Solder Anchor Attachment Method
Part Number: 374724B60024
(Vis Number: 037812)
This part is in stock and available for immediate delivery:
Contact your local sales rep
BGA Surface Interface Heat Sink Finish Part Class
All T766 Black Anodize A
Features and Benefits
New unique wire clip design allows for complete reworkability
after assembly
Configurations are available for a wide range of BGA package
sizes in any thickness up to 3.0mm
Minimal PC Board real estate is required for mounting
Solder Anchors provide the most rugged mounting in the
industry
Each Heat Sink utilizes a phase change pad as the interface for
optimal performance
Solder anchors are sold separately
Part Number Do57
2 Solder anchors must be soldered to the PCB Prior to
attaching the heat sink clip.
Width Length Height Fin Thickness
Across Width
Fin Thickness
Across Length Base Thickness # of fins
across width
# of fins
across length
35mm 35mm 18mm 1.4mm 1.57mm 1.5mm 10 10
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ±0.38(±.015)
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Recommended PCB Hole Pattern
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Thermal Performance
*θn**θf
15.3 5.15
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics.
Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
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