Features
■ RoHS compliant*
■ ESD protection >25 kV
■ Low capacitance <0.05 pF
■ Low leakage current <5 nA
Applications
■ HDMI 1.4
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
ChipGuard® MLU Series - ESD Protectors
Device SymbolGeneral Information
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLU / CG0603MLU (Note 3)
tinU x42 x21 x50 x3.3 lobmyS retemaraP
V egatloV gnitarepO suounitnoC lacipyT DC 3.3 5 12 24 V
V )1 etoN( egatloV gnipmalC lacipyT C 25 V
C zHM 1 SMRV 1 @ ecnaticapaC mumixaM O 0.05 pF
I CDV .xaM @ tnerruC egak
aeL mumixaM L 5 nA
V )2 etoN( egatloV reggirT lacipyT T 250 V
R emiTesnopseR mumixaM T 1 ns
ESD Protection: Per IEC 61000-4-2
Vk 8± )speR 0001>( egrahcsiD tcatnoC .niM
Vk 51± )speR 0001>( egrahcsiD riA .niM
T erutarepmeT gnitarepO OPR -40 to +125 ˚C
T erutarepmeT egarotS STG -55 to +150 ˚C
The ChipGuard® MLU Series has been specifi cally designed to protect sensitive electronic
components from electrostatic discharge damage. The MLU family has been designed to
protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD
specifi cations targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394
applications.
The ChipGuard® MLU Series has been manufactured to provide low 0.05 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family almost
transparent under normal working conditions.
V
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. Part number suffi x “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity.
*RoHS COMPLIANT
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice. Users should verify actual device performance in their specific
applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the
last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
ChipGuard® MLU Series - ESD Protectors
Product Dimensions
3060GC 2040GC
seireS seireS noisnemiD
L02.0 ± 06.1 51.0 ± 00.1
(0.04 ± 0.006) (0.064 ± 0.008)
W02.0 ± 08.0 01.0 ± 05.0
(0.02 ± 0.004) (0.032 ± 0.008)
A01.0 ± 54.0 50.0 ± 63.0
(0.014 ± 0.002) (0.018 ± 0.004)
B02.0 ± 03.0 51.0 ± 52.0
(0.10 ± 0.006) (0.012 ± 0.008)
DIMENSIONS: MM
(INCHES)
Recommended Pad Layout
L
W
B
A
A
CB
D
CG0402 CG0603
Dim. Series Series
A 0.51 0.76
(0.020) (0.030)
B 0.61 1.02
(0.024) (0.040)
C 0.51 0.50
(0.020) (0.020)
D 1.70 2.54
(0.067) (0.100)
Solder Refl ow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
Temperature (°C)
120 sec. (min.)
Preheat Stages 1-3 Soldering Cooling
Time (seconds)
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
A Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s
C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s
D Main Heating 200 °C 60 s to 70 s
210 °C 55 s to 65 s
220 °C 50 s to 60 s
230 °C 40 s to 50 s
240 °C 30 s to 40 s
E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ChipGuard® MLU Series - ESD Protectors
Packaging Dimensions
TOP
TAPE
NOTES: TAPE MATERIAL IS PAPER.
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
TAPE THICKNESS IS
4.00 ± 0.10
(0.16 ± 0.004)
DG
8.00 ± 0.30
(0.32 ± 0.012)
0.60 ± 0.05
(0.024 ± 0.002)
3.50 ± 0.05
(0.14 ± 0.002)
C
L
W
1.50 ± 0.10
(0.06 ± 0.004) 2.0 ± 0.50
(0.08 ± 0.02)
180.8 ± 2.0
(7.12 ± 0.08)
9.0 ± 0.50
(0.36 ± 0.02)
13.0 ± 1.0
(0.52 ± 0.04)
13.0 ± 0.50
(0.52 ± 0.02)
62.0 ± 1.50
(2.48 ± 0.06)
21.0 ± 0.80
(0.84 ± 0.032)
DIMENSIONS: MM
(INCHES)
3060GC 2040GC
seireS seireS noisnemiD
C01.0 ± 57.1 50.0 ± 57.1
(0.04 ± 0.002) (0.04 ± 0.004)
D50.0 ± 00.2 20.0 ± 00.2
(0.08 ± 0.0008) (0.08 ± 0.002)
L02.0 ± 08.1 30.0 ± 21.1
(0.045 ± 0.0012) (0.072 ± 0.008)
W02.0 ± 09.0 30.0 ± 26.0
(0.025 ± 0.0012) (0.036 ± 0.008)
G50.0 ± 0.4 50.0 ± 0.2
(0.08 ± 0.002) (0.16 ± 0.002)
How to Order
CG 0n0n MLU - n.n x
ChipGuard®
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
** Only models lower than 10 volts require
decimal point.
REV. K 11/18
Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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