tempera-
ture for 24 hours (Class I) or 48 hours
(Class II), and then shall be measured.
Perform 5 cycles as follow:
1. Room temperature. Dwell for 15 minutes.
2. Minimum operating temperature, dwell for
30 minutes.
3. Room temperature, dwell for 30 minutes.
4. Maximum operating temperature, dwell for
30 minutes.
After above testing condition, samples shall
be kept in room temperature for 24 hours
(Class I) or 48 hours (Class II), and then shall
be measured.
The capacitors are completely
immersed during 4±0.5 seconds
in the molten solder with a
temperature of 230±5˚C
*Solder: Sn 63.
Immerse into molten solder at
270±5˚C for 3±0.5 seconds.
Preheat before immersion.
1. 80~100˚C for 2 minutes.
2. 150~180˚C for 2 minutes.
3. 270±5˚C for 3±0.5 seconds.
The capacitance measurement
shall be made after sample
keeping at room temperature for
24 hours.
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
RELIABILITY AND TEST
CONDITIONS
∆C
Q
or
DF
IR
∆C
Q
or
DF
IR
∆C
Q
or
DF
IR
∆C
Q
or
DF
IR
GMC SERIES
17
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
APPLICATION MANUAL FOR
SURFACE MOUNTING
1. Temperature / Humidity Control
Since dew condensation may occur by the differences in temperature when
the products are take out of storage, it is important to maintain a temperature-
controlled environment.
2. Design of Solder Land Pattern
When designing printed circuit boards, the shape and size of the solder lands
must allow for the proper amount of solder on the capacitor. The amount of solder
at the end terminations has a direct effect on the probability that the chip will
crack. The greater amount of solder, the larger amount of stress on the chip, and
the more likely that it will break. Use the following illustrations as guidelines for
proper solder land design.
Recommendation of solder land shape and size.
3. Adhesives
MLCCs generally require the use of an adhesive to adhere the chips to the circuit
board prior to wave soldering.
3-1. Requirements for Adhesives
- They must have enough adhesion so that the chips will not fall off or move
during the handling of the circuit board.
- They must maintain their adhesive strength when exposed to soldering
temperatures.
- They should not spread or run when applied to the circuit board.
- They should have a long pot life.
- They should harden quickly.
- They should not corrode the circuit board or chip material.
- They should be a good insulator.
- They should be non-toxic, and not produce harmful gases, nor be harmful
when touched.
3-2. Application Method
It is important to use the proper amount of adhesive. Too little will cause poor
adhesion to the circuit board, and too much may strain the conductor pattern,
thereby causing defective soldering. The following illustrations show the proper
quantity of adhesive.
3-3. Adhesive Hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160°C
or less, within 2 minutes or less.
Type
a
b
c
21
0.2 min
70~100µm
>0
31
0.2 min
70~100µm
>0
(Unit: mm)
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18
4. Mounting
4-1. Mounting Head Pressure
Excessive pressure will cause chip capacitors to crack. The pressure between
nozzle and chip capacitor will be 300g maximum during mounting.
4-2.Bending Stress
Bending of printed circuit board by mounting head when double-sided circuit
boards are used, chip capacitors first are mounted and soldered onto one side of
the board. When the capacitors are mounted onto the other side, it is important
to support the board as shown in the illustration. If the circuit board is not
supported, it may bend, causing the already installed capacitors to crack.
5. Flux
Although highly activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitors. To avoid such
degradation, it is recommended that a mildly activated rosin flux (less than 0.2%
chlorine) be used.
6. Soldering
Since a multilayer chip ceramic capacitor comes into direct contact with melted
solder during soldering, it is exposed to potentially damaging mechanical stress
caused by the sudden temperature change. The capacitor may also be subject to
silver migration, and to contamination by the flux. Because of these factors, soldering
technique is critical.
6-1. Soldering Methods
6-2. Soldering Profile
To avoid the crack problem by sudden temperature change, follow the temperature
profile in graph 64.
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
Method Classification
Reflow
Soldering
Flow
Soldering
Selective
reflow
Mass
reflow
• IR/Convection
• VPS (Vapor phase)
• Hot air/gas
• Laser
Dual Wave
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6-3 Flux selection
Although highly-activated flux gives better solderability, substances which increase activi
ty may
also degrade the insulation of the chip capacitors. To avoid such degradation, the following is
recommended.
1) It is recommended to use a mildly activated rosin flux (less than 0.1 wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
6-4 Recommended soldering profile by various methods
Recommended IR reflow soldering profile for SMT
process with SnAgCu series solder paste.
Recommended wave soldering profile for
SMT process with SnAgCu series solder.
# Wave soldering is recommended only
for the following case sizes:
0603(1608); 0805(2012)&1206(3216)
thickness< 1mm
IR reflow soldering profile
Wave
soldering profile
Manual soldering (solder iron)
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
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Soldering
(Continued)
19
Multilayer Ceramic Chip Capacitors
Soldering
(Continued)
6-5 Avoiding thermal shock
1) Preheating condition
Soldering Size Temperature difference(Δ
ΔΔ
ΔT)
Wave soldering 1206 (3216) or less ΔT ≦ 150℃
1206 (3216) or less ΔT ≦ 190℃
Reflow soldering 1210 (3225) or more ΔT ≦ 130℃
1206 (3216) or less ΔT ≦ 190℃
Manual soldering 1210 (3225) or more ΔT ≦ 130℃
2) Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (ΔT) must be less than 100℃.
6-6 Amount of solder
Excessive solder will induce higher tensile force in chip capacitor when temperature
changes and may result in chip cracking. Insufficient solder may detach the capacitor
from the P.C. board.
6-7 Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C. board material and solder pad
size. Higher
tip temperature may be faster, but the heat shock may crack the chip capacitor. (Following
conditions are recommended.)
Temp. (℃) Wattage (W) Shape (mm)
300 Max 20 Max Φ3.0 Max
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitor may cause cracking.
Do not make contact directly with the ceramic dielectric.
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20
Multilayer Ceramic Chip Capacitors
21
Chip Size
0402*
0603*
0805
1206
1210
1812*
1825*
2220
2225*
3640*
L
0.021
0.035
0.040
0.040
0.040
0.050
0.050
0.050
0.050
0.060
W
0.022
0.030
0.050
0.065
0.100
0.120
0.250
0.250
0.250
0.400
S
0.017
0.030
0.040
0.080
0.080
0.130
0.130
0.130
0.170
0.300
T
0.059
0.100
0.120
0.160
0.160
0.230
0.230
0.230
0.270
0.420
Recommended Pad Dimensions
Cal-Chip Electronics, Incorporated
Multilayer Ceramic Chip Capacitors
APPLICATION INFORMATION ON SOLDER PAD DESIGN
FOR SURFACE MOUNT CHIP CAPACITOR
Dimensions (inches)
*These sizes are recommended for use with IR and vapor phase soldering only.
NOTICE: Specifications are subject to change without notice. Contact your nearest Cal-Chip Sales Office for the latest specifications.
All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee,
warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are
made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any
patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications
are typical and may not apply to all applications.
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