Preliminary data
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
December 2011 Doc ID 022612 Rev 1 1/24
24
L3G4IS
MEMS motion sensor:
three-axis digital output gyroscope for gaming and OIS
Features
■Three selectable full-scales (250/500/2000
dps) for gaming applications
■± 65 dps full-scale for OIS applications
■Independent I2C and SPI digital interfaces
■Embedded temperature sensor
■Integrated low- and high-pass filters with user-
selectable bandwidth
■Wide supply voltage range: 2.4 V to 3.6 V
■Low voltage-compatible IOs (1.8 V)
■Power-down and sleep mode for smart power
saving
■Embedded FIFO (first-in first-out buffer)
■ECOPACK® RoHS and “Green” compliant
Applications
■Gaming and virtual reality input devices
■Optical image stabilization
■Motion control and gesture recognition
■GPS navigation systems
Description
The L3G4IS is the first three-axis MEMS
gyroscope that enables both user interface and
image stabilization applications at the same time.
Thanks to two different independent reading
chains and digital interfaces, the L3G4IS delivers
previously unseen levels of flexibility to the end
user.
Each reading chain and the corresponding full-
scale can be activated by powering two separate
pins, the internal ASIC blocks automatically detect
and enable the selected device configuration.
The unique sensing element is manufactured
using a dedicated micro-machining process
developed by STMicroelectronics to produce
inertial sensors and actuators on silicon wafers.
The L3G4IS is available in a plastic land grid array
(LGA) package and can operate within a
temperature range of -30 °C to +85 °C.
LGA-16
(4x4x1 mm)
Table 1. Device summary
Order code Temperature range (°C) Package Packing
L3G4IS -30 to +85 LGA-16 (4x4x1) Tray
L3G4ISTR -30 to +85 LGA-16 (4x4x1) Tape and reel
www.st.com
Contents L3G4IS
2/24 Doc ID 022612 Rev 1
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Working mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 User interface mode specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Image stabilization (OIS mode) specifications . . . . . . . . . . . . . . . . . . . 13
5.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.1 Power supply configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1.1 Configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1.2 Configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.1.3 Configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.1.4 Configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
L3G4IS List of tables
Doc ID 022612 Rev 1 3/24
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 5. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 7. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 8. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 10. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 11. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 12. External components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 13. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
List of figures L3G4IS
4/24 Doc ID 022612 Rev 1
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. L3G4IS electrical connections and external component values . . . . . . . . . . . . . . . . . . . . . 16
Figure 4. L3G4IS power supply configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5. L3G4IS power supply configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 6. L3G4IS power supply configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7. L3G4IS power supply configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 8. LGA-16: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
L3G4IS Block diagram and pin description
Doc ID 022612 Rev 1 5/24
1 Block diagram and pin description
Figure 1. Block diagram
1.1 Pin description
Figure 2. Pin connection
AM10234V1
MEMS SENSOR
MUX
MUX
C -
converter
VSC filter ADC Digital
filters
SPI
BW Selection
Actuation Interface
C -
converter
VSC filter ADC Digital
filters
I2C
BW Selection
Actuation Interface
Full scale
Selection
FIFO
OIS Reading Chain
UI Reading Chain
AM10235v1
(TOP VIEW)
DIRECTIONS OF THE
DETECTABLE
ANGULAR RATES
X
Vdd_IO_SPI
SCL
SDA
GND
CS_OIS
SCL_OIS
SDI/SDO_OIS
Res
INT
DRDY
Res
Res
Cap
HAVdd
AVdd
Reg
1
8
12
5
49
1316
+ Ω Z
+Ω X
BOTTOM
VIEW
+Ω Y
Block diagram and pin description L3G4IS
6/24 Doc ID 022612 Rev 1
Table 2. Pin description
Pin# Name Function
1 Vdd_IO_SPI Power supply for I/O pins of the PSPI interface
2SCLI
2C serial clock (SCL)
3SDAI
2C serial data (SDA)
4 GND 0 V power supply
5 Reserved Leave unconnected
6 DRDY Data ready signal (open drain pad)
7 INT Programmable interrupt (open drain pad)
8 Reserved Leave unconnected
9 Reserved Leave unconnected
10 SDI/SDO_OIS Data-in, data-out line for SPI interface
11 SCL_OIS Clock line for SPI interface
12 CS_OIS SPI chip select line
13 Reg Capacitance connection pin for internal regulator
14 Cap Capacitance connection pin for internal charge pump
15 HAVdd Power supply for OIS mode
16 AVdd Power supply for user interface mode
L3G4IS Terminology
Doc ID 022612 Rev 1 7/24
2 Terminology
2.1 Sensitivity
An angular rate gyroscope is a device that produces a positive-going digital output for
counter-clockwise rotation around the sensitive axis considered. Sensitivity describes the
gain of the sensor and can be determined by applying a defined angular velocity to it. This
value changes very little over temperature and time.
2.2 Zero-rate level
Zero-rate level describes the actual output signal if there is no angular rate present. The
zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the sensor
and therefore the zero-rate level can slightly change after mounting the sensor onto a
printed circuit board or after exposing it to extensive mechanical stress. This value changes
very little over temperature and time.
Working mode selection L3G4IS
8/24 Doc ID 022612 Rev 1
3 Working mode selection
The L3G4IS can be used for user interface and image stabilization applications. Depending
on the power supply provided and dedicated internal bits configuration, the L3G4IS is able
to keep both reading chains active allowing the user to exploit the advantages of high
resolution on low full-scale and low current consumption on high full-scale at the same time
through SPI and I2C digital interfaces.
When either AVdd or HAVdd are removed they must be connected to GND for proper
working of the device.
Table 3. Operating mode
AVdd AVdd_OIS Operating mode I2C interface SPI interface
OFF OFF Gyro off Not available Not available
ON OFF UI Read/Write UI
registers Not available
OFF ON OIS Not available Read/Write OIS
registers
ON ON OIS/UI Read/Write UI
registers
Read/Write OIS
registers
L3G4IS User interface mode specifications
Doc ID 022612 Rev 1 9/24
4 User interface mode specifications
4.1 Mechanical characteristics
@ AVdd = 2.8 V, T = 25 °C unless otherwise noted(a).
a. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 5.
Table 4. Mechanical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
FS Measurement range User selectable
±250
dps±500
±2000
So Sensitivity
FS = 250 dps 8.75
mdps/digitFS = 500 dps 17.50
FS = 2000 dps 70
SoDr Sensitivity change vs.
temperature
From -30 °C to +85 °C
Delta from T = 25 °C ±2 %
DVoff Digital zero-rate level
FS = 250 dps ±25
dpsFS = 500 dps ±25
FS = 2000 dps ±25
OffDr Zero-rate level change
vs. temperature
FS = 250 dps ±0.03 dps/°C
FS = 2000 dps ±0.04 dps/°C
NL Non linearity(2) Best fit straight line 0.2 % FS
Rn Rate noise density 0.015
BW System bandwidth 140 Hz
Ton Turn-on time From power-down to
normal mode 60 ms
ODR Digital output data rate 95/190/
380/760 Hz
Top Operating temperature
range -30 +85 °C
1. Typical specifications are not guaranteed.
2. Guaranteed by design.
dps Hz(⁄
User interface mode specifications L3G4IS
10/24 Doc ID 022612 Rev 1
4.2 Electrical characteristics
@ AVdd = 2.8 V, T = 25 °C unless otherwise noted(b).
b. The product is factory calibrated at 3.3 V.
Table 5. Electrical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
AVdd Supply voltage 2.42 2.8 3.6 V
Vdd_IO_UI Supply voltage for UI
digital pins
Internal voltage
reference 1.62 1.8 1.98 V
VddI2Cbus Supply voltage I2C
bus
Allowed supply
voltage for UI I2C
bus
1.62 1.8 1.98 V
Idd Supply current 6 mA
IddSL Supply current in
sleep mode(2)
Selectable by digital
interface 3.2 mA
IddPdn Supply current in
power-down mode
Selectable by digital
interface 20 µA
VIH Digital high level
input voltage 0.7*Vdd_IO_UI Vdd_IO_UI Vdd_IO_UI + 0.3 V
VIL Digital low level
input voltage -0.3 0 0.3*Vdd_IO_UI V
VOH Digital high level
output voltage INT/DRDY signals 0.65*Vdd_IO_UI Vdd_IO_UI Vdd_IO_UI + 0.3 V
VOL Digital low level
output voltage INT/DRDY signals -0.3 0 0.35*Vdd_IO_UI V
Top Operating
temperature range -30 +85 °C
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time related to power-down mode.
L3G4IS User interface mode specifications
Doc ID 022612 Rev 1 11/24
4.3 Temperature sensor characteristics
@ AVdd = 2.8 V, T = 25 °C unless otherwise noted(c).
4.4 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
c. The product is factory calibrated at 3.3 V.
Table 6. Electrical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
TSDr
Temperature sensor
output change vs.
temperature
-
-1 °C/digit
TODR Temperature refresh rate 1 Hz
To p Operating temperature
range -30 +85 °C
1. Typical specifications are not guaranteed.
Table 7. Absolute maximum ratings(1)
1. Supply voltage on any pin should never exceed 4.8 V.
Symbol Ratings Maximum value Unit
AVdd Supply voltage -0.3 to 4.8 V
HAVdd Supply voltage -0.3 to 4.8 V
Vdd_IO_SPI Vdd IO SPI interface -0.3 to HAVdd +0.1 V
Vin(UI) Input voltage on:
(SCL, SDA, INT, DRDY) -0.3 to AVdd +0.1 V
Vin(OIS) Input voltage on:
(CS_OIS, SDI/SDO_OIS, SCL_OIS)
-0.3 to Vdd_IO_SPI
+0.1 V
TSTG Storage temperature range -40 to +125 °C
Sg Acceleration g for 0.1 ms 10,000 g
ESD Electrostatic discharge protection
2 (HBM) kV
1.5 (CDM) kV
200 (MM) V
User interface mode specifications L3G4IS
12/24 Doc ID 022612 Rev 1
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
L3G4IS Image stabilization (OIS mode) specifications
Doc ID 022612 Rev 1 13/24
5 Image stabilization (OIS mode) specifications
5.1 Mechanical characteristics
@ HAVdd = 3.3 V, T = 25 °C unless otherwise noted(d).
d. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 5.
Table 8. Mechanical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
FS Measurement range ±65 dps
So Sensitivity ±225 LSb/dps
SoDr Sensitivity change vs.
temperature From -30 °C to +85 °C ±5 %
DVoff Digital zero-rate level High pass filter disabled ±75 dps
High pass filter enabled ±20
OffDr Zero-rate level change
vs. temperature
High pass filter disabled ±25 dps
High pass filter enabled ±10
NL Non linearity(2) Best fit straight line ±1 % FS
Rn Rate noise density(2) 0.008
BW Internal bandwidth LPF0 set to ‘1’ 370 Hz
PhDl Phase delay At 20 Hz (370 Hz BW
selected) 4.5 deg
ODR Digital output data rate 9.5 kHz
Top Operating temperature
range -30 +85 °C
1. Typical specifications are not guaranteed.
2. Guaranteed by design.
dps Hz(⁄
Image stabilization (OIS mode) specifications L3G4IS
14/24 Doc ID 022612 Rev 1
5.2 Electrical characteristics
@ HAVdd = 3.3 V, T = 25 °C unless otherwise noted(e).
5.3 Temperature sensor characteristics
@ HAVdd = 3.3 V, T = 25 °C unless otherwise noted(f).
e. The product is factory calibrated at 3.3 V.
Table 9. Electrical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
HAVdd Supply voltage 3.0 3.3 3.6 V
Vdd_IO_SPI I/O pins supply voltage(2) 1.71 HAVdd+0
.1 V
Idd Supply current OIS and UI modes active 10 mA
IddSL Supply current in sleep
mode(3)
Selectable by digital
interface 3.2 mA
IddPdn Supply current in power-
down mode
Selectable by digital
interface 20 μA
VIH Digital high level input
voltage
0.8*Vdd_I
O_SPI V
VIL Digital low level input
voltage
0.2*Vdd_I
O_SPI V
To p Operating temperature
range -30 +85 °C
1. Typical specifications are not guaranteed.
2. It is possible to remove HAVdd maintaining Vdd_IO_SPI without blocking the communication busses, in this condition the
measurement chain is powered off.
3. Sleep mode introduces a faster turn-on time related to power-down mode.
f. The product is factory calibrated at 3.3 V.
Table 10. Electrical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
TSDr
Temperature sensor
output change vs.
temperature
-
-1 °C/digit
TODR Temperature refresh rate 1 Hz
To p Operating temperature
range -30 +85 °C
1. Typical specifications are not guaranteed.
L3G4IS Image stabilization (OIS mode) specifications
Doc ID 022612 Rev 1 15/24
5.4 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 11. Absolute maximum ratings(1)
1. Supply voltage on any pin should never exceed 4.8 V.
Symbol Ratings Maximum value Unit
AVdd Supply voltage -0.3 to 4.8 V
HAVdd Supply voltage -0.3 to 4.8 V
Vdd_IO_
SPI Vdd IO SPI interface -0.3 to HAVdd +0.1 V
Vin(UI) Input voltage on:
(SCL, SDA, INT, DRDY) -0.3 to AVdd +0.1 V
Vin(OIS) Input voltage on:
(CS_OIS, SDI/SDO_OIS, SCL_OIS)
-0.3 to Vdd_IO_SPI
+0.1 V
TSTG Storage temperature range -40 to +125 °C
Sg Acceleration g for 0.1 ms 10,000 g
ESD Electrostatic discharge protection
2 (HBM) kV
1.5 (CDM) kV
200 (MM) V
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
Application hints L3G4IS
16/24 Doc ID 022612 Rev 1
6 Application hints
Figure 3. L3G4IS electrical connections and external component values
Table 12. External components
Type description Value Purpose
C1 = C3 1 µF Decoupling
C2 = C4 100 pF Decoupling
C5(1)
1. This value must guarantee a minimum of 1 nF value under 11 V bias condition.
10 nF (25 V class) Charge pump
C6 220 nF (5 V class) Internal regulator
Rpu 10 kΩ
AVd d GND
C6
GND
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
INT
(TOP VIEW)
DIRECTIONS OF THE
DETECTABLE
ANGULAR RATES
X
+Ω
Z
+Ω
X
+Ω
Y
Rpu = 10kOhm
Rpu
SCL
SDA
Pull-up to be added on I2C lines
14
GND
SCL_OIS
CS_OIS
SDI/SDO_OIS
ResRes
Res
Reg
C5
Cap
C1C2
C4
C3
HAVdd
HAVdd
VddI2Cbus
Rpu = 10kOhm
Rpu
INT
DRDY
Pull-up to be added on INT and DRDY signals
VddI2Cbus
AM10236V1
L3G4IS Application hints
Doc ID 022612 Rev 1 17/24
Power supply decoupling capacitors (100 pF + 1 µF) should be placed as near as possible
to the device (common design practice). Pull-up resistors must be added to I2C SDA and
SCL lines and to INT and DRDY lines.
Application hints L3G4IS
18/24 Doc ID 022612 Rev 1
6.1 Power supply configurations
The L3G4IS can be powered according to several different configurations, as reported in
Section 3. Depending on the particular power supply provided, either the user interface or
image stabilization modes are activated. The presence of a certain power supply
determines also which digital interface is available. In Figure 4 three possible power supply
configurations are reported to further explain the high level of flexibility allowed by the
component. It should be noted that when AVdd and HAVdd are removed they must be
connected to GND for proper working of the device.
6.1.1 Configuration 1
Figure 4. L3G4IS power supply configuration 1
where:
●AVdd is ON
●HAVdd is ON
●UI and OIS modes enabled
●I2C (SCL/SDA) is supplied by AVdd)
●DRDY/INT are supplied by AVdd
●Vdd_IO_SPI can be connected to any voltage in the range of 1.71 V to HAVdd.
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
INT
Rpu = 10kOhm
Rpu
SCL
SDA
Pull-up to be added on I2C lines14
SCL_OIS
CS_OIS
SDI/SDO_OIS
ResRes
Res
Reg
Cap
HAVdd
AVdd HAVdd
Rpu = 10kOhm
Rpu
INT
DRDY
VddI2Cbus
VddI2Cbus
AM10237v1
L3G4IS Application hints
Doc ID 022612 Rev 1 19/24
6.1.2 Configuration 2
Figure 5. L3G4IS power supply configuration 2
where:
●AVdd is OFF
●HAVdd is ON
●OIS mode enabled
●I2C (SCL/SDA) is not available
●Vdd_IO_SPI has been shorted to HAVdd: SPI is now powered by HAVdd.
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
6.1.3 Configuration 3
Figure 6. L3G4IS power supply configuration 3
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
ResRes
Res
Reg
Cap
HAVdd
HAVddGND
INT
AM10238v1
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
ResRes
Res
Reg
Cap
HAVdd
HAVdd
AVdd
INT
Rpu = 10kOhm
Rpu
SCL
SDA
Pull-up to be added on I2C lines
VddI2Cbus
Rpu = 10kOhm
Rpu
INT
DRDY
Pull-up to be added on INT and DRDY signals
VddI2Cbus
AM10239v1
Application hints L3G4IS
20/24 Doc ID 022612 Rev 1
where:
●AVdd is ON
●HAVdd is ON
●OIS mode enabled
●UI mode enabled
●I2C (SCL/SDA) is available (internally powered at 1.8 ± 10%
●DRDY/INT are available
●Vdd_IO_SPI has been shorted to HAVdd: SPI is now powered by HAVdd.
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
6.1.4 Configuration 4 (case use)
Figure 7. L3G4IS power supply configuration 4 (case use)
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
SCL
DRDY
GND
SDA
AVdd
1
8
12
5
49
1316
TOP
VIEW
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
ResRes
Res
Reg
Cap
HAVdd
HAVdd
AVdd
INT
GYRO
OIS
CONTROLLER
Rpu = 10kOhm
Rpu
HOST
UI
Rpu = 10kOhm
Rpu
VddI2Cbus
VddI2Cbus
AM10240v1
L3G4IS Soldering information
Doc ID 022612 Rev 1 21/24
7 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
Package information L3G4IS
22/24 Doc ID 022612 Rev 1
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 8. LGA-16: mechanical data and package dimensions
Dimensions
Ref. mm inch
Min. Typ. Max. Min. Typ. Max.
A1 1.000 0.0394
A2 0.7850.0309
A30.200 0.0079
d0.300 0.0118
D1 3.850 4.000 4.150 0.1516 0.1575 0.1634
E1 3.850 4.000 4.150 0.1516 0.1575 0.1634
L2 1.950 0.0768
M 0.100 0.0039
N1 0.650 0.0256
N2 0.975 0.0384
P1 1.750 0.0689
P2 1.525 0.0600
T1 0.400 0.0157
T2 0.300 0.0118
k 0.050 0.0020
LGA-16 (4x4x1mm)
Land Grid Array Package
Outline and
8125097_A
mechanical data
L3G4IS Revision history
Doc ID 022612 Rev 1 23/24
9 Revision history
Table 13. Document revision history
Date Revision Changes
22-Dec-2011 1 Initial release.
L3G4IS
24/24 Doc ID 022612 Rev 1
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