1
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
SPECIFICATIONS NPO
Case Sizes 0201 0402 0603 0805
Capacitance Range* 1.0pF ~ 15pF 0.5pF ~ 470pF 0.5pF ~ 3300pF 1.0pF ~ 150pF
Capacitance Tolerance
Cap. Values < 5pF: ±0.1pF(B), ±0.25pF(C)
Cap. Values 5pF ~ 8.2pF: ±0.25pF(C), ±0.5pF(D)
Cap. Values >10pF: ±1%(F), ±2%(G), ±5% (J)
Operating Temperature Range -55°C ~ +125°C
Temperature Characteristics 0 ± 30PPM/°C
Rated Voltage 16Vdc, 25Vdc, 50Vdc 16Vdc, 25Vdc, 50Vdc & 100Vdc
Q Factor* Cap. Values <30pF: Q > 400 + 20C
Cap. Values >30pF: Q > 1000
ESR
Cap. Values < 2.2pF: <1000mΩ@900MHz ± 100MHz
Cap. Values 2.2pF ~ 470pF: <500mΩ@900MHz ± 100MHz
Cap. Values >470pF: <500mΩ@60MHz ± 10MHz
Insulation Resistance 10,000 Megohms min. @ +25°C
Dielectric Withstanding Voltage 250% of rated voltage for 1 ~ 5 seconds
Test Conditions (Cap. & Q) *1.0 ± 0.2Vrms, 1MHz ±10% (<1000pF) or 1KHz ± 10% (>1000pF)
NMC-L Series
FEATURES
• LOWER ESR - HIGH Q at HIGH FREQUENCY
• STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE
• EIA 0201, 0402, 0603 & 0805 CASE SIZES
• WIDE CAPACITANCE (UP TO 3,300pF) & VOLTAGE RANGE (UP TO 100VDC)
NMC-L 0603 NPO 100 J 50 TRP F
RoHS Compliant
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, fi rst 2 digits are
signifi cant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
Series
PART NUMBER SYSTEM
Multilayer Ceramic Chip Capacitors
PP
L
W
T
100% Sn over Ni barrier
*See Part Number System for Details
EIA Case Size 0201 0402 0603 0805
Length (L) 0.6 ± 0.05 1.0 ± 0.05 1.6 ±0.10 2.0 ±0.10
Width (W) 0.3 ± 0.05 0.5 ± 0.05 0.8 ± 0.10 1.25 ± 0.10
Thickness (T) 0.33 max. 0.60 max. 1.0 max. 1.3 max.
Termination Width (P) 0.10 ~ 0.20 0.15 ~ 0.30 0.12 ~ 0.55 0.25 ~ 0.71
See Part Number System for Details
RoHS
Compliant
Includes all homogeneous materials
2
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
EIA Case Size 0201 0402 0603 0805
2.0 0.6 ± 0.05 1.0 ± 0.05 1.6 ±0.10 2.0 ± 0.1
Width (W) 0.3 ± 0.05 0.5 ± 0.05 0.8 ± 0.10 1.25 ± 0.1
Thickness max. (T) 0.33 max 0.55 max. 0.87 max. 1.30 max.
Termination Width (P) 0.10 ~ 0.20 0.15 ~ 0.30 0.25 ~ 0.55 0.25 ~ 0.71
Capacitance (pF) Working Voltage (Vdc)
25V 16 25 50 100 16 25 50 100 50 100
0.5
0.700Ω
max. ESR
@ 500MHz
0.700Ω
max. ESR
@ 500MHz
0.700Ω
max. ESR
@ 500MHz
0.6
0.7
0.8
0.9
1.0
0.700Ω
max. ESR
@ 1GHz
1.2
1.5
1.8
2.2
2.7
3.3
3.9
0.385Ω
max. ESR
@ 1GHz
4.7
0.385Ω
max. ESR
@ 500MHz
0.385Ω
max. ESR
@ 500MHz
0.385Ω
max. ESR
@ 500MHz
5.6
6.8
8.2
10
12
15
18
22
0.300Ω
max. ESR
@ 500MHz
0.300Ω
max. ESR
@ 500MHz
0.300Ω
max. ESR
@ 500MHz
27
33
39
47
56
68 0.260Ω
max. ESR
@ 500MHz
0.260Ω
max. ESR
@ 500MHz
0.260Ω
max. ESR
@ 500MHz
82
100
110 0.500Ω
max. ESR
@ 500MHz
0.400Ω
max. ESR
@ 500MHz
0.260Ω
max. ESR
@ 500MHz
120
130
150
180 500mΩ
max. ESR
@ 900MHz
500mΩ
max. ESR
@ 900MHz
220
270 500mΩ
max. ESR
@ 900MHz
500mΩ
max. ESR
@ 900MHz
330
390
470
560 500mΩ
max. ESR
@ 60MHz
680
820
1,000
1,200
500mΩ
max. ESR
@ 60MHz
1,500
1,800
2,200
2,700
3,300
NMC-L Series
Multilayer Ceramic Chip Capacitors
3
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
NMC-L Series
Multilayer Ceramic Chip Capacitors
4
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
NMC-L Series
Multilayer Ceramic Chip Capacitors
5
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Taping Specifi cations
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
REEL DIMENSIONS (mm)
7 INCH REEL QUANTITIES*
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
Notes:
1. Specifi cations are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type AoBoWF E P1 P0D0
T1
max.
T2
max.
Mounting
Hole
01005 0.25 ± 0.04 0.45 ± 0.04
8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1 1.5
+0.1/-0.0
0.27 0.36
Angular
Punch
Hole
0201 0.37 ± 0.03 0.67 ± 0.05 0.45 0.80
0402 0.65 ± 0.05 1.15 ± 0.05
1.1 1.4
0603 1.1 ± 0.2 1.9 ± 0.2
4.0 ± 0.100805 1.65 ± 0.2 2.4 ± 0.2
1206 2.0 ± 0.2 3.6 ± 0.2
Size 01005 0201 0402 0603 0805 1206 1210 1812
Tape Size 8mm 8mm 8mm 8mm 8mm 8mm 8mm 12mm
Min. Qty
Per Reel 20,000 20,000 10,000 4,000 4,000 4,000 2,000 1,000
Max. Qty
Per Reel 20,000 20,000 10,000 4,000 5,000 5,000 5,000 2,000
Multilayer Ceramic Chip Capacitors
Reel Diameter (A) B C D T max.
7” (178 ± 2.0)
13 ± 0.5
50 min.
21 ± 1.0
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
10” (250 ± 2.0) 100 ± 1.0
13” (330 ± 2.0) 100 ± 1.0
C
B
T
A
REEL
D
Tape Size W F E P0P2D K max. T max. P
8mm 8.0 ± 0.2 3.5 ± 0.05 1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1
-0.0 3.02.0 4.0 ± 0.1
12mm 12 ± 0.2 5.5 ± 0.05 4.5 8.0 ± 0.1
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
CARRIER TAPE MATERIAL
EMBOSSED PLASTIC CARRIER TAPE
K
T
DP
o
W
F
A
o
P
B
o
E
P
2
See notes 2 & 3 regarding dimensions
Ao and Bo
t2
t1
DP
o
W
F
A
o
P1
Component
Pitch
B
o
E
PUNCHED CARRIER TAPE
