Technical Document LED Specification EC/Opto Group GM2BB50QK0C "Double Dome" LED Module for Lighting Applications Product Specification August 2011 CRI CCT Current (mA) Luminous Flux Efficacy (lm/W) 83 CRI 220 72.5 107 4500 K 150 53 120 Reference Doc. No. DG-113010A ISSUED August 9, 2011 SYSTEM DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION SPECIFICATIONS LED Product name Surface Mount LED GM2BB50QK0C Model No. Development Department System Device Division Electronic Components and Devices Group SHARP Corporation Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 1/ 24 Product name Model No. LED Surface Mount LED GM2BB50QK0C AV OA Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting form failure to strictly adhere to these conditions and precautions. (Precautions) (1) Please do verify the validity of this part after assembling it in customer's products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2)The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in paragraph (3), even for the following application areas, be sure to observe the precautions given in Paragraph (3). Never use the products for the equipment listed in Paragraph (4). * OA equipment * Instrumentation and measuring equipment * Machine tools * Audiovisual equipment * Home appliances * Communication equipment other than for trunk lines (3) These contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. * Control and safety devices for airplanes, trains, automobiles, and other transportation equipment * Mainframe computers * Traffic control systems * Gas leak detectors and automatic cutoff devices * Rescue and security equipment * Other safety devices and safety equipment, etc. (4) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. * Aerospace equipment * Communications equipment for trunk lines * Control equipment for the nuclear power industry * Medical equipment related to life support, etc. (5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to a sales representative of the company. Please direct all queries regarding the products covered herein to a sales representative of the company. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 2/ 24 GM2BB50QK0C GM2BB50QK0C Specification Application InGaN LED LEDGM2BB50QK0C These specifications apply to light emitting diode Model No. GM2BB50QK0C. [White LED (High colorrendering) composed of InGaN blue LED chip and green and red phosphors] Main application : Illumination 1 Ratings and characteristics ............................................................................ 3 1.1 Absolute maximum ratings........................................................................ 3 1.2 Electro-optical characteristics.................................................... 4 1.3 Rank table.......................................................................................................... 5 1.4 Derating Curve .................................................................................................. 7 1.5 Characteristics Diagram (TYP.) ........................................................ 8 2 External dimensions and equivalent circuit.............................. 9 3 Reliability............................................................................................................... 10 3.1 Test items and test conditions ................................................. 10 3.2 Failure criteria ......................................................................................... 12 4 Quality level........................................................................................................... 13 4.1 Applied standard ............................................................................................. 13 4.2 Sampling inspection........................................................................................ 13 4.3 Inspection items and defect criteria ................................. 13 5 Supplements........................................................................................................... 14 5.1 Taping ......................................................................................................... 14 5.2 Label (on reel .............................................................................. 17 5.3 Packing.................................................................................................................... 18 5.4 Information on environmental impact substances ........... 19 6 Precautions .................................................................................................... 21 6.1 General handling ..................................................................... 21 6.2 Soldering ..................................................................................... 23 6.3 Cleaning .................................................................................................. 23 Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 3/ 24 1 Ratings and characteristics 1.1 Absolute maximum ratings Parameter (Note 1) Operating temperature (Note 2) Storage temperature (Note 3) Power dissipation Derating factor (Note 3, 4) Forward current Derating factor (Note 3, 4) Peak pulsed forward current Derating factor Reverse voltage (Note 5) Soldering temperature Symbol [] Applied temperature Rating Unit Tc - -30 to +100 Tc - -40 to +100 P -30 Topr 85 816 mW - 85 Topr 100 21 mW/ IF -30 Topr 85 240 mA - 85 Topr 100 6 mA/ IFM -30 Topr 85 300 mA - 85 Topr 100 8 mA/ VR Tc = 25 5 V Tsol - 350 (Note 1) Tc 9 The range of operating temperature is prescribed by case temperature, Case temperature (Refer to Page 9, External dimensions and equivalent circuit) (Note 2) () 18 Do not exceed specified temperature range under any packing condition. (Except when baking and soldering) Refer to Page 18, for recommended storage conditions. (Note 3) 7 The operating current value follows the derating curve. (Refer to Page7) (Note 4) =1/10= 100 s Duty ratio = 1/10, Pulse width = 100s. (Note 5) 350/3 1 60W 23 Each terminal must be soldered with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350 As for the reflow soldering profile, please refer to Page 23. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 4/ 24 1.2 Electro-optical characteristics (Tc=25 ) Parameter Symbol Conditions Forward voltage (Note 1) Luminous flux (Note 2) Chromaticity coordinates (Note 3) Color rendering index Reverse current VF V MIN. TYP. MAX. IF=150 mA 2.8 2.95 3.2 IF=220 mA - 3.07 - IF=150 mA 45 53 60 IF=220 mA - 72.5 - 0.3366 (0.3447) 0.3551 0.3369 (0.3553) 0.3760 80 (83) - - - 10 x y IF=150 mA Ra IR VR = 5V Unit V lm A (Note 1)8 LE-3400 (After 20 ms drive) (10%) Monitored by 8 inch integrating sphere of Sharp Standard and Otsuka electronics MCPD-LE3400. (After 20 ms drive) (Tolerance: 10%) (Note 2) 8 LE-3400 (After 20 ms drive) (x, y : 0.01) Measured by 8 inch integrating sphere of Sharp Standard and Otsuka electronics MCPD-LE3400. (After 20ms drive) (Tolerance: 0.01) (Note 3) 8 LE-3400 (After 20 ms drive) (5) Measured by 8 inch integrating sphere of Sharp Standard and Otsuka electronics MCPD-LE3400. (After 20ms drive) (Tolerance: 5) (Note 4) Values inside parentheses are indicated only for reference, and are not guaranteed. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 5/ 24 1.3 Rank table 1.3.1 Luminous flux rank table Rank Luminous flux (Tc=25 ) E 45 50 F 50 55 G 55 60 Unit Condition lm IF=150 mA ( Tolerance: 10%) (Note 1) If the range of luminous flux level is shifted upward, the highest rank is added, and the lowest rank is deleted. Let the delivery rate of each rank be unquestioned. 1.3.2 Chromaticity rank table (IF=150mA,Tc=25 ) Point 4 x y Rank e1 x y x y x y 0.3447 0.3553 0.3371 0.3490 0.3366 0.3369 0.3436 0.3426 e2 0.3458 0.3685 0.3376 0.3616 0.3371 0.3490 0.3447 0.3553 f1 0.3533 0.3621 0.3447 0.3553 0.3436 0.3426 0.3515 0.3487 f2 0.3551 0.3760 0.3458 0.3685 0.3447 0.3553 0.3533 0.3621 ( Tolerance: 0.01) Point 1 Point 2 Point 3 0.38 0.37 f2 0.36 CIE_y e2 f1 0.35 e1 0.34 0.33 0.32 0.33 0.34 0.35 CIE_x Chromaticity diagram 0.36 0.37 Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 6/ 24 1.3.3 Forward voltage rank table (Tc=25 ) Rank Forward voltage Unit Condition V IF=150 mA 1 2.8 3.0 2 3.0 3.2 ( Tolerance: 0.1V) (Note 1) Let the delivery rate of each rank be unquestioned. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 7/ 24 1.4 Derating Curve Forward Current Derating Curve Peak Pulsed Forward Current Derating Curve 400 IFM (mA) 250 240 200 150 100 50 0 -30 -40 -20 0 20 85 40 60 80 100 120 200 180 100 0 -30 -40 -20 0 20 40 60 85 80 100 120 Tc () Case Temperature Case Temperature 400 I FM (mA) Peak Pulsed Forward Current 300 Tc () Peak Pulsed Forward Current vs. Duty Ratio (Tc=25 ) 300 240 200 100 0 1/100 Peak Pulsed Forward Current Forward Current IF (mA) 300 1/10 Duty Ratio 1 1 Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 8/ 24 1.5 Characteristics Diagram (TYP.) Relative Luminous Flux vs. Case Temperature (IF = 150 mA) 1000 (%) 100 10 Relative Luminous Flux (%) Relative Luminous Flux 1000 Relative Luminous Flux vs. Forward Current (Tc = 25 ) 100 1 1 10 100 10 1000 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Tc () IF (mA) Case Temperature Forward Current Forward Current vs. Forward Voltage (Tc = 25 ) Forward Voltage vs. Case Temperature (IF = 150 mA) 3.4 1000 (V) Forward Voltage Forward Current IF (mA) 3.2 100 10 3.0 2.8 1 2.0 2.5 3.0 VF (V) 3.5 2.6 4.0 -20 -10 0 20 30 40 50 60 70 80 90 100 Tc () Forward Voltage 0.010 10 Case Temperature - Chromaticity coordinates vs. Forward Current (Tc = 25) Chromaticity coordinates vs. Case Temperature (IF = 150mA) 0.03 0.02 90mA 90mA 120mA 0.000 150mA 150mA 180mA -0.005 210mA 240mA -0.005 0.000 0.005 0 0 0.00 25 25 60 60 85 85 100100 -0.01 240mA 210mA -0.010 -0.010 -20 -20 0.01 CIE_y CIE_y 0.005 -0.02 0.010 -0.03 -0.03 -0.02 CIE_x (Note) Characteristic data shown here is for reference purpose only. (Not guaranteed data) -0.01 0.00 CIE_x 0.01 0.02 0.03 Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 9/ 24 2 External dimensions and equivalent circuit 2.8 (2.4) (0.6) 2.8 (min.0.2) (1.9) Tc Cathode 2.8 2.8 (0.8) (2.4) Protection Resistance No. Name + Anode Equivalent circuit Anode Cathode (Notes) 1. 0.2 Unspecified tolerance to be 0.2 13 This tolerance does not include dimensions of resin and substrate burr remained on edge. Burr size is prescribed in page 13. 2. Values inside parentheses are reference values. 3. Tc: Tc: Measurement point of case temperature Unit Material Finish Drawing No. mm Substrate : Ceramics Au TerminalAu plating Lens : Silicone resin 52107012 Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 10/ 24 3 Reliability The reliability of product shall satisfy the items listed below. 3.1 Test items and test conditions Confidence level90 % No. 1 2 3 4 Test items Temperature cycle Temperature humidity storage High temperature storage Low temperature storage Samples Defective n C -40 (30 min) to +100 (30 min), 100 cycles 22 0 10 Tc = +60 , RH = 90, Time = 1 000 h 22 0 10 Tc=+100, Time=1 000 h 22 0 10 Tc=-40, Time =1 000 h 22 0 10 Tc=+25 , IF =240mA, Time = 1 000 h 22 0 10 Tc=+100 , IF =150 mA, Time = 1 000 h 22 0 10 Tc=+60 , RH=90%, IF =240 mA, Time = 500 h 22 0 10 15 000 m/s2, 0.5 ms, Tc = +25 XYZ 3 11 0 20 Test conditions 5 Steady state operating life at room temperature 6 Steady state operating life at high temperature 7 Steady state operating life at high temperature and elevated humidity LTPD % 8 Shock Acceleration: 15 000 m/s2, Pulse width: 0.5 ms, Tc = +25 Direction: X, Y and Z, 3 trials in each direction Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 11/ 24 200 m/s2, 1002 000 Hz Tc = +25 9 10 11 Vibration Resistance to soldering heat () Solderability (Solder dip) 4 XYZ 4 11 0 20 11 0 20 11 0 20 2 Acceleration: 200 m/s Frequency: 100 to 2 000 Hz (round-trip) 4 min Tc = +25 Direction: X, Y and Z 4 trials in each direction 23 2 2 trials, under the reflow condition mentioned in Page 23. 150 1 2405 51 s /M705-221BM5/ ESR-250 Solder temperature: 2405 , Soldering time: 51 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for 1 hour Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 12/ 24 3.2 Failure criteria 3.2.1 Solderability failure criterion 90 Solder should be applied at 90% or more of each solderability judgment area. Solderability judgment area: Bottom of the lead (Shaded portion in the figure) 3.2.2 Failure criteria for the other reliability tests No. 1 2 Parameter Symbol Failure criteria VF VF > U.S.L. x 1.2 Forward Voltage Luminous intensity V V < x0.5, V > x2.0 V < Initial value x 0.5, V > Initial value x 2.0 (Note 1) Measuring conditions shall accord with the paragraph mentioned about the electro-optical characteristics. (Note 2) U.S.L U.S.L. stands for Upper Specification Limit.. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 13/ 24 4 Quality level 4.1 Applied standard ISO 2859-1 4.2 Sampling inspection S-4 A single normal sampling plan, level S-4 4.3 Inspection items and defect criteria No. 1 2 3 Inspection items Defect criteria Classification No radiation Radiation color Taping 4 Electro-optical characteristics 5 External dimensions No light emitting Different from the specified color Major defect VF ,IR, V, (4) Not satisfied with specified values for VF, IR, and chromaticity coordinates mentioned in Page 4 (9) Not satisfied with specified dimensions in Page 9 Appearance 0.1% Not conforming to the inserted direction shown in the specification () 6 AQL Foreign substances and scratches of light emitting face which are obstructed light emitting condition. (Except removable foreign substance) 0.3mm Resin or substrate burr which is over 0.3mm 0.3 mm Resin crack and terminal crack, which are over 0.3 mm Minor defect 0.4 % Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 14/ 24 Supplements 5.1 Taping 5.1.1 Shape and dimensions of tape (Ref.) P2 P0 A Feeding direction W1 W0 F E t1 B 5 t3 t2 P1 Cathode Mark [mm] Parameter Symbol Dimension [mm] Remarks A 3.13 Length Pocket (embossed) Width Pitch Diameter Sprocket hole Pitch Sprocket hole position Pocket position Width Cover tape Thickness Width Carrier tape Thickness Overall thickness of the taping B 3.13 P1 4.0 D0 1.5 P0 4.0 R Measured at inside bottom square corner 0.5 mm/10 Accumulated error 0.5 mm/ 10 pitch E 1.75 P2 2.0 F 3.5 Dimension at the extension of the center lines of the pocket to the center line of the sprocket hole W1 5.3 t3 0.1 W0 8.0 t1 0.25 t2 2.6 Dimension from the edge of the tape to the center of the sprocket hole Including the thickness of cover and carrier tape Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 15/ 24 5.1.2 Shape and dimensions of reel (Ref.) A C B U 0.2 0.4 0.6 0.8 Label 0.6 0.4 0.2 0.8 E t W Parameter Diameter Flange Thickness Clearance between the flanges External diameter Spindle hole diameter Hub Key slit Width Depth Indication of Model No. etc. Materials: Polystyrene [mm] (Ref.) Symbol Dimension [mm] Remarks A 180 t 1.5 W 10 B 60 C 13 E 2.0 U 4.5 Dimension measured close to the core Label attached on flange (Model No., quantity, Lot No. etc.) Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 16/ 24 5.1.3 Taping technical specification Feeding direction Empty 160mm M IN. 160mm () Leader(Empty) 400mm M IN. 400mm LEDs inside 0.1N1.0N ( =010) 0.1N0.8N 0.1N0.8N (=010) 0.1N 1.0N Cover tape separation F=0.1~1.0 N (=10or less) F Cover Tape 010 010 Forward 5 mm/s Tape speed: 5 mm/s 5 mm/s 5mm/s Stuffed Carrier Tape (1) 30 mm Tape strength against bending: The radius of curvature should be more than 30 mm. If i bent at less than 30 mm, the cover may peel off. (2) Joint of the tape: No joint of cover tape or carrier tape in one reel (3) 2 000 Quantity: 2 000 pcs. per reel (standard) (4) 30 mg Product mass: Approx. 30 mg (One piece of LED/ Reference value) (5) Others: There are no continuous empty pockets except leader and trailer part. 0.1% The quantity of the products lacking should be less than 0.1% of total product quantity. Products should not be attached to the cover tape when it peeled off. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 17/ 24 5.2 Label (on reel EIAJ C-3 e EIAJC-3 compliant bar code (format e) label is attached on each reel. Example SHARP CORPORATION PART No. GM2BB50QK0C QUANTITY 2 000 Model No. Product quantity EIAJ C-3 EIAJ C-3 Bar codes LOT No. XX11C15/ RANK EIAJ C-3 MADE IN XXXX / LOT number and rank Production country LOT Number XX 11 C 15 () Production plant code (to be indicated alphabetically) (2 ) Year of production (the last two figures of the year) (1 ABC ) Month of production (to be indicated alphabetically with January corresponding to A) (0131) Date of production (01 to 31) Rank RANK Luminous flux rank Chromaticity rank Forward voltage rank Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 18/ 24 5.3 Packing 5.3.1 Moisture proof packing In order to avoid the absorption of humidity while transport and storage, the devices are packed in moisture proof aluminum bags. Alminum bag Label Silica gel Reel (EIAJ C-3) Label (EIAJ C-3 compliant) 5.3.2 Recommended storage conditions 530 85 % RH Temperature: 5 to 30 Relative humidity: 85% or less 5.3.3 Precautions after opening aluminum bags 7 530 60%RH Please be sure to give them the soldering within 7 days under the following conditions. Temperature: 5 to 30 Relative humidity: 60% or less 5.3.2 Storage in a dry box is recommended in case that the products are not used for a long time after opened. Or repack the reels with a desiccative by the sealer and store them under the same conditions mentioned in 5.3.2. Please perform the baking treatment under the recommended conditions in the following cases; The blue indicator of silica gel changes its color or fades. 7 7days passed after opened under the specified storage conditions. Products were stored out of storage condition. (Recommended baking conditions): Products with taping 6065 3648 Temperature: 60 to 65 , Time: 36 to 48 hours Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 19/ 24 Single piece of the products (on PCB or metallic tray) 100 120 2~3 Temperature: 100 to 120 , Time: 2 to 3 hours. Avoid piling up the reels or applying stress to them during baking so as to protect from deformation. Please be sure to cool them to room temperature after baking. 5.4 Information on environmental impact substances 5.4.1 RoHS RoHS compliant product RoHS This is a RoHS compliant product designed and manufactured in accordance with Sharp's Green Device Guidelines. 5.4.2 RoHS Information relating to China RoHS Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic Information Products. Names and Contents of the Toxic and Hazardous Substances or Elements in the Products. Toxic and Hazardous Substances or Elements. Lead Pb Mercury Hg Cadmium Cd Hexavalent Chromium Cr(VI) Polybrominated Biphenyls PBB Polybrominated Diphenyl Ethers PBDE SJ/T 11363-2006 indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006. x SJ/T 11363-2006 indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in SJ/T 11363-2006 standard. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 20/ 24 5.4.3 Ozone Depleting Substances This product does not contain the following Ozone Depleting Substances. This product does not have a production line whose process requires the following Ozone Depleting Substances. CFCs1, 1, 1- () Restricted substances: CFCs, Halones, CCl4, and 1, 1, 1-Trichloroethane (Methyl chloroform) Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 21/ 24 6 Precautions 6.1 General handling The voltage must be applied to LED only as a forward direction. Moreover, please design circuit diagram considering no voltage gap between Anode and Cathode during off state. If the reverse voltage is applied to LED for a long term, the electro-migration is generated and there is a possibility of the short-circuit of the circuit. LED TVS() This product is sensitive for electrostatic voltage and surge voltage. Static electrocity or surge voltage can deteriorate product and its reliability. Please make sure that all devices and equipments must be grounded. We recommend to built in zener diode or TVS(Transient Voltage Suppression) as protection circuit against static electricity. LED This product is composed of blue LED chip and special phosphor. Color tone is possible to vary in some degree, depending on the operating conditions such as ambient temperature or current amount. Also it is subject to variation due to the afterglow of the phosphor in pulse drive. So please verify the performance before use. Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result. LED LED () LED 100 () Materials with high thermal conductivity are used in this product in order to allow generated heat to escape effectively out of the product. Avoid locating other heat sources (ex. resistance, etc.) near the products on circuit board to protect the devices from the heatdamage. Please make sure that case temperature is always under 100 during operation, including the self-heating. Since dust on the surface of the radiation part is hard to remove and may decrease the luminous intensity, please handle the products in a clean, non-dusty condition. The lens of this product is formed with silicone resin. In the case of handling this device, please do not push the lens portion by the sharp tools. The crack and peel off of the lens, and the wire deformation are generated and it causes not lighting. Especially do not apply the load from horizontal direction to the side of the lens of this product. 45 2.5(1.4mm Please do not apply the static load of 2.5N or more (1.4mm or less)from the diagonal 45 degrees of this products lens portion to the direction of an optical axis. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 22/ 24 () This product is the small size and the lens portion is formed by silicone resin, there is a possibility to have a damage by the external stress. In the case of the handling with the tweezers In the case of the handling with the tweezers, please pick up the products with the sides of the ceramic substrate and do not touch the lens portion . In the case of the mount of the product Please use this product after confirming the mouting condition, because there is a possibility to have a damage by the external stress when the load is applied by the collet of the mouter.. Please see the recommended collet of this product as right picture. Please make sure not to apply any external stress to resin after mounted as well. When the substrate bends after mounted, the product might be applied by an external stress, and the crack will be generated in the soldering part. Please arrange the product in the direction not stressed for the warp of the substrate after mounted. Please do not pile the substrate after this product is mounted. This product will be damaged by the substrate, and it causes the crack of the lens and not lighting by the inner-wire deformation or wiring disconnection. The products are not designed for the use under any of the following conditions. Please verify their performance and reliability well enough if you use under any of the following conditions; (1) (ClH2SNH3SO2NOx ) In a place with a lot of moisture, dew condensation, briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.) (2) Under the direct sunlight, outdoor exposure, and in a dusty place (3) In water, oil, medical fluid, and organic solvents Guarantee covers the compliance to the quality standards mentioned in the Specifications; however it does not cover the compatibility with application in the end-use, including assembly and usage environment. In case any quality problems occurred in the application of end-use, details will be separately discussed and determined between the parties hereto. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 23/ 24 6.2 Soldering 2 This product is reflow ready model (within 2 times), but it is not ready for solder dipping. 6.2.1 Reflow Package temperature at reflow soldering is defined in the Fig. below. However, even when it is under the profile condition, external stress can damage the internal packages. Please test your reflow method and verify the solderability before use. 7 ( 530 60%RH ) Giving the soldering process promptly after opened aluminum package is recommended.Soldering process must be completed including 2nd reflow as repairing within 7 days (Temperature: 5 to 30 Relative humidity: 60% or less) after opened.(Storage in a dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11(()) Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [] Recommended Temperature Profile 260( MAX) 1 to 4/s 220 200 150 1 to 2.5/s 60s (MAX) 60 to 120s 5s (MAX) 1 to 4/s 25 Time [second] LED LED In order to secure the product reliability, it is recommended to control the peak temperature and temperature gradient. Moreover, since the thermal conduction to the products depends on the specification of the reflow machine, and the size and layout of the PCBs please test your solder conditions carefully. Reference Model No. GM2BB50QK0C Doc. No. DG-113010A Page 24/ 24 Moreover, after the reflow process, if the activator remains in the flux between anode and cathode, the remaining activator might react during high temperature operation, and the electro-migration is generated and there will be a possibility of a short-circuit. Please use it after confirming the electro-migration is not generated while mounted actual. Recommended solder pad design 0.15mm LED We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the actual solder method. Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the remining activator in the flux. Please make a suitable selection and test of the metal mask in terms of pitch size and thikness before mass production. 2.8 3.2 1.2 0.8 1.2 0.4 1.15 0.5 0.25 ( Unit : mm) 0.5 Precautions for PCB backside dip process Please verify your conditions carefully in giving the dip process on the backside of the PCBs, since the warped boards caused by heat and heat itself affect the inside of the package. It is recommended to give the reflow process after dip process. Though it is also available to give the reflow process before the dip process, the interval of the two processes should be as short as possible. 6.3 Cleaning Avoid cleaning the PCBs, since packages and resin are eroded by cleaning. Please use the soldering paste without need of cleaning. Avoid ultrasonic cleaning. Technical Document Opto Specification Opto/EC Group NORTH AMERICA Sharp Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (1) 360-834-8700 Fax: (1) 360-834-8903 www.sharpsma.com TAIWAN Sharp Electronic Components (Taiwan) Corporation 8F-A, No. 16, Sec. 4, Nanking E. Rd. Taipei, Taiwan, Republic of China Phone: (886) 2-2577-7341 Fax: (886) 2-2577-7326/2-2577-7328 CHINA Sharp Microelectronics of China (Shanghai) Co., Ltd. 28 Xin Jin Qiao Road King Tower 16F Pudong Shanghai, 201206 P.R. China Phone: (86) 21-5854-7710/21-5834-6056 Fax: (86) 21-5854-4340/21-5834-6057 Head Office: No. 360, Bashen Road, Xin Development Bldg. 22 Waigaoqiao Free Trade Zone Shanghai 200131 P.R. 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China Phone: (86) 755-88313505 Fax: (86) 755-88313515 KOREA Sharp Electronic Components (Korea) Corporation RM 501 Geosung B/D, 541 Dohwa-dong, Mapo-ku Seoul 121-701, Korea Phone: (82) 2-711-5813 ~ 8 Fax: (82) 2-711-5819 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE. Suggested applications (if any) are for standard use; See Important Restrictions for limitations on special applications. See Limited Warranty for SHARP's product warranty. The Limited Warranty is in lieu, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will SHARP be liable, or responsible in any way, for any incidental or consequential economic or property damage. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Sharp Microelectronics: GM2BB50QK0C