CAN4311714002454K - YAGEO (PHYCOMP)

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 1 sheet 190-1

A4

spec.doc Yageo Taiwan

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

ANTENNA PRODUCTS

Feb, 2007 V1

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 2 sheet 190-2

A4

spec.doc Yageo Taiwan

2012 Ceramic Chip Antenna for

Bluetooth/WLAN Application

Quick Reference Data

Centre Frequency 2.45 GHz*¹

Bandwidth at least 70 MHz*²

VSWR 2.5 (Max.)*²

Polarization Linear

Azimuth Beamwidth Omni-directional

Peak Gain 4.0 dBi*²

Impedance 50Ω

Operating Temperature -55~125 oC

Termination Ni / Sn (Environmentally-Friendly Leadless)

Resistance to soldering heats 260℃ , 10sec.

Maximum Power 1W

1 All the technical data and information contained herein are subject to change without prior notice

2 Testing under evaluation board of page 4

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 3 sheet 190-3

A4

spec.doc Yageo Taiwan

1. Mechanical Data (2.0 x 1.25 x 1.1 mm)

Unit: mm

2. Layout of Soldering Pads

2.0+/-0.2mm

1.25+/-0.2mm

1.7 +/-0.1mm

1.4 +/-0.1mm

0.4 +/-0.1mm

1.0 +/-0.1mm

1.7 +/-0.1mm

1.4 +/-0.1mm

0.4 +/-0.1mm

1.0 +/-0.1mm

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 4 sheet 190-4

A4

spec.doc Yageo Taiwan

3. Dimension and Outlook of Evaluation Board

Unit: mm

18

10

30

20.5

Unit:mm

50 ohm Line

18

10

30

20.5

Unit:mm

50 ohm Line

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 5 sheet 190-5

A4

spec.doc Yageo Taiwan

4. Measurement of S-parameter

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 6 sheet 190-6

A4

spec.doc Yageo Taiwan

5.The Environment of Antenna Radiation Pattern

Anechoic Chamber Dimension=8(m) × 4(m) × 4(m)

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 7 sheet 190-7

A4

spec.doc Yageo Taiwan

6. 3D Radiation Pattern ( 40x18 mm demo board)

7. Layout Recommendation in Application

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 8 sheet 190-8

A4

spec.doc Yageo Taiwan

Dimension of Demo Board

100*40 mm

12.5*5 mm clearance

Unit:mm

50 ohm Line

Ground

Dimension of Demo Board

100*40 mm

12.5*5 mm clearance

Unit:mm

50 ohm Line

Ground

Feed

Ground

Empty area

Ant

100mm

40mm

Feed

Ground

Empty area

Ant

100mm

Feed

Ground

Empty area

Ant

100mm

40mm

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 9 sheet 190-9

A4

spec.doc Yageo Taiwan

IEC

384-10/

CECC 32

100

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

4.4 Mounting The antenna can be

mounted on printed-circuit

boards or ceramic

substrates by applying

wave soldering, reflow

soldering (including

vapour phase soldering) or

conductive adhesive

No visible damage

4.5 Visual inspection

and dimension

check

Any applicable method

using × 10 magnification In accordance with

specification (chip off

4mm)

4.6.1 Antenna Central Frequency

at 20 oC Standard test board in

page 4

4.8 Adhesion A force of 3 N applied for

10 s to the line joining the

terminations and in a

plane parallel to the

substrate

No visible damage

Bond strength of

plating on end face Mounted in accordance

with CECC 32 100,

paragraph 4.4

No visible damage 4.9

Conditions: bending 0.5

mm at a rate of 1mm/s,

radius jig. 340 mm, 2mm

warp on FR4 board of 90

mm length

No visible damage

4.10 20(Tb) Resistance to

soldering heat 260 ± 5 °C for 10 ± 0.5 s

in a static solder bath The terminations shall

be well tinned after

recovery and

Central Freq. Change

± 6%

Resistance to

leaching 260 ± 5 °C for 30 ± 1 s in

a static solder bath Using visual

enlargement of × 10,

dissolution of the

termination shall not

exceed 10%

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 10 sheet 190-

10

A4

spec.doc Yageo Taiwan

IEC

384-10/

CECC 32

100

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

4.11 20(Ta) Solderability Zero hour test, and test

after storage (20 to 24

months) in original

atmosphere; un-mounted

chips completely

immersed for 2 ± 0.5 s in

235 ± 5°C.

The termination must

be well tinned, at least

75% is well tinned at

termination

4.12 4(Na) Rapid change of

temperature -25 °C (30 minutes) to +85

°C (30 minutes); 100

cycles

No visible damage

Central Freq. Change

± 6%

4.14 3(Ca) Damp heat 500 ± 12 hours at 60 °C;

90 to 95 % RH

No visible damage

2 hours recovery

Central Freq. Change

± 6%

4.15 Endurance 500 ± 12 hours at 85 °C;

No visible damage

2 hours recovery

Central Freq. Change

± 6%

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 11 sheet 190-

11

A4

spec.doc Yageo Taiwan

Ordering Information

The antennas may be ordered by using the Yageo ordering code. These code

numbers can be determined by the following rules:

CAN43 11 7 14 XX 245 4K

Family Code

CAN 43 = Yageo Part No. for Antenna

Packing Type Code

11 = 180 mm/ 7" reel , blister taping

Materials Code

7 = High Frequency Material

Size Code

11 = 3.2 * 2.5 12 = 3.2 * 1.6 13 = 2.5 * 2.0

14 = 2.0 * 1.2

15 = 1.6 * 0.8

Antenna type

00 = normal type

02 = Type 2

03 = Type 3

04 = Type 4

05 = Type 5

06 = Type 6

07 = Type 7

08 = Type 8

09 = Type 9

Working Frequency

245 = 2.45 GHz

Packing Type Code

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 12 sheet 190-

12

A4

spec.doc Yageo Taiwan

4K = 4000 pcs for taping per reel

Taping Blister Tape

DIMENSION:

Serial no Cecking note

Index

Spec(mm)

1 Sprocket hole Do 1.50±0.10

2 Pocket hole D1 ≥1

3 Distance sprocket hole/sprocket hole Po 4.0±0.10

4 Distance pocket/pocket P1 4.0±0.10

5 Distance sprocket hole/pocket P2 2.0±0.10

6 Tape width W 8.1±0.20

7 Distance sprocket hole/outside E 1.75±0.10

8 Distance sprocket hole/pocket F 3.5±0.0.05

9 Pocket length nominal clearance Ao 1.42±0.10

10 Pocket length nominal clearance Bo 2.24±0.10

11 Pocket depth minimum clearance Ko 1.2±0.10

12 Thickness of tape T 0.22±0.05

13 10x sprocket hole pitch 10Po 40.0±0.20

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 13 sheet 190-

13

A4

spec.doc Yageo Taiwan

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 14 sheet 190-

14

A4

spec.doc Yageo Taiwan

7”(180mm) Reel Specifications

Product size

code Units per

Reel Tape Width

(mm) C

(mm) D

(mm) W1

(mm) W2

(mm)

Antenna

4000 8 180.0±1.0

62±1.5

8.4+/-0.15

14.4 max

Print date 07/06/05

Feb, 2007

2012 Ceramic Chip Antenna

for Bluetooth/WLAN Application

CAN4311714XX2454K

Justin Liu C.T.Lee Page 15 sheet 190-

15

A4

spec.doc Yageo Taiwan

Revision Control:

Revision

Date Content Remark

V1 Feb, 2007 New Issued