F1235A - OSRAM GmbH - Datasheet.Live

F 1235A

GaAs-Infrarot-Lumineszenzdiode (950 nm, 200 µm Kantenlänge)

GaAs Infrared Emitting Diode (950 nm, 8 mil)

Vorläufige Daten / Preliminary data

2002-02-21 1

Wesentliche Merkmale

• Typ. Gesamtleistung: 10 mW @ 100 mA im

TOPLED® Gehäuse

•Chipgröße 200 x 200 µm2

•Wellenlänge der Strahlung 950 nm

•GaAs-LED mit sehr hohem Wirkungsgrad

•Gleichstrom- oder Impulsbetrieb möglich

•Hohe Zuverlässigkeit

Anwendungen

•Miniaturlichtschranken für Gleich- und

Wechsellichtbetrieb, Lochstreifenleser

•Industrieelektronik

•Bandende Erkennung (z.B. Videorecorder)

•Datenübertragung

•Positionsüberwachung

•Barcode-Leser

•„Messen/Steuern/Regeln“

•Automobiltechnik

•Sensorik

•Alarm- und Sicherungssysteme

•IR-Freiraumübertragung

Typ

Type Bestellnummer

Ordering Code Gehäuse

Package

F 1235A Q 67220-C1274 Infrarot emittierender Chip, Oberseite Anodenanschluß,

Rückseite AuGe-Eutektikum

Infrared emitting die, top side anode connection, backside

AuGe eutecticum alloy

Features

•Typ. total radiant power: 10 mW @ 100 mA in

TOPLED® package

•Chip size 200 x 200 µm2

•Peak wavelength of 950 nm

•Very highly efficient GaAs LED

•DC or pulsed operations are possible

•High reliability

Applications

•Miniature photointerrupters

•Industrial electronics

•Tape end detection (VCR e.g.)

•Data transmission

•Position sensing

•Barcode reader

•Drive and control circuits

•Automotive technology

•Sensor technology

•Alarm and safety equipment

•IR free air transmission

2002-02-21 2

F 1235A

Elektrische Werte (gemessen auf TO18-Bodenplatte ohne Verguss, TA = 25 °C)

Electrical values (measured on TO18 header without resin, TA = 25 °C)

Bezeichnung

Parameter Symbol

Symbol Wert1)

Value1) Einheit

Unit

min. typ. max.

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 10 mA

λpeak 950 nm

Spektrale Bandbreite bei 50% von Imax,

IF = 10 mA

Spectral bandwidth at 50% of Imax

∆λ 55 nm

Sperrspannung

reverse voltage

IR = 10 µA

VR530 V

Schaltzeiten, Ie von 10% a uf 90% und von 90% auf

10%, bei IF = 100 mA, RL = 50 Ω

Switching t imes, Ie from 10% to 90% and from

90% to 10%, IF = 100 mA, RL = 50 Ω

tr, tf350 ns

Durchlaβspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tP = 100ms VF1.5 1.6 V

Gesamtstrahlfluß4)

radiant power4)

IF = 100mA, t = 20 ms

Φe36 mW

F 1235A

2002-02-21 3

Mechanische Werte

Mechanical values

Bezeichnung

Parameter Symbol

Symbol Wert1)

Value1) Einheit

Unit

min. typ. max.

Chipkantenlänge (x-Richtun g)

Length of chip edge (x-direction) Lx0.18 0.2 0.22 mm

Chipkantenlänge (y-Richtun g)

Length of chip edge (y-direction) Ly0.18 0.2 0.22 mm

Durchmesser des Wafers

Diameter of the wafer D76.2 mm

Chiphöhe

Die height H170 185 200 µm

Bondpaddurchmesser

Diameter of bondpad d120 µm

Bezeichnung

Parameter Wert

Value

Vorderseitenmetallisierung

Metallization frontside Aluminium

Aluminum

Rückseitenmetallisierung

Metallization backside AuGe-Eutektikum

AuGe eutectic alloy

Trennverfahren

Dicing Sägen

Sawing

Verbindung Chip - Träger

Die bonding Legieren

Eutectic bonding

F 1235A

2002-02-21 4

Grenzwerte3) (TA = 25 °C)

Maximum Ratings3)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Maximaler Betriebstemperaturbereich

Maximum operating temperature range Top - 40...+100 °C

Maximaler Lagertemperaturbereich

Maximum storage temperatur range Tstg - 40...+100 °C

Maximaler Durchlaßstrom

Maximum forward current IF30 mA

Maximaler Stoßstrom

maximum surge current

tp = 10 µs, D = 0.005

IS0.5 A

Maximale Sperrschichttemperatur

Maximum junction temperature Tj125 °C

F 1235A

2002-02-21 5

Relative Spectral Emission2)Irel = f (λ)

TA = 25 °C

Forward Current2)

IF= f (VF), Single pulse, tp = 20 µs, TA = 25 °C

Radiant Intensity2)

Single pulse, tP = 20 µs, TA = 25 °C

OHR01938

rel

0880 920 960 1000

1060

100

OHF00367

-2

12340.5 1.5 2.5 V

-1

Ιe

Ιe 100 mA = f (IF)

OHF00369

10-1 1001012

10 103

-3

-2

-1

100

e (100 mA)

2002-02-21 6

F 1235A

Maßzeichnung

Chip Outlines

Maße werden als typische1) Wer te wie f olgt angegebe n: mm (inch) / Dimensions are specified as typical1) values as

follows: mm (inch).

GMOY6073

0.185 (0.0073)

0.12 (0.0047)

p-contact

n-contact

0.2 (0.0079)

F 1235A

2002-02-21 7

Published by OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

Attention please!

The inform ation gen erally descri bes the type of compone nt and shall not be considered as assured ch aracteristic s or

detaile d sp ec if ic at ion.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substa nc es . For information on the types in question pleas e c ont ac t our s ales organizatio n.

Packing

Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.

By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Com pon en ts used in life- su pport devices or system s mu st be expressl y au thorized b y us for su ch p ur p o se!

Critical components5), may only be used in life-support devices or systems6) with the express written approval of

OSRAM OS.

1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.

This is not a spe cified value. For final e lectrical te sting a spot check with sufficient st atistical accura cy is carr ied out.

Minimum and maximum values( refered to as min. and max.) refer to the limits of the sample measurement.

2) Based on data measured in OSRAM Opto Semiconductor’s TOPLED® pa c ka ge. T hey represent typical1) data.

3) Maximum ratings are strongly package dependent and may differ between different packages. The values given

represent the chip in an OSRAM OS TO PLED® package and are only valid for this package.

4) Value is refe renc ed to the vendor’s measure m ent sys t em (correlati on t o cu stom er product( s) is requ ired).

5)A critical component is a component used in a life -support device or system whose fai lure can reasonably be expected

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

6)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain

and sust ain human life. If th ey fail , it is rea so nable to assum e th at the health of the user m ay be endange red.