DATA SH EET
File under Integrated Circuits, IC18 1995 Oct 25
INTEGRATED CIRCUITS
Package outlines
Package information
PACKAGE INFORMATION
Index
CDIP
CLCC
CQFP
DBS
DIP
HDIP
PLCC
QFP
SIL
SO
SSOP
Soldering
Page
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1995 Oct 25 2
Philips Semiconductors
Package information Package outlines
INDEX
NAME DESCRIPTION VERSION PAGE
CDIP (ceramic dual in-line package)
CDIP24 ceramic dual in-line package; 24 leads (300 mil) 0586B
CDIP28 ceramic dual in-line package; 28 leads (600 mil) 0589B
CDIP40 ceramic dual in-line package; 40 leads (600 mil) 0590B
CLCC (ceramic leaded chip carrier)
CLCC44 ceramic leaded chip carrier; 44 leads; j-bent 1472A
CLCC68 ceramic leaded chip carrier (window); 68 leads NO330
CQFP (ceramic quad flat package)
CQFP80 ceramic quad flat package; 80 leads SOT351-1
DBS (DIL-bent-SIL)
DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
DIP (dual in-line package)
DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
DIP24 plastic dual in-line package; 24 leads (300 mil) SOT222-1
DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
DIP28 plastic dual in-line package; 28 leads (600 mil); long body SOT117-2
DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1
HDIP (heat-dissipating dual in-line package)
HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1
PLCC (plastic leaded chip carrier)
PLCC28 plastic leaded chip carrier; 28 leads; pedestal SOT261-3
PLCC44 plastic leaded chip carrier; 44 leads SOT187-2
PLCC68 plastic leaded chip carrier; 68 leads SOT188-2
QFP (quad flat package)
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 ×10 ×1.75 mm SOT307-2
QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm);
body 14 ×20 ×2.7 mm; high stand-off height SOT318-1
SIL (single in-line)
SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
1995 Oct 25 3
Philips Semiconductors
Package information Package outlines
SO (small outline)
SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
SSOP (shrink small outline package)
SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
NAME DESCRIPTION VERSION PAGE
1995 Oct 25 4
Philips Semiconductors
Package information Package outlines
CDIP
CDIP24: ceramic dual in-line (F) package (with window (FA) package); 24 leads (300 mil) 0586B
NOTES:
1. Controlling dimension: Inches. Millimeters are
2. Dimension and tolerancing per ANSI Y14. 5M-1982.
3. ™T∫, ™D∫, and ™E∫ are reference datums on the body
4. These dimensions measured with the leads
5. Pin numbers start with Pin #1 and continue
6. Denotes window location for EPROM products.
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
constrained to be perpendicular to plane T.
counterclockwise to Pin #24 when viewed
shown in parentheses.
from the top.
0.200 (5.08)
0.010 (0.254)TED
0.023 (0.58)
0.015 (0.38)
0.165 (4.19)
0.125 (3.18)
0.070 (1.78)
0.050 (1.27)
± T ±
SEATING
PLANE
0.165 (4.19)
0.175 (4.45)
0.145 (3.68)
0.320 (8.13)
0.290 (7.37)
(NOTE 4)
BSC
0.300 (7.62)
0.395 (10.03)
0.300 (7.62)
(NOTE 4)
0.015 (0.38)
0.010 (0.25)
0.035 (0.89)
0.020 (0.51)
SEE NOTE 6
± D ±
PIN # 1
± E ±0.306 (7.77)
0.285 (7.24)
0.100 (2.54) BSC
1.280 (32.51)
1.240 (31.40)
0.098 (2.49)
0.030 (0.76)
0.098 (2.49)
0.030 (0.76)
1995 Oct 25 5
Philips Semiconductors
Package information Package outlines
CDIP28: ceramic dual in-line (F) package (with window (FA) package); 28 leads (600 mil) 0589B
NOTES:
1. Controlling dimension: Inches. Millimeters are
2. Dimension and tolerancing per ANSI Y14. 5M-1982.
3. ™T∫, ™D∫, and ™E∫ are reference datums on the body
4. These dimensions measured with the leads
5. Pin numbers start with Pin #1 and continue
6. Denotes window location for EPROM products.
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
constrained to be perpendicular to plane T.
counterclockwise to Pin #28 when viewed
shown in parentheses.
from the top.
± D ±
PIN # 1
± E ±
0.225 (5.72) MAX.
0.010 (0.254)TED
0.023 (0.58)
0.015 (0.38)
0.165 (4.19)
0.125 (3.18)
0.070 (1.78)
0.050 (1.27)
± T ±
SEATING
PLANE
0.598 (15.19)
0.514 (13.06)
0.100 (2.54) BSC
1.485 (37.72)
1.440 (36.58)
0.098 (2.49)
0.040 (1.02)
0.098 (2.49)
0.040 (1.02) SEE NOTE 6
0.620 (15.75)
0.590 (14.99)
(NOTE 4)
BSC
0.600 (15.24)
0.695 (17.65)
0.600 (15.24)
(NOTE 4)
0.015 (0.38)
0.010 (0.25)
0.175 (4.45)
0.145 (3.68)
0.055 (1.40)
0.020 (0.51)
1995 Oct 25 6
Philips Semiconductors
Package information Package outlines
0590B
NOTES:
1. Controlling dimension: Inches. Millimeters are
2. Dimension and tolerancing per ANSI Y14. 5M-1982.
3. ™T∫, ™D∫, and ™E∫ are reference datums on the body
4. These dimensions measured with the leads
5. Pin numbers start with Pin #1 and continue
6. Denotes window location for EPROM products.
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
constrained to be perpendicular to plane T.
counterclockwise to Pin #40 when viewed
shown in parentheses.
from the top.
± D ±
PIN # 1
± E ±
0.225 (5.72) MAX.
0.010 (0.254)TED
0.023 (0.58)
0.015 (0.38)
0.165 (4.19)
0.125 (3.18)
0.070 (1.78)
0.050 (1.27)
± T ±
SEATING
PLANE
0.620 (15.75)
0.590 (14.99)
(NOTE 4)
0.598 (15.19)
0.571 (14.50)
BSC
0.600 (15.24)
0.695 (17.65)
0.600 (15.24)
(NOTE 4)
0.015 (0.38)
0.010 (0.25)
0.175 (4.45)
0.145 (3.68)
0.055 (1.40)
0.020 (0.51)
0.100 (2.54) BSC
2.087 (53.01)
2.038 (51.77)
0.098 (2.49)
0.040 (1.02)
0.098 (2.49)
0.040 (1.02) SEE NOTE 6
CDIP40: ceramic dual in-line (F) package (with window (FA) package); 40 leads (600 mil)
1995 Oct 25 7
Philips Semiconductors
Package information Package outlines
CLCC
CLCC44: ceramic leaded chip carrier; 44 leads; j-bent 1472A
NOTES:
1. All dimensions and tolerances to conform
2. UV window is optional.
3. Dimensions do not include glass protrusion.
Glass protrusion to be 0.005 inches maximum
4. Controlling dimension millimeters.
5. All dimensions and tolerances include
lead trim offset and lead plating finish.
6. Backside solder relief is optional and
dimensions are for reference only.
1.02 (0.040) X 45ϒ
16.89 (0.665)
16.00 (0.630)
17.65 (0.695)
17.40 (0.685)
CHAMFER
45
16.89 (0.665)
16.00 (0.630)
17.65 (0.695)
17.40 (0.685)
on each side.
to ANSI Y14.5±1982.
23
3 X 0.63 (0.025) R MIN.
3.05 (0.120)
2.29 (0.090)
4.83 (0.190)
3.94 (0.155) SEATING
PLANE
0.38 (0.015)
0.51 (0.02) X 45ϒ
6
6
17.65 (0.656)
17.40 (0.685)
1.27 (0.050)
12.7 (0.500)
8.13 (0.320)
7.37 (0.290)
40X
4.83 (0.190)
3.94 (0.155)
SEATING
PLANE
0.15 (0.006) MIN.
0.25 (0.010) R MIN.
0.508 (0.020) R MIN.
0.25 (0.010)
0.15 (0.006)
90 + 5
±10
ϒϒ
ϒ
0.076 (0.003) MIN.
DETAIL B
mm/(inch)
SEE DETAIL B
SEE DETAIL A
DETAIL A
TYP. ALL SIDES
mm/(inch)
1.52 (0.060) REF.
0.482 (0.019 + 0.002)
SEATING
PLANE
1.02 + 0.25 (0.040 + 0.010) BASE PLANE
45 TYP.
4 PLACES
ϒ
0.73 + 0.08 (0.029 + 0.003)
1.27 (0.050) TYP.
NOMINAL
8.13 (0.320)
7.37 (0.290)
3
1995 Oct 25 8
Philips Semiconductors
Package information Package outlines
CLCC68: ceramic leaded chip carrier (window); 68 leads NO330
17.27
1.02
(3x)
10
0.51
1
68
60 44
43
27
26
9.98
17.27 0.2 A
A
0.2 B
B
0.48
1.27
(64 x)
seating plane
X
25.45
24.85
pin 1
index
24.43
23.83
24.43
23.83 24.13
23.11 25.45
24.85
MBC655
detail X
0.35
0.25
4.25
3.75
45o9
45o61
1995 Oct 25 9
Philips Semiconductors
Package information Package outlines
CQFP
UNIT A1A2bc Ee ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.5
0.2 3.9
3.1 0.45
0.30 0.25
0.14 14.2
13.9 0.8
∅ j
9.00
8.75 7
0
o
o
0.20.2 0.15
DIMENSIONS (mm are the original dimensions)
SOT351-1
D
20.2
19.8
HD
24.2
23.6
HE
18.2
17.6
b
e
θ
EA1
detail X
B
24
c
b
E
HA2
D
A
e
vMA
1
80
65
64 4140
25
pin 1 index
X
y
D
HvMB
wM
wM
93-11-02
0 5 10 mm
scale
CQFP80: ceramic quad flat package; 80 leads SOT351-1
∅ j
1995 Oct 25 10
Philips Semiconductors
Package information Package outlines
DBS
UNIT A e1
A2bpcD
(1) E(1) Z(1)
deD
hLL
3m
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 3.4
v
0.8
12.2
11.8 1.7
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25
w
0.03
x
D
L
E
A
c
A2
m
L3
Q
wM
bp
1
d
D
Ze2
e
e
xh
113
j
E
h
non-concave
view B: mounting base side
95-03-11
97-12-16
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
vM
B
1995 Oct 25 11
Philips Semiconductors
Package information Package outlines
DIP
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1995 Oct 25 12
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 (1) (1)
b1cD (1)
Z
Ee M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1 92-11-17
95-03-11
A
min. A
max. bmax.
w
ME
e1
1.73
1.13 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.24.2 0.51 3.2
0.068
0.044 0.021
0.015 0.77
0.73
0.014
0.009 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0870.17 0.020 0.13
050G04 MO-001AA
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
14
1
8
7
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
1995 Oct 25 13
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT38-4 92-11-17
95-01-14
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 0.764.2 0.51 3.2
inches 0.068
0.051 0.021
0.015 0.014
0.009
1.25
0.85
0.049
0.033 0.77
0.73 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0300.17 0.020 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
1995 Oct 25 14
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 92-11-17
95-05-24
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.04.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0780.17 0.020 0.13
SC603
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1995 Oct 25 15
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
SOT222-1 95-03-11
A
min. A
max. bZ
max.
w
ME
e1
1.63
1.14 0.56
0.43 0.36
0.25 31.9
31.5 6.73
6.48 3.51
3.05 0.252.54 7.62 8.13
7.62 10.03
7.62 2.05
4.70 0.38 3.94
0.064
0.045 0.022
0.017 0.014
0.010 1.256
1.240 0.265
0.255 0.138
0.120 0.010.100 0.300 0.32
0.30 0.395
0.300 0.081
0.185 0.015 0.155
MS-001AF
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
24
1
13
12
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
pin 1 index
(1)
(1)(1)
DIP24: plastic dual in-line package; 24 leads (300 mil) SOT222-1
1995 Oct 25 16
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1(1)
(1) (1)
cD E weM
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT117-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 36.0
35.0 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 1.75.1 0.51 4.0
0.066
0.051 0.020
0.014 0.013
0.009 1.41
1.34 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0670.20 0.020 0.16
051G05 MO-015AH
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
28
1
15
14
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
1995 Oct 25 17
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cDE eM
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
SOT117-2 95-03-11
(1)
(1)(1)
A
min. A
max. bZ
max.
w
ME
e1
1.63
1.14 0.56
0.43 0.38
0.25 37.08
35.94 14.22
13.84 3.51
3.05 0.252.54 15.24 15.75
15.24 17.65
15.24 2.10
5.08 0.51 3.94
0.064
0.045 0.022
0.017 0.015
0.010 1.460
1.415 0.560
0.545 0.138
0.120 0.010.100 0.600 0.62
0.60 0.695
0.600 0.083
0.200 0.020 0.155
MS-011AB
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
28
1
15
14
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
pin 1 index
DIP28: plastic dual in-line package; 28 leads (600 mil); long body SOT117-2
1995 Oct 25 18
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
w
ME
e1
1.70
1.14 0.53
0.38 0.36
0.23 52.50
51.50 14.1
13.7 3.60
3.05 0.2542.54 15.24 15.80
15.24 17.42
15.90 2.254.7 0.51 4.0
0.067
0.045 0.021
0.015 0.014
0.009 2.067
2.028 0.56
0.54 0.14
0.12 0.010.10 0.60 0.62
0.60 0.69
0.63 0.089 0.19 0.020 0.16
051G08 MO-015AJ
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
40
1
21
20
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1)(1)
DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
1995 Oct 25 19
Philips Semiconductors
Package information Package outlines
HDIP
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT398-1 94-04-13
95-01-25
A
min. A
max. bmax.
w
ME
e1
1.40
1.14 0.67
0.50 0.47
0.38 21.85
21.35 6.5
6.2 3.9
3.1 0.252.54 7.62 8.32
8.02 8.7
7.7 1.04.7 0.51 3.7
inches 0.06
0.04 0.03
0.02 0.02
0.01
1.05
0.75
0.04
0.03 0.87
0.84 0.26
0.24 0.15
0.12 0.010.10 0.30 0.33
0.32 0.34
0.30 0.040.19 0.02 0.15
MH
c
(e )
1
ME
wM
b1
b2
e
A
A1
A2
L
seating plane
Z
D
E
18
1
10
9
b
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1
1995 Oct 25 20
Philips Semiconductors
Package information Package outlines
PLCC
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT261-3
19
25
28
1
4
511
18
12
26
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
MO-047AB
0 5 10 mm
scale
95-02-25
97-12-16
pin 1 index
PLCC28: plastic leaded chip carrier; 28 leads; pedestal SOT261-3
UNIT A A
min. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.13 3.05 0.53
0.33
0.021
0.013
1.27 12.57
12.32 2.06 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
11.58
11.43
HD
12.57
12.32
E
Z
2.06
D
b1
0.81
0.66
k
1.22
1.07
0.180
0.165 0.005 0.12
A3
0.25
0.01 0.05 0.495
0.485
Oj
5.69
5.54
0.224
0.218 0.081
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.456
0.450
11.58
11.43
0.456
0.450 0.495
0.485
eE
eD
10.92
9.91
0.430
0.390
10.92
9.91
0.430
0.390 0.081
0.032
0.026 0.048
0.042
E
e
inches
D
e
∅ j
1995 Oct 25 21
Philips Semiconductors
Package information Package outlines
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 4.57
4.19 0.51 3.05 0.53
0.33
0.021
0.013
16.66
16.51 1.27 17.65
17.40 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT187-2
D(1)
16.66
16.51
HD
17.65
17.40
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.12
A3
0.25
0.01 0.656
0.650 0.05 0.695
0.685 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.656
0.650 0.695
0.685
eE
eD
16.00
14.99
0.630
0.590
16.00
14.99
0.630
0.590 0.085
0.032
0.026 0.048
0.042
2939
44
1
6
717
28
18
40
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
e
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
112E10 MO-047AC
0 5 10 mm
scale
95-02-25
97-12-16
inches
PLCC44: plastic leaded chip carrier; 44 leads SOT187-2
D
e
1995 Oct 25 22
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT188-2
4460
68
1
9
10 26
43
27
61
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
112E10 MO-047AC
0 5 10 mm
scale
92-11-17
95-03-11
PLCC68: plastic leaded chip carrier; 68 leads SOT188-2
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.51 3.30 0.53
0.33
0.021
0.013
1.27 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
24.33
24.13
HD
25.27
25.02
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.13
A3
0.25
0.01 0.05 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.958
0.950
24.33
24.13
0.958
0.950 0.995
0.985
25.27
25.02
0.995
0.985
eE
eD
23.62
22.61
0.930
0.890
23.62
22.61
0.930
0.890 0.085
0.032
0.026 0.048
0.042
E
e
inches
D
e
1995 Oct 25 23
Philips Semiconductors
Package information Package outlines
QFP
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 1.85
1.65 0.25 0.40
0.20 0.25
0.14 10.1
9.9 0.8 1.3
12.9
12.3 1.2
0.8 10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2 95-02-04
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
ZE
e
vMA
X
1
44
34 33 23 22
12
y
θ
A1
A
Lp
detail X
L
(A )
3
A2
pin 1 index
D
HvMB
bp
bp
wM
wM
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
A
max.
2.10
1995 Oct 25 24
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.36
0.10 2.87
2.57 0.25 0.45
0.30 0.25
0.13 14.1
13.9 0.8 18.2
17.6 1.2
0.8 7
0
o
o
0.2 0.10.21.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT318-1 95-02-04
97-08-01
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
1.0
0.6
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
24
c
bp
E
HA2
D
HvMB
D
ZD
A
ZE
e
vMA
1
80
6564 41
40
25
pin 1 index
X
y
wM
wM
0 5 10 mm
scale
80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height
QFP80: plastic quad flat package; SOT318-1
A
max.
3.3
1995 Oct 25 25
Philips Semiconductors
Package information Package outlines
SIL
UNIT AA
max.
2A3b1D1
b2
bcD
(1) E(1) Z
max.
(1)
eLPP
1q
1
q
2
q
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 18.5
17.8 3.7 8.7
8.0
A4
15.8
15.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7 6.48
6.20 3.4
3.2
2.54 1.0
5.9
5.7
4.4
4.2
3.9
3.4 15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1 92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q1q2
L
Q
wM
b
b1
b2
D1
P
q
1
Ze
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
1995 Oct 25 26
Philips Semiconductors
Package information Package outlines
SO
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1995 Oct 25 27
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06S MS-012AB
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
95-01-23
97-05-22
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
1995 Oct 25 28
Philips Semiconductors
Package information Package outlines
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1 95-01-23
97-05-22
076E07S MS-012AC
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.39
0.38 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1995 Oct 25 29
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22
1995 Oct 25 30
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 18.1
17.7 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
e
15
1
(A )
3
A
y
0.25
075E06 MS-013AE
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.71
0.69 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
95-01-24
97-05-22
1995 Oct 25 31
Philips Semiconductors
Package information Package outlines
SSOP
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 8.4
8.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 0.8
0.4 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150AG 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
A
max.
2.0
1995 Oct 25 32
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 10.4
10.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 1.1
0.7 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT341-1 MO-150AH 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
114
28 15
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
A
max.
2.0
