TF414
PS No.A2259-3/3
Package Dimensions
unit : mm
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SOT-883 (XDFN3), 1.0x0.6, 0.35P
CASE 506CB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. EXPOSED COPPER ALLOWED AS SHOWN.
A B
E
D
BOTTOM VIEW
b
0.10 C
T OP VIEW
0.10 C
A
A1
0.10 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
DIM MIN MAX
MILLIMETERS
A0.340 0.440
A1 0.000 0.030
b0.075 0.200
D2 0.620 BSC
e0.350 BSC
L0.170 0.300
SOLDER FOOTPRINT*
DIMENSIONS: MILLIMETERS
1.10
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer
to device data sheet for actual part
XX = Specific Device Code
M = Date Code
XX M
L
0.43
RECOMMENDED
D0.950 1.075
E0.550 0.675
E2 0.425 0.550
A
M
0.10 BC
M
0.05 C
e
e/2
2X 3X
D2
E2
2X
0.41
0.55
0.20
EGAKCAPX2
OUTLINE
PIN ONE
REFERENCE
NOTE 3
3X
1