www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61008
36 Revision: 10-Mar-08
SFC
Vishay Electro-Films
Thin Film 0202 Size Resistor on Alumina
CHIP
RESISTORS
The SFC series resistor chips offer a combination of low
shunt capacitance and small size. The SFCs tantalum nitride
resistor material offers excellent resistance to high moisture
environments.
The SFCs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology.
The SFCs are 100 % electrically tested and visually
inspected to MIL-STD-883.
FEATURES
Wire bondable
Small size: 0.020 inches square
Resistance range: 10 Ω to 10 kΩ
Alumina substrate
Low shunt capacitance: < 0.2 pF
Resistor material: Tantalum nitride
Moisture resistant
APPLICATIONS
Vishay EFI SFC chip resistors provide excellent high-frequency response and are ideally suited for prototyping.
Typical application areas are:
Amplifiers
Oscillators
Attenuators
Couplers
Filters
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE
CLASS H* CLASS K*
002 122
001 121
000 120
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308 - 20 dB typ.
Moisture Resistance, MIL-STD-202
Method 106 ± 0.5 % max. ΔR/R
Stability, 1000 h, + 125 °C, 25 mW ± 0.5 % max. ΔR/R
Operating Temperature Range - 55 °C to + 125 °C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F ± 0.25 % max. ΔR/R
High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R
Dielectric Voltage Breakdown 400 V
Insulation Resistance 1012 min.
Operating Voltage 100 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 150 °C) 62 mW max.
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R
10 Ω50 Ω5.6 kΩ10 kΩ
1.0 %
Tightest Standard Tolerance Available
± 50 ppm/°C
± 250 ppm/°C
± 100 ppm/°C
Document Number: 61008 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 10-Mar-08 37
SFC
Thin Film 0202 Size Resistor on Alumina Vishay Electro-Films
CHIP
RESISTORS
DIMENSIONS in inches
SCHEMATIC
Options: Gold back for solder die attach
Contact Applications Engineer
0.012
0.020
0.020
0.004
TYPICAL RANGE
10 Ω - 49 Ω
0.006
0.020
0.004
0.020
TYPICAL RANGE
50 Ω - 10 kΩ
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.768 mm)
Chip Thickness 0.010 ± 0.002 (0.25 ± 0.05 mm)
Chip Substrate Material 99.6 % alumina, 2 - 4 microinch finish
Resistor Material Tantalum nitride, self-passivating
Bonding Pad Size 0.004 x 0.006 (0.10 x 0.15 mm) minimum
Number of Pads 2
Pad Material 25 kÅ minimum gold standard
Backing None
ORDERING INFORMATION
Example: 100 % visual, 50 Ω, ± 10 %, ± 250 ppm/°C TCR, gold pads, class H visual inspection
W
INSPECTION
/PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample visually
inspected parts loaded in
matrix trays (4 % AQL)
SFC
PRODUCT
FAMILY
000
PROCESS
CODE
See Process Code
table
5000
RESISTANCE
VALUE
Use first 4
significant digits of
resistance
B
MULTIPLIER
CODE
B = 0.01
A = 0.1
0 = 1
1 = 10
K
TOLERANCE
CODE
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
*Coating standard
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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