September 2011 Doc ID 2914 Rev 3 1/9
9
1N5908
SM5908
Transil™
Features
■Peak pulse power:
– 1500 W (10/1000 μs)
■Stand off voltage: 5 V
■Unidirectional
■Operating Tjmax
: 175 °C
■High power capability at Tjmax
:
– 1500 W (10/1000 µs)
■JEDEC registered package outline
Complies with the following standards
■IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■IEC 61000-4-5
■MIL STD 883G, method 3015-7 Class 3B
– 25 kV HBM (human body model)
■Resin meets UL 94, V0
■MIL-STD-750, method 2026 solderability
■EIA STD RS-481 and IEC 60286-3 packing
■IPC 7531 footprint
Description
This Transil series has been designed to protect
sensitive equipment against electrostatic
discharges according to IEC 61000-4-2, and
MIL STD 883, method 3015, and electrical over
stress according to IEC 61000-4-4 and 5. These
devices are more generally used against surges
below 1500 W (10/1000 μs).
The Planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
They are packaged in SMC (SMC footprint in
accordance with IPC 7531 standard) and
DO-201.
TM: Transil is a trademark of STMicroelectroniocs
K
A
SMC
(JEDEC DO-214AB)
K
A
DO-201
www.st.com
Characteristics 1N5908, SM5908
2/9 Doc ID 2914 Rev 3
1 Characteristics
Figure 1. Electrical characteristics - definitions
Figure 2. Pulse definition for electrical characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
PPP Peak pulse power dissipation (1) Tj initial = Tamb 1500 W
Tstg Storage temperature range -65 to +175 ° C
TjOperating junction temperature range -55 to +175 ° C
TLMaximum lead temperature for soldering during 10 s. 260 ° C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Thermal resistances
Symbol Parameter Value Unit
Rth(j-l) Junction to leads SMC 15
° C/W
DO-201 20
Rth(j-a)
Junction to ambient on printed circuit on recommended pad layout SMC 90
Junction to ambient DO-201 75
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
Symbol Parameter
V Stand-off voltage
V Breakdown voltage
V Clamping voltage
I Leakage current @ V
I Peak pulse current
T Voltage temperature coefficient
V Forward voltage drop
R Dynamic resistance
RM
BR
CL
RM RM
PP
F
D
a
Repetitive pulse current
tr= rise time (µs)
tp= pulse duration time (µs)
trtp
1N5908, SM5908 Characteristics
Doc ID 2914 Rev 3 3/9
Table 3. Electrical characteristics - parameter values (Tamb = 25 °C)
Order code
IRM @VRM VBR @IR (1)
1. Pulse tes: tp < 50 ms
VCL @IPP
,
10/1000 µs
VCL @IPP
,
10/1000 µs
VCL @IPP
,
10/1000 µs αT (2)
2. To calculate VBR or VCL versus junction temperature, use the following formulas:
VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25))
VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ – 25))
C
max min max max max max typ
µA V V mA V A(3)
3. Surge capability given for both directions
VA
(3) VA
(3) 10-4/ °C pF
1N5908 300 5 6 1 7.6 30 8 60 8.5 120 5.7 9500
SM5908
Figure 3. Peak pulse power dissipation
versus initial junction temperature
Figure 4. Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
P
pp
(
W
)
0
500
1000
1500
2000
0 25 50 75 100 125 150 175 200
T
j
(°C)
0.1
1.0
10.0
100.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
P
PP
(kW)
Tjinitial = 25 °C
tP(ms)
Characteristics 1N5908, SM5908
4/9 Doc ID 2914 Rev 3
Figure 5. Clamping voltage versus peak pulse current (exponential waveform, typical values)
IPP(A)
0.1
1.0
10.0
100.0
1000.0
1 10 100
10/1000 µs
Tjinitial=25 °C 8/20 µs
VCL(V)
Figure 6. Junction capacitance versus
reverse applied voltage
(typical values)
Figure 7. Peak forward voltage drop
versus peak forward current
(typical values)
1
10
12345
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
VR(V)
C(nF)
I
FM
(A)
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Tj=25 °C
Tj=125 °C
VFM(V)
1N5908, SM5908 Characteristics
Doc ID 2914 Rev 3 5/9
Figure 8. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (SMC)
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (DO-201)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead (SMC)
Figure 11. Leakage current versus junction
temperature (typical values)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Z
th(j-a)
/R
th(j-a)
tP(s)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
Z
th(j-a)
/R
th(j-a)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tP(s)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SCU(cm²)
PCB FR4, copper thickness = 35 µm
I
R
(A)
1.E+00
1.E+01
1.E+02
25 50 75 100 125 150 175
Tj(°C)
µ
Package information 1N5908, SM5908
6/9 Doc ID 2914 Rev 3
2 Package information
●Case: JEDEC DO-214AB molded plastic over planar junction
●Terminals: solder plated, solderable per MIL-STD-750, Method 2026
●Polarity: for unidirectional types the band indicates cathode
●Flammability: epoxy is rated UL94V-0
●RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4. SMC dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Figure 12. SMC footprint dimensions mm
(inches)
Figure 13. SMC marking layout(1)
1. Marking layout can vary according to assembly location.
E
CLE2
E1
D
A1
A2
b
8.19
1.545.111.54
(0.061) (0.201)
(0.322)
(0.124)
(0.061)
3.14
y w wz
x x x
: ECOPACK status
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar
1N5908, SM5908 Package information
Doc ID 2914 Rev 3 7/9
Table 6. DO-201 marking layout
Table 5. DO-201 Dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 8.5 9.5 0.335 0.374
B25.4 1
Ø C 4.8 5.3 0.189 0.209
Ø D 0.96 1.06 0.038 0.042
ØC
ØD
A
BB
e, G : Ecopack status
x: Marking
mmm : Manufacturing location
y:Year
ww: week
x x
x x x x x
y w wm m m
x x x x
Cathode bar
Ordering information 1N5908, SM5908
8/9 Doc ID 2914 Rev 3
3 Ordering information
Table 7. Ordering information
4 Revision history
02-Jul
Order code Marking Package Weight Base qty Delivery mode
SM5908 MDC SMC 0.25 g 2500 Tape and reel
1N5908 1N5908 DO-201 0.9 g 600 Ammopack
Table 8. Document revision history
Date Revision Changes
Aug-1999 2A Previous release
20-Sep-2011 3
Added cathode bands. Added standards compliance
statements. Updated Description. Updated Ta b l e 1 and Ta bl e 2 .
Updated Figures 3 through 11. Updated Section 2: Package
information.
1N5908, SM5908
Doc ID 2914 Rev 3 9/9
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